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IS42S16320D-7TL

Integrated Silicon Solution

IS42S16320D-7TL by Integrated Silicon Solution

IS42S16320D-7TL by Integrated Silicon Solution is a 32MX16 Synchronous DRAM with 3.3V supply, operating at up to 143MHz clock frequency. It features self-refresh and common I/O type, suitable for applications requiring fast memory access in commercial temperature environments.

Median Price

$14.540

Lifecycle Status

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15

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Mouser Electronics

USA . 702 parts In-Stock

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$14.470

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$13.050

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$10.920

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DigiKey

USA . 606 parts In-Stock

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$14.540

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$13.114

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$10.189

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Chip1Stop

Japan . 15 parts In-Stock

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$209.050

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Avnet

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Freelance Electronics

USA . 6 parts In-Stock

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$8.199

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$8.609

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$8.117

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Nova Conductors

Japan . 29 parts In-Stock

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$10.352

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Flip Electronics

USA . 1,080 parts In-Stock

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$12.682

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Chip Stock

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Sensible Micro Corp

USA . 4,752 parts In-Stock

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$8.512

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$7.910

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NAC Semi

USA . 639 parts In-Stock

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Vyrian

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Prism Electronics

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Inventory MP

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Bristol Electronics

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PC Components Company LLC

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Distributors (Availability)

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Corohmni

South Africa . 269 parts In-Stock

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$3.971

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Aztec Data Supply Inc.

USA . 2,372 parts In-Stock

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$4.040

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Advanced Electronics

New Zealand . 10 parts In-Stock

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$4.163

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$3.788

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$3.414

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Netroflash

USA . 500 parts In-Stock

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$10.352

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$9.835

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$9.628

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$9.628

Perfect Parts

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S.R.D Solutions

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Argo Parts USA

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Lixinc

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Eastek

USA . 1,735 parts In-Stock

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Continental Prestige Electronics

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Kepictronics

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Overview

Unlock the next level of performance with the IS42S16320D-7TL by Integrated Silicon Solution. As a leading manufacturer in the industry, ISS delivers top-quality DRAM products that are essential for various applications. Whether you're upgrading your system or designing cutting-edge technology, this synchronous DRAM offers unparalleled speed and reliability. Say goodbye to lagging and hello to seamless operations with the IS42S16320D-7TL. Elevate your projects with ISS and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making it a reliable choice for long-term use.

Surface Mount: YES

This feature allows for easy installation on circuit boards, making it convenient for manufacturers to integrate into their designs.

Package Shape: RECTANGULAR

The rectangular shape of the package offers a compact and space-saving design, ideal for devices with limited space.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures precise timing and performance, making it suitable for high-speed applications.

Self Refresh: YES

The self-refresh capability helps conserve power and maintain data integrity during idle periods, enhancing energy efficiency.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage provides stable power delivery for consistent performance, ensuring reliable operation.

Power Supplies (V): 3.3

The 3.3V power supply requirement is common and widely available, making it easy to find compatible power sources.

No. of Terminals: 54

With 54 terminals, this DRAM module offers versatile connectivity options and flexibility for various system configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile design save space and allow for denser memory configurations in tight layouts.

Maximum Operating Temperature: 70 °C

The high operating temperature range of 70°C ensures stable performance in diverse environments, suitable for industrial applications.

Organization: 32MX16

The 32MX16 organization provides a high memory capacity of 33554432 words, ideal for data-intensive tasks and large-scale applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics offer flexibility in controlling data flow, allowing for efficient data transmission and processing.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this DRAM module can function reliably in cold environments without compromising performance.

Terminal Position: DUAL

The dual terminal position enhances stability and ensures secure connections, reducing the risk of signal interference or disconnections.

Maximum Seated Height: 1.2 mm

The low seated height of 1.2mm minimizes space requirements and enables compact designs in slim electronic devices.

Maximum Clock Frequency (fCLK): 143 MHz

The high maximum clock frequency of 143MHz supports fast data processing and transfer speeds, suitable for demanding applications.

Width: 10.16 mm

With a width of 10.16mm, this DRAM module can fit into narrow spaces and compact systems, offering versatility in design options.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage requirement of 3V ensures compatibility with a wide range of power sources, enhancing usability.

Length: 22.22 mm

The length of 22.22mm provides a balance between compactness and functionality, suitable for a variety of devices and applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance in standard operating conditions, making it suitable for everyday use.

Access Mode: FOUR BANK PAGE BURST

The four bank page burst access mode enhances memory access efficiency and data processing speeds, optimizing system performance.

Technology: CMOS

The CMOS technology offers low power consumption, high speed, and reliable performance, making it an efficient choice for various applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and stability during assembly, ensuring proper functionality and long-term reliability.

Maximum Supply Current: 220 mA

The maximum supply current of 220mA ensures stable power delivery for consistent and reliable performance, suitable for various operating conditions.

No. of Words: 33554432 words

With a high number of words, this DRAM module offers ample memory capacity for storing and processing large volumes of data, ideal for complex applications.

Sequential Burst Length: 1,2,4,8,FP

The sequential burst length options provide flexibility in data transfer modes, enhancing efficiency and accommodating different data processing needs.

Memory Width: 16

With a memory width of 16 bits, this DRAM module can handle data in larger chunks, improving data processing speed and efficiency.

Terminal Pitch: 0.8 mm

The tight terminal pitch of 0.8mm allows for high-density packaging and compact designs, suitable for space-constrained applications.

No. of Words Code: 32M

The 32M word code designation indicates a high memory capacity, providing ample storage space for diverse data processing requirements.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V ensures safe operation and protection against voltage spikes, enhancing the reliability of the DRAM module.

Memory Density: 536870912 bit

With a high memory density of 536870912 bits, this DRAM module offers ample storage capacity for handling large datasets and complex computations.

Memory IC Type: SYNCHRONOUS DRAM

The synchronous DRAM type provides fast data access and processing speeds, suitable for high-performance computing and data-intensive applications.

Maximum Standby Current: 0.004 Amp

The low maximum standby current of 0.004A minimizes power consumption during idle periods, enhancing energy efficiency and prolonging battery life.

Refresh Cycles: 8192

The 8192 refresh cycles ensure data integrity and reliability over extended periods of use, maintaining optimal performance and preventing data loss.

Interleaved Burst Length: 1,2,4,8

The interleaved burst length options offer flexibility in data transfer modes, optimizing memory access efficiency and improving overall system performance.

Maximum Access Time: 5.4 ns

The low maximum access time of 5.4ns ensures fast data retrieval and processing speeds, making this DRAM module suitable for high-speed applications.

Technical Specifications

DRAM IS42S16320D-7TL attributes and parameters. Explore more DRAM devices from Integrated Silicon Solution

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

143 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

1,2,4,8

JESD-30 Code:

R-PDSO-G54

Length:

22.22 mm

Memory Density:

536870912 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP54,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

1,2,4,8,FP

Maximum Standby Current:

.004 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

220 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

IS42S16320D-7TL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.28

SB

8542.32.00.15

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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