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OMAPL138BZWT3

Texas Instruments

OMAPL138BZWT3 by Texas Instruments

The Texas Instruments OMAPL138BZWT3 is a DSP with 361 terminals, operating at 0-90°C. It features a clock frequency of 50 MHz and low power mode, suitable for digital signal processing applications. With a package style of grid array and terminal pitch of 0.8mm, it offers high performance in a compact form factor.

Median Price

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Lifecycle Status

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7

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 3,860 parts In-Stock

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Elcom Components

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Flip Electronics

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Bristol Electronics

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PC Components Company LLC

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Inventory MP

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AZTECH Wire

Italy . 760 parts In-Stock

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$5.060

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One Stop Electronics

USA . 1,629 parts In-Stock

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Ampacity Inc.

Singapore . 930 parts In-Stock

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Parana Technologies

USA . 1,027 parts In-Stock

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DigiPath Technology Company

USA . 487 parts In-Stock

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$46.960

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$43.203

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ChromeModa Solutions

Germany . 6,043 parts In-Stock

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IDEA Electronic Components Group

UK . 1,002 parts In-Stock

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Corohmni

South Africa . 656 parts In-Stock

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A-Z Elektronik GmbH

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Lixinc

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Perfect Parts

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Emar International I/E

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Microchip USA

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ChipstoGo Electronic ltd

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Overview

Experience the power of cutting-edge technology with the OMAPL138BZWT3 by Texas Instruments, a top-of-the-line digital signal processor designed for unparalleled performance and reliability. With Texas Instruments' reputation for excellence in innovation and quality, this DSP offers endless possibilities for applications in fields such as telecommunications, audio processing, and industrial automation. Elevate your projects with the OMAPL138BZWT3's advanced features, seamless integration, and unmatched value. Discover the difference today and revolutionize your work with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 1.35 V

The low maximum supply voltage helps in reducing power consumption and heat generation.

Package Shape: SQUARE

The square shape allows for efficient use of space on the circuit board.

Power Supplies (V): 1.2,1.8/3.3

Multiple power supply options provide flexibility in designing and optimizing power consumption.

No. of Terminals: 361

Having a high number of terminals allows for connectivity to various peripherals and components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density and efficient routing of signals.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage allows for operation in low power environments.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes the product suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity and reliability for connections.

Terminal Position: BOTTOM

The bottom terminal position makes it easier to mount the product onto circuit boards.

Maximum Seated Height: 1.4 mm

Low seated height helps in space-constrained applications.

Width: 16 mm

The compact width allows for efficient use of space on the circuit board.

Boundary Scan: YES

Boundary scan capability provides for easy testing and debugging of circuits.

Maximum Clock Frequency: 50 MHz

The high clock frequency enables fast processing of signals and data.

Maximum Time At Peak Reflow Temperature (s): 30

This short reflow time helps in preventing damage to the product during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures secure soldering connections during assembly.

Internal Bus Architecture: MULTIPLE

Multiple internal buses enhance data transfer efficiency within the product.

Length: 16 mm

The compact length helps in fitting the product into small form factor designs.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

This versatile IC type supports various digital signal processing tasks and additional functionalities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient signal processing.

Terminal Form: BALL

Ball terminals provide reliable connections and ease of mounting onto circuit boards.

Nominal Supply Voltage: 1 V

The nominal supply voltage ensures stable operation of the product within specified parameters.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high density mounting and efficient routing of connections.

Format: FLOATING POINT

The floating point format enables efficient and accurate processing of numerical data.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the product's ability to withstand moderate levels of moisture exposure.

Low Power Mode: YES

The low power mode option enables energy-efficient operation to prolong battery life.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL138BZWT3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAPL138BZWT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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