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MT40A2G8SA-062E:F

Micron Technology

MT40A2G8SA-062E:F by Micron Technology

Micron Technology's MT40A2G8SA-062E:F is a DDR4 DRAM with 2GX8 organization, operating at up to 1600 MHz. It features a thin profile grid array package suitable for applications requiring high-speed synchronous memory with common I/O.

Median Price

$24.785

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 5 parts In-Stock

1+ parts

$22.201

100+ parts

$18.620

1k+ parts

-

10k+ parts

-

5

$22.201

$18.620

-

-

Farnell

UK . 5 parts In-Stock

1+ parts

$24.785

100+ parts

$19.067

1k+ parts

-

10k+ parts

-

5

$24.785

$19.067

-

-

DigiKey

USA . 436 parts In-Stock

1+ parts

$172.460

100+ parts

$149.702

1k+ parts

-

10k+ parts

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436

$172.460

$149.702

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Mouser Electronics

USA . 3,391 parts In-Stock

1+ parts

$207.530

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3,391

$207.530

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Newark

USA . 1,229 parts In-Stock

1+ parts

$277.810

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-

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1,229

$277.810

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EBV Elektronik

Germany . 2,520 parts In-Stock

1+ parts

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2,520

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Future Electronics

Canada . 2,100 parts In-Stock

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-

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$13.690

10k+ parts

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2,100

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-

$13.690

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Verical

USA . 2,000 parts In-Stock

1+ parts

-

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-

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$11.236

2,000

-

-

-

$11.236

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,169 parts In-Stock

1+ parts

$9.566

100+ parts

-

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2,169

$9.566

-

-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$19.130

100+ parts

-

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50

$19.130

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IBS Electronics

USA . 8,190 parts In-Stock

1+ parts

-

100+ parts

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$1,164.215

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8,190

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-

$1,164.215

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Cyclops Electronics Ltd

UK . 8,000 parts In-Stock

1+ parts

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8,000

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Vyrian

USA . 2,159 parts In-Stock

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2,159

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BCID Electronics Ltd.

Israel . 780 parts In-Stock

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780

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ACDS - Activité Composants Distribution Service

France . 499 parts In-Stock

1+ parts

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499

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Bristol Electronics

USA . 499 parts In-Stock

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499

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Dan-Mar Components

USA . 499 parts In-Stock

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499

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,375 parts In-Stock

1+ parts

$9.063

100+ parts

-

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2,375

$9.063

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Ampacity Inc.

Singapore . 347 parts In-Stock

1+ parts

$9.550

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347

$9.550

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Continental Prestige Electronics

USA . 157 parts In-Stock

1+ parts

$16.420

100+ parts

$12.900

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-

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157

$16.420

$12.900

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CoreStaff

Japan . 1,050 parts In-Stock

1+ parts

$28.854

100+ parts

$19.063

1k+ parts

$19.039

10k+ parts

-

1,050

$28.854

$19.063

$19.039

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GreenTree Electronics

Israel . 25,372 parts In-Stock

1+ parts

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25,372

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Argo Parts USA

USA . 2,382 parts In-Stock

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2,382

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Authorized Procurement Solutions

USA . 1,076 parts In-Stock

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1,076

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RC Electronics

USA . 832 parts In-Stock

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832

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$18.747

1k+ parts

$18.173

10k+ parts

$17.791

50

-

$18.747

$18.173

$17.791

Overview

Experience top-of-the-line performance with Micron Technology's MT40A2G8SA-062E:F, a cutting-edge DDR4 DRAM module designed for seamless operation in various applications. This module offers unparalleled reliability and efficiency, thanks to Micron Technology's renowned quality standards. Unlock the power of synchronous operation and self-refresh capabilities, providing optimal functionality in a compact package. Elevate your computing experience with this versatile solution that delivers exceptional value and performance to meet all your memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable, ideal for portable devices.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures data is transferred at a precise rate, enhancing overall system performance.

Nominal Supply Voltage / Vsup (V): 1.2

The low nominal supply voltage of 1.2V helps in reducing power consumption and improving efficiency.

Maximum Clock Frequency (fCLK): 1600 MHz

The high maximum clock frequency allows for fast data transfer speeds, making the product suitable for high-performance applications.

Memory IC Type: DDR4 DRAM

Being DDR4 DRAM, the memory module offers improved data transfer rates and efficiency compared to older generations.

Technical Specifications

DRAM MT40A2G8SA-062E:F attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

MULTI BANK PAGE BURST

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

1600 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

8

JESD-30 Code:

R-PBGA-B78

Length:

11 mm

Memory Density:

17179869184 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

78

No. of Words:

2147483648 words

No. of Words Code:

2G

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2GX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA78,9X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

8

Maximum Supply Voltage (Vsup):

1.26 V

Minimum Supply Voltage (Vsup):

1.14 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

7.5 mm

Trade Compliance

MT40A2G8SA-062E:F Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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