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STGB10HF60KDT4

STMicroelectronics

STGB10HF60KDT4 by STMicroelectronics

STGB10HF60KDT4 from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 600 V, 20 A collector current, and operates up to 175 °C. Its compact surface mount design ensures versatility in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,793 parts In-Stock

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2,793

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Anansix

USA . 2,661 parts In-Stock

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2,661

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Vyrian

USA . 409 parts In-Stock

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409

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 395 parts In-Stock

1+ parts

$0.593

100+ parts

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1k+ parts

$0.534

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395

$0.593

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$0.534

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MKK Technologies

India . 643 parts In-Stock

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$1.116

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643

$1.116

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DigiPath Technology Company

USA . 643 parts In-Stock

1+ parts

$1.116

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643

$1.116

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Corphita

USA . 1,968 parts In-Stock

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1,968

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Parana Technologies

USA . 1,426 parts In-Stock

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$0.710

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1,426

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$0.710

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Overview

Unlock unparalleled efficiency and reliability with the STGB10HF60KDT4 from STMicroelectronics. Renowned for its superior quality and innovation, STMicroelectronics delivers this outstanding Insulated Gate Bipolar Transistor, perfect for power control applications. With its compact design and robust performance, it ensures optimal thermal management and longevity, making it an ideal choice for demanding environments. Elevate your projects with a component you can trust to deliver exceptional results!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and reliability, providing excellent protection against environmental factors.

Polarity or Channel Type: N-CHANNEL

N-channel types typically offer better performance characteristics in power control applications, making this IGBT suitable for high-efficiency designs.

Configuration: SINGLE WITH BUILT-IN DIODE

The single configuration with a built-in diode reduces component count and allows for better thermal management in circuit designs.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is ideal for applications requiring high voltage and current ratings, ensuring efficient performance.

Surface Mount: YES

Surface mount capability facilitates compact design and ease of assembly, making it suitable for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on PCBs, allowing for greater circuit density.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics and mechanical stability, improving reliability in electronic assemblies.

No. of Terminals: 2

With only two terminals, this IGBT simplifies circuit design and reduces potential points of failure, enhancing overall reliability.

Maximum Power Dissipation (Abs): 80 W

An 80 W power dissipation rating allows for efficient operation in demanding applications without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, allowing for greater design flexibility.

Maximum Operating Temperature: 175 °C

The ability to operate at temperatures up to 175 °C ensures reliability and performance in high-temperature environments.

Maximum Collector-Emitter Voltage: 600 V

600 V voltage capability makes this IGBT suitable for use in high-voltage applications, broadening its range of applications.

Transistor Element Material: SILICON

Silicon as the element material is well-known for its effective electrical properties, enhancing the performance of this IGBT.

Maximum Gate-Emitter Voltage: 20 V

The 20 V gate-emitter voltage capability provides flexibility in circuit design while ensuring compatibility with a wide range of drive circuits.

Maximum Collector Current (IC): 20 A

With a maximum collector current rating of 20 A, this IGBT can handle significant loads, making it suitable for heavy-duty applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

A threshold voltage of 6.5 V allows for efficient and fast switching characteristics, reducing power losses during operation.

Terminal Position: SINGLE

The single terminal position simplifies connections and improves layout efficiency on printed circuit boards.

Case Connection: COLLECTOR

A collector case connection design enhances heat dissipation and overall performance, ensuring stable operation under load.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGB10HF60KDT4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Trade Compliance

STGB10HF60KDT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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