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MT48LC8M16A2TG-7E:GTR

Micron Technology

MT48LC8M16A2TG-7E:GTR by Micron Technology

Micron Technology's MT48LC8M16A2TG-7E:GTR is a 3.3V Synchronous DRAM with 8MX16 organization, offering 8388608 words and 134217728-bit memory density. Operating at a max temperature of 70°C, it features self-refresh mode and four-bank page burst access for commercial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 4,793 parts In-Stock

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4,793

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Vyrian

USA . 4,427 parts In-Stock

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4,427

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Bristol Electronics

USA . 1,922 parts In-Stock

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1,922

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Atlantic Semiconductor

USA . 1,922 parts In-Stock

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1,922

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Digiode

USA . 1,069 parts In-Stock

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1,069

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 47 parts In-Stock

1+ parts

$4.500

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47

$4.500

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Andel Nordic

Denmark . 5,743 parts In-Stock

1+ parts

$6.977

100+ parts

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$6.698

10k+ parts

$6.698

5,743

$6.977

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$6.698

$6.698

AZTECH Wire

Italy . 644 parts In-Stock

1+ parts

$7.246

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644

$7.246

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Component Stockers USA

USA . 387 parts In-Stock

1+ parts

$99.990

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387

$99.990

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Continental Prestige Electronics

USA . 5,882 parts In-Stock

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5,882

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A-Z Elektronik GmbH

Germany . 4,934 parts In-Stock

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4,934

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Argo Parts USA

USA . 1,993 parts In-Stock

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Microchip USA

USA . 473 parts In-Stock

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473

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Corphita

USA . 181 parts In-Stock

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Kepictronics

USA . 96 parts In-Stock

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96

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the MT48LC8M16A2TG-7E:GTR by Micron Technology. As a leading manufacturer in the industry, Micron delivers unparalleled quality and reliability in their DRAM products. This versatile memory module is perfect for a wide range of applications, providing seamless performance and efficiency. Elevate your projects with this innovative solution that offers value, benefits, and advantages that customers can trust. Trust Micron to bring your ideas to life with superior technology and exceptional performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this DRAM product lightweight and durable.

Surface Mount: YES

Being surface mountable, this DRAM is easy to install and saves space on the PCB.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient utilization of space on the PCB.

Operating Mode: SYNCHRONOUS

Operating in synchronous mode ensures high-speed and reliable data transfer.

Self Refresh: YES

The self-refresh capability of this DRAM helps in saving power and prolonging the lifespan of the product.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures compatibility with a wide range of systems.

No. of Terminals: 54

Having 54 terminals enables seamless connectivity and communication with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile package style make this DRAM suitable for compact electronic devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this DRAM can perform reliably in various environmental conditions.

Organization: 8MX16

The organization of 8MX16 ensures efficient data storage and retrieval capabilities.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C allows this DRAM to function even in low-temperature environments.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides excellent conductivity and prevents corrosion.

Terminal Position: DUAL

The dual terminal position allows for easy installation and secure connection.

Maximum Seated Height: 1.2 mm

The maximum seated height of 1.2mm ensures compatibility with various PCB designs.

Width: 10.16 mm

The width of 10.16mm makes this DRAM suitable for applications with space constraints.

Minimum Supply Voltage (Vsup): 3 V

Having a minimum supply voltage of 3V ensures compatibility with a wide range of systems.

Length: 22.22 mm

The length of 22.22mm is appropriate for different PCB layouts.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures stable performance in standard operating environments.

Access Mode: FOUR BANK PAGE BURST

The four bank page burst access mode enhances the speed and efficiency of data access.

Technology: CMOS

Being based on CMOS technology, this DRAM offers low power consumption and high speed.

Terminal Form: GULL WING

The gull-wing terminal form allows for easy soldering and secure attachment to the PCB.

No. of Words: 8388608 words

With a large number of words, this DRAM can store and process a significant amount of data.

Memory Width: 16

The memory width of 16 ensures efficient data transfer and processing capabilities.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch facilitates precise and reliable connections.

No. of Words Code: 8M

The 8M words code indicates the high data storage capacity of this DRAM.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides a safe operating margin for the DRAM.

Memory Density: 134217728 bit

The high memory density of 134217728 bits allows for storing a large amount of data.

Memory IC Type: SYNCHRONOUS DRAM

Being a synchronous DRAM, this product offers fast and efficient data processing capabilities.

Maximum Access Time: 5.4 ns

With a maximum access time of 5.4ns, this DRAM can quickly retrieve data for seamless performance.

Technical Specifications

DRAM MT48LC8M16A2TG-7E:GTR attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e0

Length:

22.22 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

MT48LC8M16A2TG-7E:GTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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