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MT48LC16M16A2P-75:DTR

Micron Technology

MT48LC16M16A2P-75:DTR by Micron Technology

MT48LC16M16A2P-75:DTR by Micron Technology is a 16MX16 Synchronous DRAM with 16777216 words, 268435456 bit memory density, and 5.4 ns max access time. It operates at 3.3V and is ideal for commercial applications requiring fast and reliable memory performance in a small outline package.

Median Price

$2.234

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 510 parts In-Stock

1+ parts

$2.374

100+ parts

-

1k+ parts

-

10k+ parts

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510

$2.374

-

-

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Vyrian

USA . 5,597 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,597

-

-

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Chip Stock

USA . 4,205 parts In-Stock

1+ parts

-

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10k+ parts

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4,205

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-

-

-

Sensible Micro Corp

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$2.093

1k+ parts

$1.873

10k+ parts

-

2,000

-

$2.093

$1.873

-

Digiode

USA . 624 parts In-Stock

1+ parts

-

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624

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,445 parts In-Stock

1+ parts

$4.450

100+ parts

-

1k+ parts

-

10k+ parts

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1,445

$4.450

-

-

-

Corohmni

South Africa . 141 parts In-Stock

1+ parts

$5.300

100+ parts

-

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141

$5.300

-

-

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AZTECH Wire

Italy . 502 parts In-Stock

1+ parts

$5.315

100+ parts

-

1k+ parts

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10k+ parts

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502

$5.315

-

-

-

Ampacity Inc.

Singapore . 903 parts In-Stock

1+ parts

$29.000

100+ parts

-

1k+ parts

-

10k+ parts

-

903

$29.000

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 27,845 parts In-Stock

1+ parts

-

100+ parts

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27,845

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Microchip USA

USA . 4,380 parts In-Stock

1+ parts

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4,380

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Continental Prestige Electronics

USA . 3,033 parts In-Stock

1+ parts

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100+ parts

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3,033

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Argo Parts USA

USA . 718 parts In-Stock

1+ parts

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718

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Corphita

USA . 514 parts In-Stock

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514

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Bastille Electronics

Australia . 93 parts In-Stock

1+ parts

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93

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Speed Components Ltd (Excess)

Israel . 85 parts In-Stock

1+ parts

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100+ parts

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85

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Overview

Upgrade your devices with the MT48LC16M16A2P-75:DTR by Micron Technology, a leading manufacturer in the industry. This high-quality DRAM offers unrivaled performance and reliability for a wide range of applications. With its synchronous operation, self-refresh capabilities, and compact design, this memory module provides seamless functionality and efficiency. Experience faster data access and smoother multitasking with the MT48LC16M16A2P-75:DTR, delivering exceptional value and benefits to all customers seeking top-notch memory solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the DRAM, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation of the DRAM onto circuit boards, saving time and effort in the assembly process.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise and efficient data transfer within the DRAM, increasing overall performance and reliability of the product.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage offers a balance between power consumption and performance, making the DRAM energy-efficient and suitable for a wide range of applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this DRAM can withstand higher temperatures and maintain stable performance in challenging environments.

Technology: CMOS

The CMOS technology used in this DRAM helps in reducing power consumption and improving overall speed and efficiency, making it a reliable choice for various electronic devices.

Memory IC Type: SYNCHRONOUS DRAM

The synchronous DRAM design ensures synchronous data transfer and improved overall performance, making it ideal for applications that require high-speed data processing.

Technical Specifications

DRAM MT48LC16M16A2P-75:DTR attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e3

Length:

22.22 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

16MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

MT48LC16M16A2P-75:DTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.24

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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