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W66CP2NQUAGJ

Winbond Electronics

W66CP2NQUAGJ by Winbond Electronics

Winbond Electronics LPDDR4 DRAM W66CP2NQUAGJ features 128MX32 organization, operates at up to 1869.1 MHz clock frequency, and has a memory density of 4294967296 bit. Ideal for applications requiring high-speed synchronous operation in compact devices like smartphones and tablets.

Median Price

$7.526

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 56 parts In-Stock

1+ parts

$7.526

100+ parts

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56

$7.526

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Vyrian

USA . 6,812 parts In-Stock

1+ parts

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6,812

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 100 parts In-Stock

1+ parts

$7.376

100+ parts

-

1k+ parts

$7.081

10k+ parts

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100

$7.376

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$7.081

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Continental Prestige Electronics

USA . 2,903 parts In-Stock

1+ parts

$7.526

100+ parts

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$7.376

2,903

$7.526

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$7.376

AZTECH Wire

Italy . 851 parts In-Stock

1+ parts

$18.989

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851

$18.989

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Argo Parts USA

USA . 3,152 parts In-Stock

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3,152

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Overview

Elevate your tech game with the cutting-edge W66CP2NQUAGJ by Winbond Electronics. This LPDDR4 DRAM boasts top-notch quality, courtesy of a trusted manufacturer, and offers unparalleled performance for a wide range of applications. From lightning-fast data processing to seamless multitasking, this memory module delivers exceptional value, benefits, and advantages that cater to all your computing needs. Upgrade to Winbond Electronics and experience the difference in speed, efficiency, and reliability today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the DRAM, making it reliable for various applications.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise coordination and timing, improving performance and efficiency of the DRAM.

Nominal Supply Voltage / Vsup (V): 1.1

The nominal supply voltage of 1.1V ensures energy efficiency while providing stable power to the DRAM.

Maximum Clock Frequency (fCLK): 1869.1 MHz

With a high maximum clock frequency, this DRAM can handle demanding tasks and operate at high speeds.

Technology: CMOS

The use of CMOS technology results in low power consumption and high noise immunity, making the DRAM energy-efficient and reliable.

Memory IC Type: LPDDR4 DRAM

LPDDR4 DRAM is known for its high performance, low power consumption, and high bandwidth capabilities, making it a top choice for mobile devices and other applications.

Technical Specifications

DRAM W66CP2NQUAGJ attributes and parameters. Explore more DRAM devices from Winbond Electronics

Specs

Access Mode:

MULTI BANK PAGE BURST

Additional Features:

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY; TERM PITCH-MAX

Maximum Clock Frequency (fCLK):

1869.1 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

16,32

JESD-30 Code:

R-PBGA-B200

Length:

14.5 mm

Memory Density:

4294967296 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

200

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX32

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA200,12X22,32/25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.8 mm

Self Refresh:

YES

Sequential Burst Length:

16,32

Maximum Supply Voltage (Vsup):

1.17 V

Minimum Supply Voltage (Vsup):

1.06 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Trade Compliance

W66CP2NQUAGJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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