Loading...

TM124BBJ32U-70L

Texas Instruments

TM124BBJ32U-70L by Texas Instruments

TM124BBJ32U-70L by Texas Instruments is a 1MX32 DRAM module with 1048576 words and memory width of 32. Operating at 5V, it offers fast page access mode in CMOS technology. Ideal for commercial applications requiring high-speed memory solutions up to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,952 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,952

-

-

-

-

Vyrian

USA . 2,396 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,396

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 41 parts In-Stock

1+ parts

$5.211

100+ parts

-

1k+ parts

$5.824

10k+ parts

-

41

$5.211

-

$5.824

-

DigiPath Technology Company

USA . 2,042 parts In-Stock

1+ parts

$5.738

100+ parts

$5.279

1k+ parts

-

10k+ parts

-

2,042

$5.738

$5.279

-

-

ChromeModa Solutions

Germany . 3,963 parts In-Stock

1+ parts

$5.855

100+ parts

$4.801

1k+ parts

-

10k+ parts

-

3,963

$5.855

$4.801

-

-

IDEA Electronic Components Group

UK . 108 parts In-Stock

1+ parts

$5.855

100+ parts

-

1k+ parts

$5.270

10k+ parts

-

108

$5.855

-

$5.270

-

AZTECH Wire

Italy . 427 parts In-Stock

1+ parts

$8.431

100+ parts

-

1k+ parts

-

10k+ parts

-

427

$8.431

-

-

-

One Stop Electronics

USA . 388 parts In-Stock

1+ parts

$29.000

100+ parts

-

1k+ parts

-

10k+ parts

-

388

$29.000

-

-

-

Corphita

USA . 1,852 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,852

-

-

-

-

Overview

Experience superior performance with the TM124BBJ32U-70L by Texas Instruments, a leading manufacturer in the DRAM category. Perfect for various applications, this asynchronous memory module offers unparalleled value and benefits to customers. With a nominal supply voltage of 5V and fast access mode, you can trust this high-quality product to meet your memory needs efficiently. Trust Texas Instruments to deliver reliable products that exceed expectations.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy installation in various systems.

Operating Mode: ASYNCHRONOUS

Asynchronous operation provides flexibility in communication with other components, allowing for optimized performance.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures compatibility with many systems and allows for stable performance.

No. of Terminals: 72

Having a high number of terminals enables efficient connectivity and data transfer within the system.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand heat and maintain reliable performance in various environments.

Organization: 1MX32

Organized as 1MX32, this product offers a high memory capacity and data width for storing and accessing large amounts of data efficiently.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation, making this product energy efficient and reliable.

Maximum Access Time: 70 ns

With a maximum access time of 70 ns, this product provides fast data retrieval, enhancing overall system performance.

Technical Specifications

DRAM TM124BBJ32U-70L attributes and parameters. Explore more DRAM devices from Texas Instruments

Specs

Access Mode:

FAST PAGE

Maximum Access Time:

70 ns

Additional Features:

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

JESD-30 Code:

R-XSMA-N72

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

72

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1MX32

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

SINGLE

Trade Compliance

TM124BBJ32U-70L Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19