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MT48LC2M32B2P-6AIT:J

Micron Technology

MT48LC2M32B2P-6AIT:J by Micron Technology

Micron Technology's MT48LC2M32B2P-6AIT:J is a 2MX32 Synchronous DRAM with 67108864-bit memory density. It operates at 166 MHz clock frequency, suitable for industrial applications. With a low standby current of 0.0025 Amp and common I/O type, it offers fast access time of 5.4 ns.

Median Price

$6.614

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 1,585 parts In-Stock

1+ parts

$6.614

100+ parts

-

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1,585

$6.614

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Arrow

USA . 1,585 parts In-Stock

1+ parts

$6.614

100+ parts

-

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1,585

$6.614

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DigiKey

USA . 704 parts In-Stock

1+ parts

-

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$6.500

10k+ parts

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704

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$6.500

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 579 parts In-Stock

1+ parts

$6.283

100+ parts

-

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579

$6.283

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$6.415

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200

$6.415

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Cyclops Electronics Ltd

UK . 37,157 parts In-Stock

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Chip Stock

USA . 23,500 parts In-Stock

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23,500

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Vyrian

USA . 4,249 parts In-Stock

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4,249

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Dynamic Solutions

Germany . 4,000 parts In-Stock

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4,000

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Mil-Aero Solutions, Inc.

USA . 1,796 parts In-Stock

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1,796

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Cogito LLC

Ukraine . 1,000 parts In-Stock

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1,000

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J2 Sourcing AB

Sweden . 624 parts In-Stock

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624

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Bristol Electronics

USA . 548 parts In-Stock

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548

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Sensible Micro Corp

USA . 195 parts In-Stock

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195

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Technoshack Inc.

Canada . 140 parts In-Stock

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140

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ACDS - Activité Composants Distribution Service

France . 64 parts In-Stock

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64

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Holdelec - ElecDif-Pro

France . 64 parts In-Stock

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64

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Semi Source

USA . 36 parts In-Stock

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36

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Connect4Technologies Inc.

Canada . 16 parts In-Stock

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16

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ComSIT Distribution GmbH

Germany . 10 parts In-Stock

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10

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NAC Semi

USA . 8 parts In-Stock

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8

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Classic Components Corporation

USA . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,274 parts In-Stock

1+ parts

$3.805

100+ parts

-

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2,274

$3.805

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Andel Nordic

Denmark . 2,818 parts In-Stock

1+ parts

$4.498

100+ parts

-

1k+ parts

$4.318

10k+ parts

$4.318

2,818

$4.498

-

$4.318

$4.318

Aztec Data Supply Inc.

USA . 2,216 parts In-Stock

1+ parts

$4.550

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2,216

$4.550

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Semicontronic

India . 3,117 parts In-Stock

1+ parts

$5.520

100+ parts

$5.382

1k+ parts

$5.354

10k+ parts

-

3,117

$5.520

$5.382

$5.354

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Ampacity Inc.

Singapore . 1,023 parts In-Stock

1+ parts

$5.520

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1,023

$5.520

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Corphita

USA . 2,015 parts In-Stock

1+ parts

$5.952

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2,015

$5.952

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$6.287

100+ parts

-

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$6.035

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100

$6.287

-

$6.035

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Continental Prestige Electronics

USA . 3,486 parts In-Stock

1+ parts

$6.415

100+ parts

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$6.287

3,486

$6.415

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$6.287

Component Stockers USA

USA . 137 parts In-Stock

1+ parts

$13.210

100+ parts

$12.550

1k+ parts

$12.160

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137

$13.210

$12.550

$12.160

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Perfect Parts

USA . 46,759 parts In-Stock

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46,759

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A-Z Elektronik GmbH

Germany . 9,922 parts In-Stock

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9,922

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RC Electronics

USA . 7,681 parts In-Stock

1+ parts

-

100+ parts

$6.740

1k+ parts

$6.350

10k+ parts

$6.220

7,681

-

$6.740

$6.350

$6.220

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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Futuretech Components

Singapore . 2,500 parts In-Stock

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2,500

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GreenTree Electronics

Israel . 947 parts In-Stock

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947

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S.R.D Solutions

India . 200 parts In-Stock

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200

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ChipstoGo Electronic ltd

UK . 75 parts In-Stock

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75

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Argo Parts USA

USA . 62 parts In-Stock

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62

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Speed Components Ltd (Excess)

Israel . 18 parts In-Stock

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iodParts Technologies Inc.

India . 3 parts In-Stock

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Computer Components Inc. - USA

USA . 3 parts In-Stock

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3

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Overview

Unlock the power of cutting-edge technology with the MT48LC2M32B2P-6AIT:J by Micron Technology. As a leading manufacturer in the industry, Micron Technology delivers high-quality DRAM products that exceed expectations. Perfect for a wide range of applications, this versatile memory module offers seamless performance and reliability. Say goodbye to slow loading times and hello to efficiency with the MT48LC2M32B2P-6AIT:J. Discover the value and benefits it brings to your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and lightweight, making the DRAM chip easy to handle and transport.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures data is transmitted and processed efficiently, resulting in faster performance.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage of 3.3V, making it compatible with a wide range of systems and devices.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

Small outline and thin profile design save space on the PCB, allowing for compact and efficient memory layout.

Maximum Clock Frequency (fCLK): 166 MHz

High maximum clock frequency allows for quick data transfer and processing speeds, ideal for demanding applications.

Memory IC Type: SYNCHRONOUS DRAM

Being synchronous DRAM, it offers faster data transfer rates compared to asynchronous DRAM, making it suitable for high-performance computing.

Technical Specifications

DRAM MT48LC2M32B2P-6AIT:J attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

166 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

1,2,4,8

JESD-30 Code:

R-PDSO-G86

JESD-609 Code:

e3

Length:

22.22 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

86

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX32

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP86,.46,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

1,2,4,8,FP

Maximum Standby Current:

.0025 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

180 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

MT48LC2M32B2P-6AIT:J Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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