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M29DW128F60NF6F

STMicroelectronics

M29DW128F60NF6F by STMicroelectronics

M29DW128F60NF6F from STMicroelectronics is a 16-bit NOR Flash memory with a density of 128Mb, operating at 3V. It features an asynchronous mode and supports temperatures from -40 °C to 85 °C, making it ideal for industrial applications. With a fast access time of 60 ns, it's perfect for embedded systems requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,271 parts In-Stock

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3,271

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Digiode

USA . 2,527 parts In-Stock

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2,527

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Anansix

USA . 1,851 parts In-Stock

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1,851

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 64 parts In-Stock

1+ parts

$2.522

100+ parts

-

1k+ parts

$2.270

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64

$2.522

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$2.270

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MKK Technologies

India . 574 parts In-Stock

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$4.742

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574

$4.742

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DigiPath Technology Company

USA . 574 parts In-Stock

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$4.742

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574

$4.742

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Parana Technologies

USA . 1,393 parts In-Stock

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$3.015

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1,393

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$3.015

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Corphita

USA . 1,209 parts In-Stock

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1,209

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Overview

Elevate your projects with the M29DW128F60NF6F from STMicroelectronics, a trusted leader in innovative solutions. This high-quality flash memory combines efficiency and reliability, perfect for industrial applications demanding robust performance under varying temperatures. With its compact design and low power consumption, it ensures seamless integration into your devices while maximizing data storage capabilities. Experience unmatched value with STMicroelectronics—your partner in excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the product's reliability and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for a compact design, making it suitable for a variety of electronic applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, facilitating easier integration into designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enhances performance by allowing faster data access and processing.

Nominal Supply Voltage / Vsup: 3 V

Low nominal supply voltage ensures energy efficiency, making it ideal for battery-powered devices.

Power Supplies (V): 3/3.3

Compatibility with standard power supply voltages increases versatility in application settings.

No. of Terminals: 56

A higher number of terminals supports more versatile and complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The thin profile is beneficial for space-constrained applications, allowing for a compact design.

Alternate Memory Width: 8

Provides efficient data processing capabilities, supporting various data-handling requirements.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where higher temperatures can occur, ensuring reliability under extreme conditions.

Organization: 8Mx16

This organization allows for efficient data structuring, enhancing read and write speeds.

Minimum Operating Temperature: -40 °C

Guaranteed performance in low-temperature environments makes it suitable for harsh industrial applications.

No. of Sectors/Size: 16,254

A high number of sectors provides flexibility in data storage allocation, enhancing memory management.

Terminal Finish: MATTE TIN/TIN BISMUTH

A robust terminal finish ensures durability and improves solderability during assembly.

Terminal Position: DUAL

Dual terminal positioning enhances design flexibility and simplifies PCB layout.

Maximum Seated Height: 1.2 mm

Low seated height supports space-saving designs, ideal for compact electronic devices.

Width: 14 mm

A narrow width allows for efficient layout choices and design integration in various applications.

Minimum Supply Voltage (Vsup): 2.7 V

Ensures compatibility with lower voltage systems, providing flexibility in power source selection.

Page Size (words): 8/16

Supports various data operations, enhancing accessibility and compatibility with diverse systems.

Maximum Time At Peak Reflow Temperature: 40 s

Optimized reflow time increases throughput during manufacturing processes, improving production efficiency.

Peak Reflow Temperature: 260 °C

High reflow temperature tolerance ensures reliability and integrity during PCB assembly processes.

Type: NOR TYPE

NOR type memory enables fast random access, making it suitable for applications requiring rapid data retrieval.

Common Flash Interface: YES

Compatibility with common interfaces simplifies integration into existing systems and enhances user convenience.

Length: 18.4 mm

A compact length contributes to overall space efficiency in electronic designs.

Programming Voltage (V): 3

Standard programming voltage facilitates easier implementation in the design phase.

Temperature Grade: INDUSTRIAL

Industrial grade ensures reliability and performance in demanding environments, making it suitable for robust applications.

Technology: CMOS

CMOS technology allows for lower power consumption, enhancing battery life in portable devices.

Parallel or Serial: PARALLEL

Parallel connection enables faster data transfer rates, boosting overall performance.

Terminal Form: GULL WING

Gull wing terminals simplify soldering processes, promoting better electrical connections.

Sector Size (Words): 8K, 64K

Various sector sizes provide flexibility in memory allocation and enhance data management.

Maximum Supply Current: 20 mA

Relatively low maximum supply current promotes energy efficiency across different applications.

No. of Words: 8,388,608 words

High word count allows for substantial data storage, making it suitable for large applications.

Toggle Bit: YES

Toggle bit feature assists in efficient memory management and data retrieval processes.

Memory Width: 16

A wider memory width improves data throughput and general performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch supports higher density designs, allowing for more efficient PCB layouts.

No. of Words Code: 8M

Providing significant coding capacity ensures compatibility with a range of applications and data needs.

Command User Interface: YES

User-friendly command interface simplifies control and integration into various systems.

Ready or Busy: YES

Features a ready/busy status indicator for efficient data handling and management.

Maximum Supply Voltage (Vsup): 3.6 V

Supports a broad range of voltage inputs, enhancing installation flexibility.

Boot Block: BOTTOM/TOP

Flexible boot block arrangement provides options for various firmware loading strategies.

Memory Density: 134,217,728 bit

High memory density allows for large amounts of data storage in a compact footprint.

Memory IC Type: FLASH

Flash memory characteristics make it ideal for quick data writing and erasing, overall improving performance.

Maximum Standby Current: 0.0001 Amp

Extremely low standby current improves power efficiency and is ideal for battery-operated devices.

Maximum Access Time: 60 ns

Fast access time promotes quick data retrieval, enhancing overall application performance.

Data Polling: YES

Data polling feature ensures efficient data verification and management, boosting reliability.

Technical Specifications

Flash Memory M29DW128F60NF6F attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

60 ns

Additional Features:

100,000 PROGRAM/ERASE CYCLES

Alternate Memory Width:

8

Boot Block:

BOTTOM/TOP

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e3/e6

Length:

18.4 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

16,254

No. of Terminals:

56

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Page Size (words):

8/16

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

8K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN/TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Toggle Bit:

YES

Type:

NOR TYPE

Width:

14 mm

Trade Compliance

M29DW128F60NF6F Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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