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S27KL0642DPBHI020

Infineon Technologies

S27KL0642DPBHI020 by Infineon Technologies

S27KL0642DPBHI020 by Infineon Technologies is an 8MX8 DRAM with a memory density of 67108864 bit. Operating at up to 200 MHz, it features synchronous mode and self-refresh capability. This HYPERRAM is suitable for applications requiring high-speed data storage in compact electronic devices.

Median Price

$2.895

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 375 parts In-Stock

1+ parts

$2.840

100+ parts

$2.620

1k+ parts

$2.320

10k+ parts

-

375

$2.840

$2.620

$2.320

-

RS (Exports)

UK . 115 parts In-Stock

1+ parts

$2.840

100+ parts

$2.110

1k+ parts

-

10k+ parts

-

115

$2.840

$2.110

-

-

Chip1Stop

Japan . 185 parts In-Stock

1+ parts

$2.950

100+ parts

$2.170

1k+ parts

$2.140

10k+ parts

$2.040

185

$2.950

$2.170

$2.140

$2.040

Farnell

UK . 338 parts In-Stock

1+ parts

$3.060

100+ parts

$2.270

1k+ parts

$2.110

10k+ parts

-

338

$3.060

$2.270

$2.110

-

Mouser Electronics

USA . 332 parts In-Stock

1+ parts

$4.090

100+ parts

$3.530

1k+ parts

$3.290

10k+ parts

$3.240

332

$4.090

$3.530

$3.290

$3.240

DigiKey

USA . 2,652 parts In-Stock

1+ parts

$4.480

100+ parts

$3.868

1k+ parts

$3.613

10k+ parts

$3.560

2,652

$4.480

$3.868

$3.613

$3.560

Element14

Singapore . 138 parts In-Stock

1+ parts

$7.070

100+ parts

$6.110

1k+ parts

$5.610

10k+ parts

-

138

$7.070

$6.110

$5.610

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Flip Electronics (Authorized)

USA . 5,940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,940

-

-

-

-

Rochester

USA . 1,320 parts In-Stock

1+ parts

-

100+ parts

$2.130

1k+ parts

$1.900

10k+ parts

$1.790

1,320

-

$2.130

$1.900

$1.790

Verical

USA . 1,201 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.375

10k+ parts

$2.237

1,201

-

-

$2.375

$2.237

Future Electronics

Canada . 290 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.140

10k+ parts

-

290

-

-

$2.140

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 756 parts In-Stock

1+ parts

$2.252

100+ parts

-

1k+ parts

-

10k+ parts

-

756

$2.252

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$3.695

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$3.695

-

-

-

Flip Electronics

USA . 1,171 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,171

-

-

-

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Vyrian

USA . 807 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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807

-

-

-

-

IBS Electronics

USA . 290 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.782

10k+ parts

-

290

-

-

$2.782

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,164 parts In-Stock

1+ parts

$2.010

100+ parts

-

1k+ parts

-

10k+ parts

-

1,164

$2.010

-

-

-

Semicontronic

India . 1,107 parts In-Stock

1+ parts

$2.010

100+ parts

$1.960

1k+ parts

$1.950

10k+ parts

-

1,107

$2.010

$1.960

$1.950

-

Corphita

USA . 965 parts In-Stock

1+ parts

$2.133

100+ parts

-

1k+ parts

-

10k+ parts

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965

$2.133

-

-

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Corohmni

South Africa . 974 parts In-Stock

1+ parts

$2.550

100+ parts

-

1k+ parts

-

10k+ parts

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974

$2.550

-

-

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Modulus Dynamics

Lithuania . 1,899 parts In-Stock

1+ parts

$3.562

100+ parts

$3.420

1k+ parts

$3.277

10k+ parts

-

1,899

$3.562

$3.420

$3.277

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$3.621

100+ parts

-

1k+ parts

$3.477

10k+ parts

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50

$3.621

-

$3.477

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Argo Parts USA

USA . 4,954 parts In-Stock

1+ parts

$3.695

100+ parts

-

1k+ parts

-

10k+ parts

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4,954

$3.695

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-

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Continental Prestige Electronics

USA . 2,145 parts In-Stock

1+ parts

$3.695

100+ parts

-

1k+ parts

-

10k+ parts

$3.621

2,145

$3.695

-

-

$3.621

Aztec Data Supply Inc.

USA . 4,383 parts In-Stock

1+ parts

$3.786

100+ parts

-

1k+ parts

-

10k+ parts

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4,383

$3.786

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-

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Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$4.072

100+ parts

$3.746

1k+ parts

$3.510

10k+ parts

-

70

$4.072

$3.746

$3.510

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QUARKTWIN TECHNOLOGY LTD

USA . 7,539 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,539

-

-

-

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Overview

Experience the seamless performance and reliability with the S27KL0642DPBHI020 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality products that excel in various applications. The S27KL0642DPBHI020 is a game-changer in the DRAM category, offering unparalleled value to customers seeking high-speed memory solutions. Whether you're in need of fast data processing or smooth multitasking capabilities, this product provides the ultimate benefits and advantages you're looking for. Trust Infineon Technologies to elevate your technology experience with the S27KL0642DPBHI020.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the product, making it a reliable choice.

Surface Mount: YES

Allows for easy installation and space-saving design, ideal for compact applications.

Package Shape: RECTANGULAR

This shape offers efficient use of space and compatibility with standard hardware configurations.

Operating Mode: SYNCHRONOUS

Ensures precise timing and coordination, enhancing overall performance and reliability.

Self Refresh: YES

Offers power-saving capabilities, extending battery life and reducing energy consumption.

Nominal Supply Voltage / Vsup (V): 3

Provides compatibility with various systems and ensures stable operation.

No. of Terminals: 24

Sufficient number of terminals for connectivity and communication in complex systems.

Maximum Operating Temperature: 85 °C

Allows for reliable operation in varying environmental conditions.

Organization: 8MX8

Provides a high memory organization for efficient data storage and retrieval.

Output Characteristics: 3-STATE

Offers flexibility in data output, enabling compatibility with multiple devices.

Minimum Operating Temperature: -40 °C

Ensures functionality in extreme temperatures, making it suitable for harsh environments.

Terminal Position: BOTTOM

Simplifies installation and maintenance processes, enhancing user convenience.

Maximum Seated Height: 1 mm

Low profile design for space-constrained applications.

Maximum Clock Frequency (fCLK): 200 MHz

High clock frequency for fast data processing and operations.

Technology: CMOS

Efficient and reliable technology for advanced memory operations and performance.

Terminal Form: BALL

Secure terminal form for stable connections and efficient data transfer.

Memory IC Type: HYPERRAM

Specialized memory IC for enhanced performance and capabilities.

Maximum Standby Current: 0.00025 Amp

Low standby current for energy efficiency and extended battery life.

Technical Specifications

DRAM S27KL0642DPBHI020 attributes and parameters. Explore more DRAM devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

200 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

24

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Self Refresh:

YES

Maximum Standby Current:

.00025 Amp

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

S27KL0642DPBHI020 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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