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MT41K128M16JT-107IT:KTR

Micron Technology

MT41K128M16JT-107IT:KTR by Micron Technology

Micron Technology's MT41K128M16JT-107IT:KTR is a DDR3L DRAM with 128MX16 organization, operating at 934.5 MHz clock frequency. It features a thin profile grid array package suitable for industrial applications requiring high memory density and common I/O type.

Median Price

$5.339

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 24 parts In-Stock

1+ parts

$11.150

100+ parts

$9.564

1k+ parts

$8.791

10k+ parts

$8.567

24

$11.150

$9.564

$8.791

$8.567

Mouser Electronics

USA . 603 parts In-Stock

1+ parts

$19.480

100+ parts

-

1k+ parts

-

10k+ parts

-

603

$19.480

-

-

-

Avnet

USA . 28,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28,000

-

-

-

-

Future Electronics

Canada . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.090

4,000

-

-

-

$2.090

Arrow

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.603

2,000

-

-

-

$3.603

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$5.339

2,000

-

-

-

$5.339

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,263 parts In-Stock

1+ parts

$4.066

100+ parts

-

1k+ parts

-

10k+ parts

-

2,263

$4.066

-

-

-

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$4.423

100+ parts

-

1k+ parts

-

10k+ parts

-

650

$4.423

-

-

-

Component Sense

UK . 40,090 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

40,090

-

-

-

-

Chip Stock

USA . 15,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,700

-

-

-

-

Vyrian

USA . 1,751 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,751

-

-

-

-

EPE Components Inc.

USA . 1,031 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,031

-

-

-

-

Bristol Electronics

USA . 1,031 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,031

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,329 parts In-Stock

1+ parts

$2.270

100+ parts

$2.213

1k+ parts

$2.202

10k+ parts

-

2,329

$2.270

$2.213

$2.202

-

Ampacity Inc.

Singapore . 2,245 parts In-Stock

1+ parts

$2.270

100+ parts

-

1k+ parts

-

10k+ parts

-

2,245

$2.270

-

-

-

Corphita

USA . 2,025 parts In-Stock

1+ parts

$3.852

100+ parts

-

1k+ parts

-

10k+ parts

-

2,025

$3.852

-

-

-

Continental Prestige Electronics

USA . 4,443 parts In-Stock

1+ parts

$4.404

100+ parts

-

1k+ parts

-

10k+ parts

$4.316

4,443

$4.404

-

-

$4.316

Argo Parts USA

USA . 1,092 parts In-Stock

1+ parts

$4.404

100+ parts

-

1k+ parts

-

10k+ parts

-

1,092

$4.404

-

-

-

Corohmni

South Africa . 297 parts In-Stock

1+ parts

$4.945

100+ parts

-

1k+ parts

-

10k+ parts

-

297

$4.945

-

-

-

Aztec Data Supply Inc.

USA . 2,867 parts In-Stock

1+ parts

$4.960

100+ parts

-

1k+ parts

-

10k+ parts

-

2,867

$4.960

-

-

-

Perfect Parts

USA . 13,440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,440

-

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 4,745 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,745

-

-

-

-

Overview

Transform your tech experience with the MT41K128M16JT-107IT:KTR by Micron Technology. As a leader in the industry, Micron's cutting-edge DRAM technology offers unparalleled reliability and performance. Whether you're looking to enhance your gaming rig or boost the capabilities of your business applications, this versatile memory module delivers exceptional value. Upgrade to Micron today and unlock the full potential of your devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, making it easier to handle and less prone to damage during handling and installation.

Surface Mount: YES

Being surface mountable makes the product suitable for automated assembly processes, increasing efficiency and reducing production costs.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise and accurate data transfer, enhancing system performance and reliability.

Nominal Supply Voltage / Vsup (V): 1.35

Operating at a nominal supply voltage of 1.35V helps in reducing power consumption and heat generation, contributing to energy efficiency and prolonged product lifespan.

Maximum Clock Frequency (fCLK): 934.5 MHz

The high maximum clock frequency enables fast data transfer speeds, making the product suitable for high-performance applications.

Memory IC Type: DDR3L DRAM

The DDR3L DRAM technology offers improved power efficiency and higher data transfer rates, making the product ideal for devices requiring high-speed and energy-efficient memory solutions.

Technical Specifications

DRAM MT41K128M16JT-107IT:KTR attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

MULTI BANK PAGE BURST

Additional Features:

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

Maximum Clock Frequency (fCLK):

934.5 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

8

JESD-30 Code:

R-PBGA-B96

Length:

14 mm

Memory Density:

2147483648 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

96

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,9X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

8

Maximum Supply Voltage (Vsup):

1.45 V

Minimum Supply Voltage (Vsup):

1.283 V

Nominal Supply Voltage / Vsup (V):

1.35

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

MT41K128M16JT-107IT:KTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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