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W631GU6NB11I

Winbond Electronics

W631GU6NB11I by Winbond Electronics

Winbond Electronics' W631GU6NB11I is a DDR3L DRAM with 64MX16 organization, operating at up to 933 MHz. Featuring synchronous mode and self-refresh capability, it has a memory density of 1073741824 bit. Ideal for industrial applications requiring high-speed data processing in compact devices.

Median Price

$4.025

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 245 parts In-Stock

1+ parts

$3.850

100+ parts

-

1k+ parts

$2.690

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245

$3.850

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$2.690

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DigiKey

USA . 18 parts In-Stock

1+ parts

$4.200

100+ parts

$3.709

1k+ parts

$3.035

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18

$4.200

$3.709

$3.035

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ozdisan Elektronik

Türkiye . 594 parts In-Stock

1+ parts

$1.896

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594

$1.896

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TECHDesign

Taiwan . 6,299 parts In-Stock

1+ parts

$3.520

100+ parts

$3.310

1k+ parts

$3.060

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6,299

$3.520

$3.310

$3.060

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$3.524

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15

$3.524

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Bristol Electronics

USA . 5,396 parts In-Stock

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5,396

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Atlantic Semiconductor

USA . 5,396 parts In-Stock

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Vyrian

USA . 132 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,523 parts In-Stock

1+ parts

$2.190

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-

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3,523

$2.190

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Corohmni

South Africa . 251 parts In-Stock

1+ parts

$3.287

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251

$3.287

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$3.453

100+ parts

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1k+ parts

$3.315

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100

$3.453

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$3.315

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Continental Prestige Electronics

USA . 6,333 parts In-Stock

1+ parts

$3.524

100+ parts

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$3.453

6,333

$3.524

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$3.453

Argo Parts USA

USA . 23 parts In-Stock

1+ parts

$3.524

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23

$3.524

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$3.594

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$3.594

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$3.594

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20

$3.594

$3.594

$3.594

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AZTECH Wire

Italy . 835 parts In-Stock

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$5.724

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835

$5.724

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Infinite Electronics LLP (Excess)

. 12,368 parts In-Stock

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12,368

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Formix International (Excess)

India . 80 parts In-Stock

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80

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Overview

Experience superior performance and reliability with the W631GU6NB11I by Winbond Electronics, a leading manufacturer in the industry. This DDR3L DRAM module offers exceptional value, providing seamless operation in a variety of applications. With a high-speed clock frequency of 933 MHz and a wide temperature range, this memory module guarantees optimal performance even in challenging conditions. Trust Winbond Electronics for cutting-edge technology and unlock the full potential of your devices with the W631GU6NB11I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the DRAM chip, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort during the assembly process.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate and synchronized data transfer, reducing the risk of errors in data processing.

Nominal Supply Voltage / Vsup (V): 1.35

Low nominal supply voltage of 1.35V helps in reducing power consumption and heat generation, contributing to energy efficiency.

Maximum Clock Frequency (fCLK): 933 MHz

High maximum clock frequency of 933 MHz enables fast data processing and seamless multitasking capability for improved performance.

Technology: CMOS

CMOS technology offers low power consumption and enhanced noise immunity, making the DRAM chip reliable and efficient in various applications.

Memory IC Type: DDR3L DRAM

DDR3L DRAM type ensures high-speed data transfer, low power consumption, and compatibility with a wide range of devices, making it a versatile choice for memory solutions.

Technical Specifications

DRAM W631GU6NB11I attributes and parameters. Explore more DRAM devices from Winbond Electronics

Specs

Access Mode:

MULTI BANK PAGE BURST

Maximum Access Time:

20 ns

Maximum Clock Frequency (fCLK):

933 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

8

JESD-30 Code:

R-PBGA-B96

Length:

13 mm

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

96

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,9X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

1 mm

Self Refresh:

YES

Sequential Burst Length:

8

Maximum Standby Current:

.055 Amp

Maximum Supply Current:

240 mA

Maximum Supply Voltage (Vsup):

1.45 V

Minimum Supply Voltage (Vsup):

1.283 V

Nominal Supply Voltage / Vsup (V):

1.35

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

7.5 mm

Trade Compliance

W631GU6NB11I Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.32

SB

8542.32.00.15

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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