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MT47H64M16NF-25E:M

Micron Technology

MT47H64M16NF-25E:M by Micron Technology

Micron Technology's MT47H64M16NF-25E:M is a DDR2 DRAM with 64MX16 organization, operating at 400 MHz. It features a 1.8V nominal voltage and offers 67108864 words of memory density. Ideal for applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.

Median Price

$4.095

Lifecycle Status

Suppliers In-Stock

37

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 63 parts In-Stock

1+ parts

$3.810

100+ parts

$2.990

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$2.900

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63

$3.810

$2.990

$2.900

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Mouser Electronics

USA . 9,818 parts In-Stock

1+ parts

$4.010

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$3.360

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$3.150

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$4.010

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Element14

Singapore . 322 parts In-Stock

1+ parts

$4.594

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EBV Elektronik

Germany . 15,048 parts In-Stock

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Future Electronics

Canada . 6,840 parts In-Stock

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$2.160

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Arrow

USA . 6,000 parts In-Stock

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Verical

USA . 6,000 parts In-Stock

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WPG Americas

USA . 2,000 parts In-Stock

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DF Sales Co.

USA . 18 parts In-Stock

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$2.500

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18

$2.500

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DF Sales Co.

USA . 18 parts In-Stock

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$2.500

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18

$2.500

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Digiode

USA . 1,345 parts In-Stock

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$3.620

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Nova Conductors

Japan . 300 parts In-Stock

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$4.323

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300

$4.323

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Freelance Electronics

USA . 110 parts In-Stock

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$4.850

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$5.092

1k+ parts

$4.802

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110

$4.850

$5.092

$4.802

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Mobius Materials

USA . 2,109 parts In-Stock

1+ parts

$6.670

100+ parts

$5.330

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2,109

$6.670

$5.330

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Cyclops Electronics Ltd

UK . 164,564 parts In-Stock

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Goldney Electronics S.L.

Spain . 8,000 parts In-Stock

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Rebound Electronics

UK . 6,025 parts In-Stock

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NAC Semi

USA . 3,644 parts In-Stock

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3,644

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Vyrian

USA . 3,364 parts In-Stock

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HZD GmbH

Germany . 2,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,008 parts In-Stock

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Greenchips

USA . 877 parts In-Stock

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SIE Connect GmbH - GreenChips

Germany . 877 parts In-Stock

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Bristol Electronics

USA . 745 parts In-Stock

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Atlantic Semiconductor

USA . 731 parts In-Stock

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Sensible Micro Corp

USA . 642 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 483 parts In-Stock

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Speed Components Ltd

Israel . 345 parts In-Stock

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Amalfi Trading

USA . 329 parts In-Stock

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Inventory MP

USA . 323 parts In-Stock

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323

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Semtec, LLC

USA . 120 parts In-Stock

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Infinite Electronics LLP

India . 110 parts In-Stock

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Electronics Depot

USA . 18 parts In-Stock

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Contempo Components LLC

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ComSIT Distribution GmbH

Germany . 8 parts In-Stock

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ComSIT USA

USA . 8 parts In-Stock

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Semi Source

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,340 parts In-Stock

1+ parts

$2.210

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3,340

$2.210

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Semicontronic

India . 6,858 parts In-Stock

1+ parts

$3.240

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$3.159

1k+ parts

$3.143

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6,858

$3.240

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$3.143

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Corphita

USA . 2,400 parts In-Stock

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$3.429

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$3.429

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Aztec Data Supply Inc.

USA . 14,457 parts In-Stock

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$4.200

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14,457

$4.200

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Argo Parts USA

USA . 2,516 parts In-Stock

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$4.323

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2,516

$4.323

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Netroflash

USA . 1,000 parts In-Stock

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$4.323

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$4.107

10k+ parts

$4.020

1,000

$4.323

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$4.107

$4.020

Corohmni

South Africa . 169 parts In-Stock

1+ parts

$4.583

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169

$4.583

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Continental Prestige Electronics

USA . 364 parts In-Stock

1+ parts

$4.730

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$3.370

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364

$4.730

$3.370

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Modulus Dynamics

Lithuania . 450 parts In-Stock

1+ parts

$4.799

100+ parts

$4.751

1k+ parts

$4.607

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450

$4.799

$4.751

$4.607

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Advanced Electronics

New Zealand . 59 parts In-Stock

1+ parts

$6.330

100+ parts

$5.760

1k+ parts

$5.191

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59

$6.330

$5.760

$5.191

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Component Connect

USA . 25,988 parts In-Stock

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BidChips

USA . 22,480 parts In-Stock

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GreenTree Electronics

Israel . 20,000 parts In-Stock

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Kepictronics

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,531 parts In-Stock

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8,531

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RC Electronics

USA . 6,522 parts In-Stock

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6,522

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Futuretech Components

Singapore . 6,000 parts In-Stock

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Emar International I/E

Canada . 5,676 parts In-Stock

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5,676

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Speed Components Ltd (Excess)

Israel . 2,317 parts In-Stock

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2,317

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Cyclops Electronics Ltd (Excess)

UK . 1,018 parts In-Stock

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1,018

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Infinite Electronics LLP (Excess)

. 632 parts In-Stock

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632

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S.R.D Solutions

India . 500 parts In-Stock

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500

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Robosynatics

Brazil . 200 parts In-Stock

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200

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Lucentia Tech

USA . 200 parts In-Stock

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200

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Computer Components Inc. - USA

USA . 4 parts In-Stock

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Overview

Experience unparalleled performance and reliability with Micron Technology's MT47H64M16NF-25E:M DDR2 DRAM. This cutting-edge memory module offers seamless synchronous operation, self-refresh capability, and a common input/output type, making it ideal for a wide range of applications. With a nominal supply voltage of 1.8V and a maximum clock frequency of 400 MHz, this high-quality product delivers exceptional value, efficiency, and speed to meet your computing needs. Upgrade your system today with Micron Technology's MT47H64M16NF-25E:M for a superior computing experience like no other.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection to the DRAM, ensuring its longevity and reliability.

Operating Mode: SYNCHRONOUS

The synchronous operating mode allows for precise timing and coordination of data transfers, enhancing the overall performance of the DRAM.

Nominal Supply Voltage: 1.8V

The 1.8V supply voltage ensures efficient power consumption and operation of the DRAM, making it energy-efficient.

Maximum Clock Frequency: 400 MHz

With a high maximum clock frequency of 400 MHz, this DRAM can handle high-speed data processing tasks effectively and quickly.

Technology: CMOS

Utilizing CMOS technology makes the DRAM more power-efficient and offers faster operation speeds compared to other technologies.

Technical Specifications

DRAM MT47H64M16NF-25E:M attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

MULTI BANK PAGE BURST

Maximum Access Time:

.4 ns

Additional Features:

SELF REFRESH

Maximum Clock Frequency (fCLK):

400 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

4,8

JESD-30 Code:

R-PBGA-B84

JESD-609 Code:

e1

Length:

12.5 mm

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

84

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA84,9X15,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

4,8

Sub-Category:

DRAMs

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

MT47H64M16NF-25E:M Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.32

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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