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S27KS0642GABHB020

Infineon Technologies

S27KS0642GABHB020 by Infineon Technologies

Infineon's S27KS0642GABHB020 DRAM features 8MX8 organization, operates at 200MHz with 1.7-1.8V supply voltage. Suitable for applications requiring high-speed synchronous memory in automotive electronics and industrial control systems.

Median Price

$3.460

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,930 parts In-Stock

1+ parts

-

100+ parts

$3.460

1k+ parts

$3.090

10k+ parts

$2.910

7,930

-

$3.460

$3.090

$2.910

Verical

USA . 7,618 parts In-Stock

1+ parts

-

100+ parts

$4.325

1k+ parts

$3.862

10k+ parts

$3.638

7,618

-

$4.325

$3.862

$3.638

Future Electronics

Canada . 1,352 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.450

10k+ parts

-

1,352

-

-

$3.450

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$4.210

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$4.210

-

-

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Vyrian

USA . 1,495 parts In-Stock

1+ parts

-

100+ parts

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1,495

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-

-

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IBS Electronics

USA . 1,352 parts In-Stock

1+ parts

-

100+ parts

$4.207

1k+ parts

$4.053

10k+ parts

-

1,352

-

$4.207

$4.053

-

Digiode

USA . 862 parts In-Stock

1+ parts

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100+ parts

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862

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 362 parts In-Stock

1+ parts

$3.898

100+ parts

$3.742

1k+ parts

$3.586

10k+ parts

-

362

$3.898

$3.742

$3.586

-

Continental Prestige Electronics

USA . 4,237 parts In-Stock

1+ parts

$4.210

100+ parts

-

1k+ parts

-

10k+ parts

$4.126

4,237

$4.210

-

-

$4.126

Argo Parts USA

USA . 2,008 parts In-Stock

1+ parts

$4.210

100+ parts

-

1k+ parts

-

10k+ parts

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2,008

$4.210

-

-

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AZTECH Wire

Italy . 752 parts In-Stock

1+ parts

$18.406

100+ parts

-

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752

$18.406

-

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Ampacity Inc.

Singapore . 456 parts In-Stock

1+ parts

$22.000

100+ parts

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456

$22.000

-

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Component Stockers USA

USA . 2,151 parts In-Stock

1+ parts

$56.030

100+ parts

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2,151

$56.030

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QUARKTWIN TECHNOLOGY LTD

USA . 19,422 parts In-Stock

1+ parts

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19,422

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$4.126

1k+ parts

$4.000

10k+ parts

$3.915

1,000

-

$4.126

$4.000

$3.915

Corphita

USA . 961 parts In-Stock

1+ parts

-

100+ parts

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961

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Overview

Discover the cutting-edge S27KS0642GABHB020 by Infineon Technologies, a high-quality DRAM that offers unmatched performance and reliability. With a package body material made of plastic/epoxy and a maximum operating temperature of 105°C, this synchronous memory module is ideal for a wide range of applications. Whether you're looking to enhance your gaming experience or boost the speed of your data processing tasks, this Infineon product delivers exceptional value with its common input/output type, self-refresh capability, and 8MX8 organization. Upgrade your system today with the innovative technology of the S27KS0642GABHB020.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the DRAM, ensuring a longer lifespan.

Operating Mode : SYNCHRONOUS

Synchronous operation allows for precise timing and coordination, optimizing performance.

Nominal Supply Voltage / Vsup (V) : 1.8

Low nominal supply voltage of 1.8V helps in reducing power consumption and heat generation.

Maximum Clock Frequency (fCLK) : 200 MHz

High maximum clock frequency of 200 MHz enables fast data transfer and processing.

Technology : CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing efficiency.

Technical Specifications

DRAM S27KS0642GABHB020 attributes and parameters. Explore more DRAM devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

200 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

24

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Self Refresh:

YES

Maximum Standby Current:

.00033 Amp

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

S27KS0642GABHB020 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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