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STGB30V60F

STMicroelectronics

STGB30V60F by STMicroelectronics

STGB30V60F by STMicroelectronics is an N-CHANNEL IGBT transistor with VCEsat of 2.3V and IC of 60A, ideal for POWER CONTROL applications. It has a toff of 225ns, ton of 59ns, and can handle up to 260W power dissipation. Suitable for surface mount with operating temperature range from -55°C to 175°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,313 parts In-Stock

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Digiode

USA . 1,915 parts In-Stock

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Anansix

USA . 976 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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150

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IDEA Electronic Components Group

UK . 880 parts In-Stock

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$0.462

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$0.416

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880

$0.462

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$0.416

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MKK Technologies

India . 1,484 parts In-Stock

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$0.868

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$0.868

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DigiPath Technology Company

USA . 1,484 parts In-Stock

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$0.868

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$0.868

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Corohmni

South Africa . 204 parts In-Stock

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$1.222

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204

$1.222

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AZTECH Wire

Italy . 999 parts In-Stock

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$16.310

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$16.310

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Ampacity Inc.

Singapore . 256 parts In-Stock

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$18.050

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$18.050

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Semicontronic

India . 1,051 parts In-Stock

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$33.050

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$32.224

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$32.058

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1,051

$33.050

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$32.058

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Argo Parts USA

USA . 4,706 parts In-Stock

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Corphita

USA . 3,679 parts In-Stock

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Continental Prestige Electronics

USA . 2,517 parts In-Stock

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Parana Technologies

USA . 879 parts In-Stock

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$0.552

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Aranea Global

USA . 500 parts In-Stock

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Overview

Unleash the power of STMicroelectronics' STGB30V60F Insulated Gate Bipolar Transistor (IGBT) for all your power control needs. With a maximum collector-emitter voltage of 600V and a maximum collector current of 60A, this N-channel transistor offers superior performance and reliability. Perfect for applications requiring high power dissipation, this IGBT is designed to withstand extreme temperatures while delivering efficient power control. Trust STMicroelectronics to provide you with cutting-edge technology that exceeds expectations and maximizes value for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the IGBT, ensuring long-lasting performance and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have higher mobility and lower resistance, making them suitable for high power control applications.

Configuration: SINGLE

Single configuration simplifies the circuit design and makes the IGBT easy to integrate into existing power control systems.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for efficient and precise control of electrical power.

Surface Mount: YES

Surface mount capability allows for easy and efficient mounting on PCBs, saving space and simplifying assembly processes.

Maximum VCEsat: 2.3 V

Low VCEsat value indicates minimal voltage drop across the collector-emitter junction, leading to higher efficiency and lower power dissipation.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact form factor, making it suitable for space-constrained applications.

Nominal Turn Off Time (toff): 225 ns

Fast turn-off time enables quick switching capabilities, reducing power losses and improving overall efficiency.

Maximum Power Dissipation (Abs): 260 W

High power dissipation capability ensures the IGBT can handle demanding power requirements without overheating or failing.

Package Style (Meter): SMALL OUTLINE

Small outline package style further enhances space efficiency and allows for versatile mounting options in various applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature tolerance enables reliable operation in elevated temperature environments without compromising performance.

Maximum Collector-Emitter Voltage: 600 V

High maximum collector-emitter voltage rating provides versatility and ensures compatibility with a wide range of voltage requirements.

Transistor Element Material: SILICON

Silicon material offers excellent electrical properties, high temperature tolerance, and reliability, making it an ideal choice for power semiconductor devices.

Maximum Gate-Emitter Voltage: 20 V

High maximum gate-emitter voltage rating allows for robust control signals and ensures stable operation under varying input signal conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures reliable performance even in extreme cold conditions, making this IGBT suitable for a wide range of environments.

Maximum Collector Current (IC): 60 A

High maximum collector current rating allows for handling large currents, making this IGBT suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 7 V

Moderate gate-emitter threshold voltage facilitates precise control and switching of the IGBT, ensuring accurate power modulation.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection procedures, reducing complexity and error potential in circuitry.

Case Connection: COLLECTOR

Case connection to collector facilitates efficient heat dissipation, ensuring optimal thermal management and preventing overheating issues.

Nominal Turn On Time (ton): 59 ns

Fast turn-on time enables rapid response and precise switching control, enhancing the overall performance and efficiency of power control circuits.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGB30V60F attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

225 ns

Nominal Turn On Time (ton):

59 ns

Maximum VCEsat:

2.3 V

Trade Compliance

STGB30V60F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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