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HY5DU573222FP-33

Sk Hynix

HY5DU573222FP-33 by Sk Hynix

SK Hynix's HY5DU573222FP-33 is a DDR1 DRAM with 8MX32 organization, operating at 300 MHz. It features 144 terminals in a low profile grid array package, suitable for applications requiring high-speed synchronous memory access and common I/O type. With a max clock frequency of 300 MHz and 268435456-bit memory density, it offers fast data processing capabilities for commercial-grade systems.

Median Price

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Lifecycle Status

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5

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1k+

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Vyrian

USA . 934 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 50 parts In-Stock

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Nova Conductors

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Holdelec - ElecDif-Pro

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ACDS - Activité Composants Distribution Service

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AZTECH Wire

Italy . 569 parts In-Stock

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Lixinc

USA . 13,193 parts In-Stock

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Continental Prestige Electronics

USA . 2,696 parts In-Stock

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Argo Parts USA

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Bastille Electronics

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Overview

Experience superior performance and reliability with the HY5DU573222FP-33 by Sk Hynix. As a trusted leader in the industry, Sk Hynix delivers top-notch quality products that excel in the DRAM category. This innovative memory module is perfect for a wide range of applications, providing seamless operation and incredible speed. Say goodbye to slow load times and hello to efficient multitasking with the HY5DU573222FP-33. Trust Sk Hynix to meet all your memory needs, offering unbeatable value and benefits that will take your devices to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and lightweight, enhancing the overall reliability and ease of handling.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and synchronized data transfer, resulting in efficient performance.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a low nominal supply voltage of 2.5V helps in reducing power consumption and heat generation, leading to energy efficiency.

Maximum Clock Frequency (fCLK): 300 MHz

The high maximum clock frequency of 300 MHz indicates fast data processing and transfer speeds, making it suitable for applications requiring high-performance memory.

Memory IC Type: DDR1 DRAM

Being a DDR1 DRAM, this memory module offers a good balance of speed, power efficiency, and cost-effectiveness, making it a reliable choice for various computing tasks.

Technical Specifications

DRAM HY5DU573222FP-33 attributes and parameters. Explore more DRAM devices from Sk Hynix

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

.6 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

300 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

2,4,8

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

12 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

144

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8MX32

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

2.5

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.3 mm

Self Refresh:

YES

Sequential Burst Length:

2,4,8

Maximum Standby Current:

.05 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

700 mA

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Trade Compliance

HY5DU573222FP-33 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.24

SB

8542.32.00.15

Manufacturer Highlights

Sk Hynix

A Solution Provider Leading the Global ICT Ecosystem With our global technology leadership, SK hynix aims to provide greater value to all stakeholders, including our customers, partner companies, investors, local communities, and employees. SK hynix is committed to becoming a solution provider, which leads the global ICT ecosystem through paradigm-shifting hyper collaboration with our global partners. Moreover, we are working to strengthen our ESG management to create even more value, by moving away from the conventional business model of seeking only economic benefits, in search of more social value and a healthier governance structure. SK hynix will rise to become a “Global Top-Tier Technology Company”, which contributes to humanity and society.

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