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STGB20H65DFB2

STMicroelectronics

STGB20H65DFB2 by STMicroelectronics

STGB20H65DFB2 from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control. It features a max VCEsat of 2.1V, supports up to 40A collector current, and operates in temperatures from -55 °C to 175 °C. Ideal for high-performance applications, it ensures reliable operation with built-in diode functionality.

Median Price

$0.870

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 3,000 parts In-Stock

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3,000

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Future Electronics

Canada . 1,000 parts In-Stock

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-

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1k+ parts

$0.870

10k+ parts

$0.810

1,000

-

-

$0.870

$0.810

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,440 parts In-Stock

1+ parts

-

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7,440

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Digiode

USA . 2,520 parts In-Stock

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2,520

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Anansix

USA . 2,269 parts In-Stock

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2,269

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,112 parts In-Stock

1+ parts

$0.951

100+ parts

-

1k+ parts

$0.856

10k+ parts

-

2,112

$0.951

-

$0.856

-

MKK Technologies

India . 503 parts In-Stock

1+ parts

$1.789

100+ parts

-

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503

$1.789

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DigiPath Technology Company

USA . 503 parts In-Stock

1+ parts

$1.789

100+ parts

-

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-

503

$1.789

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AZTECH Wire

Italy . 432 parts In-Stock

1+ parts

$14.640

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432

$14.640

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Microchip USA

USA . 4,509 parts In-Stock

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4,509

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Corphita

USA . 3,744 parts In-Stock

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3,744

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iodParts Technologies Inc.

India . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 78 parts In-Stock

1+ parts

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100+ parts

$1.137

1k+ parts

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78

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$1.137

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Overview

Unlock unparalleled efficiency and reliability with the STGB20H65DFB2 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel IGBT is designed for seamless power control in various applications, ensuring superior performance even in extreme conditions. With its compact design and built-in diode, it promises easy integration and outstanding thermal management. Elevate your projects with a trusted component that delivers exceptional value and long-term benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, enhancing the overall reliability of the IGBT.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are generally preferred for power switching applications due to their higher efficiency and better performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances performance in applications requiring fast turn-off times.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is ideal for various applications including motor drives and power inverters.

Surface Mount: YES

Surface mount capability allows for compact PCB designs and higher assembly efficiency, making it suitable for modern electronics.

Maximum VCEsat: 2.1 V

A low VCEsat indicates improved efficiency and reduced power loss during operation, leading to better thermal management.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization in circuit boards, facilitating integration into compact designs.

Terminal Form: GULL WING

Gull wing terminals provide ease of soldering and mechanical stability, ensuring reliable connections.

Nominal Turn Off Time (toff): 178 ns

A fast turn-off time allows for high-speed switching applications, improving performance in dynamic circuits.

No. of Terminals: 2

With only two terminals, this IGBT simplifies circuit connections and reduces the layout complexity.

Maximum Power Dissipation (Abs): 147 W

High power dissipation capability allows for the management of significant loads, making it suitable for demanding applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables high-density designs and is ideal for space-constrained applications.

Maximum Operating Temperature: 175 °C

A high operating temperature rating increases reliability in harsh environments, allowing for versatile applications.

Maximum Collector-Emitter Voltage: 650 V

A high voltage rating ensures compatibility with high-voltage applications, facilitating its usage in various power systems.

Transistor Element Material: SILICON

Silicon as the material ensures good thermal conductivity and effective switching characteristics, essential for high-performance devices.

Maximum Gate-Emitter Voltage: 20 V

A wide gate-emitter voltage range allows for flexible drive configurations and compatibility with various control circuits.

Minimum Operating Temperature: -55 °C

Operating effectively at low temperatures expands its range of applications, particularly in extreme environments.

Maximum Collector Current (IC): 40 A

A maximum collector current of 40 A supports high-current applications and enhances overall power handling capability.

Maximum Gate-Emitter Threshold Voltage: 7 V

A manageable gate-emitter threshold simplifies gate drive requirements and adds to the versatility of the device.

Terminal Position: SINGLE

Single terminal positioning streamlines connections, making integration into circuit designs easier and more efficient.

Case Connection: COLLECTOR

Direct collector connection enhances performance and reduces additional circuit complexities for power applications.

Nominal Turn On Time (ton): 26 ns

Fast turn-on time allows for rapid switching applications, improving system responsiveness and efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGB20H65DFB2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

178 ns

Nominal Turn On Time (ton):

26 ns

Maximum VCEsat:

2.1 V

Trade Compliance

STGB20H65DFB2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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