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MT48LC16M16A2P-6AAAT:G

Micron Technology

MT48LC16M16A2P-6AAAT:G by Micron Technology

MT48LC16M16A2P-6AAAT:G by Micron Technology is a 16MX16 Synchronous DRAM with 268MB memory density. It operates at 3.3V, has a max access time of 5.4ns, and is suitable for industrial applications requiring fast and reliable memory performance.

Median Price

$5.000

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 5 parts In-Stock

1+ parts

$5.000

100+ parts

-

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5

$5.000

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DF Sales Co.

USA . 5 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

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10k+ parts

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5

$5.000

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Vyrian

USA . 8,581 parts In-Stock

1+ parts

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8,581

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Chip Stock

USA . 3,500 parts In-Stock

1+ parts

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3,500

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Digiode

USA . 884 parts In-Stock

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884

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Cyclops Electronics Ltd

UK . 863 parts In-Stock

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863

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J2 Sourcing AB

Sweden . 368 parts In-Stock

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368

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Rebound Electronics

UK . 349 parts In-Stock

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349

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Semi Source

USA . 94 parts In-Stock

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94

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Nova Conductors

Japan . 85 parts In-Stock

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85

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 742 parts In-Stock

1+ parts

$6.750

100+ parts

$6.410

1k+ parts

$6.210

10k+ parts

-

742

$6.750

$6.410

$6.210

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AZTECH Wire

Italy . 665 parts In-Stock

1+ parts

$16.737

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665

$16.737

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RC Electronics

USA . 14,798 parts In-Stock

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14,798

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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A-Z Elektronik GmbH

Germany . 5,264 parts In-Stock

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5,264

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Argo Parts USA

USA . 2,949 parts In-Stock

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2,949

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Futuretech Components

Singapore . 944 parts In-Stock

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944

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Continental Prestige Electronics

USA . 782 parts In-Stock

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782

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Corphita

USA . 696 parts In-Stock

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696

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Perfect Parts

USA . 560 parts In-Stock

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560

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Microchip USA

USA . 247 parts In-Stock

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247

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Experience superior performance with the MT48LC16M16A2P-6AAAT:G by Micron Technology. As a leading manufacturer in the industry, Micron Technology ensures top-quality DRAM products like this one. Ideal for a wide range of applications, this DRAM offers unmatched value and benefits to customers. With its synchronous operation, self-refresh capability, and industrial-grade temperature tolerance, the MT48LC16M16A2P-6AAAT:G provides reliable memory solutions for your needs. Trust Micron Technology for innovative technology that delivers exceptional results every time. Unlock the potential of your devices with this high-performance memory IC type.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection for the DRAM, making it a reliable choice for various applications.

Surface Mount: YES

With surface mount capability, this DRAM can be easily integrated onto circuit boards, allowing for efficient and space-saving designs in electronic devices.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the DRAM meets strict automotive industry standards, making it a dependable choice for automotive applications where reliability is crucial.

Package Shape: RECTANGULAR

The rectangular package shape offers a standardized form factor that is easy to handle and integrate, making it a versatile option for different system designs.

Operating Mode: SYNCHRONOUS

Operating in synchronous mode allows for precise and coordinated data transfer within the DRAM, enhancing performance and efficiency in data processing.

Self Refresh: YES

The self-refresh feature enables the DRAM to automatically maintain data integrity during power interruptions, providing continuous operation and data retention in critical applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V, this DRAM offers a good balance between power consumption and performance, making it suitable for a wide range of electronic devices.

No. of Terminals: 54

With 54 terminals, this DRAM provides ample connectivity options for interfacing with external components, enhancing flexibility and compatibility in system designs.

Technical Specifications

DRAM MT48LC16M16A2P-6AAAT:G attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e3

Length:

22.22 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

MT48LC16M16A2P-6AAAT:G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.24

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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