Loading...

W66CP2NQUAHJ

Winbond Electronics

W66CP2NQUAHJ by Winbond Electronics

Winbond Electronics LPDDR4 DRAM W66CP2NQUAHJ features 128MX32 organization, operates at up to 2136.7 MHz clock frequency, and has a memory density of 4294967296 bit. Ideal for applications requiring high-speed synchronous operation in compact devices with limited space constraints.

Median Price

$7.560

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$7.560

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$7.560

-

-

-

Vyrian

USA . 5,295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,295

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,872 parts In-Stock

1+ parts

$7.560

100+ parts

-

1k+ parts

-

10k+ parts

$7.409

6,872

$7.560

-

-

$7.409

AZTECH Wire

Italy . 708 parts In-Stock

1+ parts

$15.130

100+ parts

-

1k+ parts

-

10k+ parts

-

708

$15.130

-

-

-

Argo Parts USA

USA . 4,558 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,558

-

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$7.409

1k+ parts

$7.182

10k+ parts

$7.031

50

-

$7.409

$7.182

$7.031

Overview

Unlock the power of cutting-edge technology with the W66CP2NQUAHJ by Winbond Electronics. This LPDDR4 DRAM offers unparalleled performance and reliability, perfect for a wide range of applications. With a sleek package style and maximum clock frequency of 2136.7 MHz, this memory module is designed to enhance your devices' speed and efficiency. Trust in Winbond Electronics, a leading manufacturer known for their top-quality products. Upgrade your system today and experience the difference with the W66CP2NQUAHJ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring product longevity and affordability.

Surface Mount: YES

Easily mounted on circuit boards, making installation and integration into devices straightforward.

Operating Mode: SYNCHRONOUS

Ensures precise timing and coordination of data transfers, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 1.1

Efficient power consumption at a moderate voltage, contributing to energy savings.

Maximum Clock Frequency (fCLK): 2136.7 MHz

High clock frequency allows for fast data processing, ideal for demanding applications.

Memory IC Type: LPDDR4 DRAM

LPDDR4 technology provides high-speed and low-power performance, suitable for mobile devices and other applications requiring efficiency.

Technical Specifications

DRAM W66CP2NQUAHJ attributes and parameters. Explore more DRAM devices from Winbond Electronics

Specs

Access Mode:

MULTI BANK PAGE BURST

Additional Features:

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY; TERM PITCH-MAX

Maximum Clock Frequency (fCLK):

2136.7 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

16,32

JESD-30 Code:

R-PBGA-B200

Length:

14.5 mm

Memory Density:

4294967296 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

200

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX32

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA200,12X22,32/25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.8 mm

Self Refresh:

YES

Sequential Burst Length:

16,32

Maximum Supply Voltage (Vsup):

1.17 V

Minimum Supply Voltage (Vsup):

1.06 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Trade Compliance

W66CP2NQUAHJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 2