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K4S281632O-LI75T

Samsung

K4S281632O-LI75T by Samsung

Samsung's K4S281632O-LI75T is an 8MX16 DRAM with 3.3V supply, operating from -40 to 85°C. Featuring a max clock frequency of 133 MHz, it offers a memory density of 134217728 bits suitable for industrial applications requiring high-speed data processing.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 1,067 parts In-Stock

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Nova Conductors

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Aztec Data Supply Inc.

USA . 3,146 parts In-Stock

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$4.200

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Corohmni

South Africa . 144 parts In-Stock

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AZTECH Wire

Italy . 462 parts In-Stock

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Ampacity Inc.

Singapore . 1,054 parts In-Stock

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Argo Parts USA

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Aranea Global

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Continental Prestige Electronics

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Overview

Elevate your electronic devices to the next level with Samsung's cutting-edge K4S281632O-LI75T DRAM memory chip. Designed with precision and quality in mind, this memory module offers unparalleled performance and reliability for a wide range of applications. From gaming consoles to industrial machinery, this versatile component ensures seamless operation and lightning-fast data processing. Trust Samsung's expertise in memory technology to enhance the efficiency and functionality of your devices. Upgrade to Samsung's K4S281632O-LI75T and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product budget-friendly and easy to handle.

Surface Mount: YES

The surface mount feature allows for easy installation and saves space on the PCB.

Package Shape: RECTANGULAR

The rectangular shape ensures efficient use of space on the circuit board.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is common in many electronic devices, making this product compatible with a wide range of systems.

Power Supplies (V): 3.3

The 3.3V power supply ensures reliable and stable performance of the DRAM.

No. of Terminals: 54

With 54 terminals, this DRAM can handle complex data processing tasks efficiently.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile design save space on the PCB, making it suitable for compact devices.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures reliable performance in various environments.

Organization: 8MX16

The 8MX16 organization provides a high memory capacity, suitable for demanding applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for efficient data transmission and processing.

Minimum Operating Temperature: -40 °C

The low operating temperature range ensures the DRAM can function in extreme conditions.

Terminal Position: DUAL

The dual terminal position provides stability and reliability in data transfer.

Maximum Clock Frequency (fCLK): 133 MHz

The high clock frequency allows for fast data processing, ideal for high-performance applications.

Peak Reflow Temperature °C: 260

The peak reflow temperature ensures the DRAM can withstand the soldering process during manufacturing.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes the DRAM suitable for harsh industrial environments.

Technology: CMOS

The CMOS technology ensures low power consumption and high performance.

Terminal Form: GULL WING

The gull-wing terminal form provides easy soldering and reliable connections.

Maximum Supply Current: 100 mA

The low maximum supply current helps in reducing power consumption.

No. of Words: 8388608 words

With a high number of words, the DRAM can store a large amount of data.

Sequential Burst Length: 1,2,4,8,FP

The sequential burst length options offer flexibility in data transfer modes.

Memory Width: 16

The 16-bit memory width allows for efficient data processing.

Terminal Pitch: 0.8 mm

The small terminal pitch saves space on the PCB.

No. of Words Code: 8M

The 8M words code indicates a high memory capacity.

Memory Density: 134217728 bit

The memory density of 134217728 bits provides ample storage capacity.

Memory IC Type: SYNCHRONOUS DRAM

The synchronous DRAM type offers fast and synchronized data transfer.

Maximum Standby Current: 0.002 Amp

The low standby current helps in saving power when the DRAM is not in use.

Refresh Cycles: 4096

The refresh cycles help maintain data integrity in the DRAM.

Interleaved Burst Length: 1,2,4,8

The interleaved burst length options enhance data transfer efficiency.

Maximum Access Time: 5.4 ns

The fast maximum access time ensures quick data retrieval and processing.

Technical Specifications

DRAM K4S281632O-LI75T attributes and parameters. Explore more DRAM devices from Samsung

Specs

Maximum Access Time:

5.4 ns

Maximum Clock Frequency (fCLK):

133 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

1,2,4,8

JESD-30 Code:

R-PDSO-G54

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

16

No. of Terminals:

54

No. of Words:

8388608 words

No. of Words Code:

8M

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP54,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Refresh Cycles:

Sequential Burst Length:

1,2,4,8,FP

Maximum Standby Current:

.002 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

100 mA

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Trade Compliance

K4S281632O-LI75T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

Manufacturer Highlights

Samsung

Samsung Electronics Co., Ltd. engages in the consumer electronics, information technology and mobile communications, and device solutions businesses worldwide. The company offers smartphones, tablets, watches, and accessories; TVs, projectors, and sound devices; home appliances, including refrigerators, washing machines and dryers, vacuum cleaners, cooking appliances, dishwashers, air conditioners, and air purifiers; monitors, and memory and storage products; displays, and smart and LED signages; and other accessories. It also engages in technology, venture capital investments, cloud services, network devices installation and optimization, semiconductor equipment services, digital advertising platforms, marketing, consulting, connected services, logistics, financing, and software design activities; toll processing of display panels and semiconductors; development and sale of network solutions; manufactures semiconductors and food; provision of repair services for electronic devices and enterprise automation solutions; and development and supply of semiconductor process defect and quality control software. The company serves various industries, including education, retail, and finance, as well as government and corporate customers. Samsung Electronics Co., Ltd. was incorporated in 1969 and is based in Suwon-si, South Korea.

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