Loading...

M29DW128F60ZA6T

STMicroelectronics

M29DW128F60ZA6T by STMicroelectronics

M29DW128F60ZA6T from STMicroelectronics is a 16-bit NOR Flash memory with a density of 128Mb, operating at 3V. It features asynchronous access with a max speed of 60 ns and operates in extreme temperatures from -40 °C to 85 °C. Ideal for industrial applications, it supports data polling and has a thin profile design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,424

-

-

-

-

Anansix

USA . 2,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,300

-

-

-

-

Vyrian

USA . 1,145 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,145

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,691 parts In-Stock

1+ parts

$4.011

100+ parts

-

1k+ parts

$3.610

10k+ parts

-

1,691

$4.011

-

$3.610

-

MKK Technologies

India . 286 parts In-Stock

1+ parts

$7.543

100+ parts

-

1k+ parts

-

10k+ parts

-

286

$7.543

-

-

-

DigiPath Technology Company

USA . 286 parts In-Stock

1+ parts

$7.543

100+ parts

-

1k+ parts

-

10k+ parts

-

286

$7.543

-

-

-

Corphita

USA . 2,327 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,327

-

-

-

-

Parana Technologies

USA . 2,106 parts In-Stock

1+ parts

-

100+ parts

$4.796

1k+ parts

-

10k+ parts

-

2,106

-

$4.796

-

-

Overview

Unlock unparalleled performance with the M29DW128F60ZA6T Flash Memory from STMicroelectronics, a leader in innovation and quality. This robust solution is designed for demanding applications across automotive, industrial, and consumer electronics. Offering high density and reliability, it ensures swift data access while operating seamlessly in varying temperatures. Trust in ST’s decades of expertise to enhance your projects with unmatched efficiency and durability. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection against environmental factors.

Surface Mount: YES

Surface mount capability allows for compact design and easier integration into modern electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape is space-efficient, facilitating effective use of PCB real estate.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables faster data access without needing to synchronize with external clock signals.

Nominal Supply Voltage / Vsup (V): 3

Operates on a common supply voltage of 3V, making it compatible with a wide range of devices.

Power Supplies (V): 3/3.3

Dual power supply options enhance versatility for various applications, accommodating both standard 3V and 3.3V requirements.

No. of Terminals: 64

With 64 terminals, this memory provides ample connectivity for efficient data transfer, enhancing overall system performance.

Package Style (Meter): GRID ARRAY, THIN PROFILE

Thin profile and grid array style promote efficient space utilization and facilitate sufficient thermal dissipation during operation.

Alternate Memory Width: 8

An alternate memory width of 8 ensures compatibility with various systems requiring different data widths.

Maximum Operating Temperature: 85 °C

High maximum operating temperature enables its use in industrial applications, ensuring reliability in challenging environments.

Organization: 8MX16

The organization of 8MX16 provides a balanced architecture for optimizing both performance and storage capacity.

Minimum Operating Temperature: -40 °C

The ability to function at low temperatures makes it suitable for outdoor and harsh environments.

No. of Sectors/Size: 16,254

A large number of sectors allows for efficient data management and organization.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers excellent solderability and corrosion resistance, enhancing device longevity.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB design, providing an efficient layout for circuit boards.

Maximum Seated Height: 1.2 mm

A low seated height aids in maintaining a compact design suitable for modern electronics.

Width: 10 mm

Width of 10 mm contributes to a compact design, suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 2.7 V

Operational flexibility with a minimum supply voltage of 2.7V supports devices with lower power requirements.

Page Size (words): 8/16

Flexible page size allows for efficient data handling depending on specific application needs.

Type: NOR TYPE

NOR type memory offers fast read speeds and reliable data retention, ideal for applications requiring quick access.

Common Flash Interface: YES

The inclusion of a common flash interface facilitates easier integration into existing systems and enhances compatibility.

Length: 13 mm

Compact length makes it suitable for high-density applications where space is a critical factor.

Programming Voltage (V): 3

Operating at a standard programming voltage of 3V simplifies power supply requirements.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring reliability in demanding conditions.

Technology: CMOS

CMOS technology ensures low power consumption, making this product energy-efficient for long-term use.

Parallel or Serial: PARALLEL

Parallel operation allows for faster data transfers, enhancing the performance of applications requiring quick data access.

Terminal Form: BALL

Ball terminal form provides excellent electrical performance and reduces the risk of solder joint fatigue.

Sector Size (Words): 8K, 64K

Variable sector sizes cater to diverse application needs, optimizing both storage efficiency and performance.

Maximum Supply Current: 20 mA

Low maximum supply current optimizes energy usage, ideal for battery-operated devices.

No. of Words: 8388608 words

A substantial word count offers ample memory space for data storage in various applications.

Toggle Bit: YES

Toggle bit functionality enables device status monitoring, ensuring enhanced reliability and ease of troubleshooting.

Memory Width: 16

A memory width of 16 enhances data handling capabilities, accommodating more extensive data transfers.

Terminal Pitch: 1 mm

A 1 mm terminal pitch enables a compact layout while preserving sufficient spacing for soldering.

No. of Words Code: 8M

An 8M word code indicates a significant storage capacity, meeting the demands of complex applications.

Command User Interface: YES

A user-friendly command interface simplifies programming and reduces the need for complex control logic.

Ready or Busy: YES

The ready/busy indicator allows for enhanced coordination in data processing, preventing data loss or corruption.

Maximum Supply Voltage (Vsup): 3.6 V

Support for a maximum supply voltage of 3.6V allows it to operate effectively in various power conditions.

Boot Block: BOTTOM/TOP

Configurable boot blocks provide enhanced flexibility for firmware storage and application development.

Memory Density: 134217728 bit

High memory density allows for significant data storage, making it suitable for applications requiring large memory capacity.

Memory IC Type: FLASH

Flash memory type ensures non-volatility and fast access times, ideal for a variety of storage needs.

Maximum Standby Current: 0.0001 Amp

Ultra-low standby current improves energy efficiency, particularly beneficial for battery-operated devices.

Maximum Access Time: 60 ns

Fast access time of 60 ns enables quicker data retrieval, enhancing the performance of applications.

Data Polling: YES

Data polling capability enhances monitoring and control during read/write operations, improving overall reliability.

Technical Specifications

Flash Memory M29DW128F60ZA6T attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

60 ns

Additional Features:

100,000 PROGRAM/ERASE CYCLES

Alternate Memory Width:

8

Boot Block:

BOTTOM/TOP

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

JESD-30 Code:

R-PBGA-B64

JESD-609 Code:

e0

Length:

13 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

16,254

No. of Terminals:

64

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Page Size (words):

8/16

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

8K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Toggle Bit:

YES

Type:

NOR TYPE

Width:

10 mm

Trade Compliance

M29DW128F60ZA6T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20