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M29DW128F60NF1T

STMicroelectronics

M29DW128F60NF1T by STMicroelectronics

M29DW128F60NF1T from STMicroelectronics is a 16-bit NOR Flash memory with a density of 128Mb, operating at 3V. It features asynchronous access with a max speed of 60 ns and supports parallel interface. Ideal for embedded applications requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,914 parts In-Stock

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6,914

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Digiode

USA . 5,109 parts In-Stock

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5,109

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Anansix

USA . 282 parts In-Stock

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282

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,743 parts In-Stock

1+ parts

$2.963

100+ parts

-

1k+ parts

$2.667

10k+ parts

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1,743

$2.963

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$2.667

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MKK Technologies

India . 791 parts In-Stock

1+ parts

$5.572

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791

$5.572

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DigiPath Technology Company

USA . 791 parts In-Stock

1+ parts

$5.572

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791

$5.572

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Corphita

USA . 1,423 parts In-Stock

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1,423

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Parana Technologies

USA . 1,305 parts In-Stock

1+ parts

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$3.543

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1,305

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$3.543

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Overview

Unlock unparalleled performance with the M29DW128F60NF1T Flash Memory from STMicroelectronics, a leader in innovation and reliability. This high-quality NOR type memory is designed for seamless asynchronous operation, ideal for automotive, industrial, and consumer applications. Its compact size ensures easy integration while providing exceptional speed and efficiency. Trust in STMicroelectronics' legacy of excellence to elevate your projects and achieve greater results!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, enhancing the product's longevity.

Surface Mount: YES

Surface mount technology allows for compact designs and high-density PCB layouts, making it suitable for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient use of board space and simplifies handling during manufacturing.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables faster access times and simplifies interfacing with microcontrollers and processors.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal voltage of 3V allows for compatibility with a variety of low-power devices.

Power Supplies (V): 3/3.3

Supports a range of supply voltages, accommodating various system designs and power requirements.

No. of Terminals: 56

A higher number of terminals provides more flexibility for connections and configurations in complex applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile are ideal for minimizing footprint in compact electronic devices.

Alternate Memory Width: 8

An 8-bit memory width allows efficient data processing while maintaining a balance with power consumption.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability in high-temperature environments.

Organization: 8MX16

The memory organization supports high density and efficient data storage, making it suitable for applications requiring large memory capacities.

Minimum Operating Temperature: 0 °C

Operating from 0 °C ensures functionality in a wide range of temperatures, increasing its applicability.

No. of Sectors/Size: 16,254

A large number of sectors allows for flexible memory management and efficient data organization.

Terminal Finish: TIN LEAD

The tin lead finish provides good solderability and durability, ensuring robust connections during assembly.

Terminal Position: DUAL

Dual terminal positioning allows for better board layout options and facilitates easier connections.

Maximum Seated Height: 1.2 mm

A low seated height is advantageous for low-profile designs, making it suitable for slim devices.

Width: 14 mm

The compact width aids in saving space on the PCB, accommodating more components in limited areas.

Minimum Supply Voltage (Vsup): 2.7 V

A low minimum supply voltage permits operation in battery-operated and low-power devices.

Page Size (words): 8/16

Supports flexible page sizes, providing versatility in data transfer and storage operations.

Type: NOR TYPE

NOR type memory offers faster read speeds and efficient random access, making it ideal for code storage.

Common Flash Interface: YES

A common flash interface facilitates easier integration and compatibility with existing systems.

Length: 18.4 mm

The suitable length complements the compact design, fitting a variety of applications.

Programming Voltage (V): 3

Operating at a standardized programming voltage simplifies design considerations and compatibility.

Temperature Grade: COMMERCIAL

Commercial grade temperature range ensures reliability in typical operational environments.

Technology: CMOS

CMOS technology provides low power consumption and high performance, ideal for modern electronic devices.

Parallel or Serial: PARALLEL

Parallel architecture allows for faster data transfer rates, enhancing overall performance.

Terminal Form: GULL WING

Gull-wing terminals enhance soldering reliability and are compatible with automatic assembly processes.

Sector Size (Words): 8K,64K

Flexible sector sizes enable efficient data management and ideal for various applications.

Maximum Supply Current: 20 mA

Low maximum supply current ensures minimal power consumption, extending device battery life.

No. of Words: 8388608 words

A high memory word count provides ample space for data storage in a variety of applications.

Toggle Bit: YES

Toggle bit feature enables efficient error detection and memory management.

Memory Width: 16

A 16-bit memory width allows for higher data throughput, suitable for performance-intensive applications.

Terminal Pitch: 0.5 mm

A smaller terminal pitch allows for more compact designs and higher-density components on PCBs.

No. of Words Code: 8M

The memory capacity of 8M words provides considerable storage for data and programs.

Command User Interface: YES

A user-friendly command interface enhances ease of use and simplifies programming.

Ready or Busy: YES

Ready/busy signals support effective workflow management, ensuring devices respond in real-time.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V ensures compatibility with a variety of power sources.

Boot Block: BOTTOM/TOP

Boot block configuration offers versatile boot options for embedded systems, enhancing design flexibility.

Memory Density: 134217728 bit

High memory density supports data-heavy applications, enabling advanced functionalities in devices.

Memory IC Type: FLASH

Flash memory is non-volatile, ensuring data retention even without power, crucial for many applications.

Maximum Standby Current: 0.0001 Amp

Extremely low standby current supports energy-efficient designs, ideal for battery-powered applications.

Maximum Access Time: 60 ns

Quick access time enhances overall system speed and performance, beneficial for high-speed applications.

Data Polling: YES

Data polling capability allows real-time monitoring of memory operations, facilitating efficient data management.

Technical Specifications

Flash Memory M29DW128F60NF1T attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

60 ns

Additional Features:

100,000 PROGRAM/ERASE CYCLES

Alternate Memory Width:

8

Boot Block:

BOTTOM/TOP

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e0

Length:

18.4 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

16,254

No. of Terminals:

56

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Page Size (words):

8/16

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

8K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Toggle Bit:

YES

Type:

NOR TYPE

Width:

14 mm

Trade Compliance

M29DW128F60NF1T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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