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M29DW128F60ZA6

STMicroelectronics

M29DW128F60ZA6 by STMicroelectronics

M29DW128F60ZA6 by STMicroelectronics is a 16-bit NOR Flash memory with a density of 128Mb, operating at 3V. It features asynchronous access with a max speed of 60 ns and supports industrial temp ranges from -40 °C to 85 °C. Ideal for embedded applications requiring reliable data storage.

Median Price

$1.700

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,875 parts In-Stock

1+ parts

$1.700

100+ parts

-

1k+ parts

-

10k+ parts

-

4,875

$1.700

-

-

-

Digiode

USA . 4,170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,170

-

-

-

-

Anansix

USA . 490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

490

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 240 parts In-Stock

1+ parts

$4.057

100+ parts

-

1k+ parts

$3.651

10k+ parts

-

240

$4.057

-

$3.651

-

MKK Technologies

India . 434 parts In-Stock

1+ parts

$7.629

100+ parts

-

1k+ parts

-

10k+ parts

-

434

$7.629

-

-

-

DigiPath Technology Company

USA . 434 parts In-Stock

1+ parts

$7.629

100+ parts

-

1k+ parts

-

10k+ parts

-

434

$7.629

-

-

-

Parana Technologies

USA . 2,063 parts In-Stock

1+ parts

-

100+ parts

$4.851

1k+ parts

-

10k+ parts

-

2,063

-

$4.851

-

-

Corphita

USA . 604 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

604

-

-

-

-

Overview

Unlock the power of reliable performance with the M29DW128F60ZA6 from STMicroelectronics—a leader in cutting-edge flash memory solutions. Designed for industrial applications, this versatile NOR flash memory combines robust quality with energy efficiency, ensuring high-speed data access and durability across temperature extremes. Elevate your systems with advanced features that promise exceptional value and seamless integration, empowering you to innovate with confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection against environmental factors, contributing to the longevity and reliability of the flash memory.

Surface Mount: YES

The surface mount capability allows for a compact design, making it suitable for a wide range of space-constrained applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes board space usage and facilitates easy integration into various electronic devices.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for faster data transfer rates, enhancing overall system performance.

Nominal Supply Voltage / Vsup: 3 V

The low nominal supply voltage increases compatibility with a wide range of devices while minimizing power consumption.

Power Supplies (V): 3/3.3 V

Supports dual voltage levels, ensuring flexibility and adaptability in various applications.

No. of Terminals: 64

The 64 terminals provide ample connectivity options, facilitating efficient communication with the host system.

Package Style (Meter): GRID ARRAY, THIN PROFILE

The thin profile grid array design allows for effective heat dissipation and is suitable for high-density mounting applications.

Alternate Memory Width: 8

The 8-bit memory width supports both standard and enhanced applications, catering to diverse performance needs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in demanding environments, making it ideal for industrial applications.

Organization: 8MX16

This organization provides a structured memory layout, optimizing data retrieval and storage efficiency.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature guarantees functionality in extreme cold conditions, suitable for outdoor or harsh environments.

No. of Sectors/Size: 16,254

A large number of sectors allows for efficient data management and partitioning, aiding in system performance and organization.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides excellent solderability and reliability, ensuring a robust connection within electronic circuits.

Terminal Position: BOTTOM

Bottom terminal positioning results in easier placement and improved thermal management in assembly processes.

Maximum Seated Height: 1.2 mm

The low profile design helps maintain compact device heights, ideal for modern electronic designs.

Width: 10 mm

A manageable width facilitates integration in various compact designs without compromising on performance.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum voltage requirement allows for greater energy efficiency, making it suitable for battery-operated devices.

Page Size (words): 8/16

Varied page sizes support diverse application needs, enhancing the flexibility and performance of data processing.

Type: NOR TYPE

NOR type flash memory allows for read, erase, and write operations at the byte level, providing more efficient access to data.

Common Flash Interface: YES

Compatibility with common flash interfaces simplifies integration into existing systems and enhances usability.

Length: 13 mm

The compact length is ideal for space-limited applications, improving the overall design efficiency.

Programming Voltage (V): 3 V

The moderate programming voltage enables faster programming cycles, improving overall data handling efficiency.

Temperature Grade: INDUSTRIAL

Industrial-grade specifications guarantee enhanced performance in extreme temperatures and conditions, ideal for critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, ensuring sustained performance in various applications.

Parallel or Serial: PARALLEL

Parallel data access increases throughput and reduces latency, making it suitable for high-speed data operations.

Terminal Form: BALL

Ball form terminals ensure reliable connections and facilitate automated assembly processes.

Sector Size (Words): 8K, 64K

Flexible sector sizing allows for optimal data allocation, enhancing performance for various applications.

Maximum Supply Current: 20 mA

The manageable supply current allows for efficient power usage, making this product suitable for energy-sensitive applications.

No. of Words: 8388608 words

A large memory capacity facilitates extensive data storage, ideal for applications requiring significant information retention.

Toggle Bit: YES

Toggle bit functionality simplifies error correction and data verification processes, improving data integrity.

Memory Width: 16

A 16-bit memory width allows for efficient data processing and enhances system performance in data-intensive tasks.

Terminal Pitch: 1 mm

The 1 mm terminal pitch helps in high-density designs while maintaining reliable signal integrity.

No. of Words Code: 8M

The 8M words code denotes high performance in terms of storage, making it suitable for advanced applications.

Command User Interface: YES

The presence of a command user interface simplifies the interaction with the memory component, enhancing ease of use.

Ready or Busy: YES

This feature provides informative status signals that can optimize data processing workflows and prevent data loss.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage ensures safe operation within prescribed limits, adding to the product's reliability.

Boot Block: BOTTOM/TOP

Configurable boot blocks enhance the versatility of the memory, making it adaptable to various programming needs.

Memory Density: 134217728 bit

The high memory density supports extensive data storage in a compact form factor, enhancing functionality without increasing space.

Memory IC Type: FLASH

Flash memory technology is ideal for data retention without power, making it well-suited for a multitude of applications.

Maximum Standby Current: 0.0001 Amp

Minimal standby current consumption enhances energy efficiency, prolonging battery life in portable applications.

Maximum Access Time: 60 ns

Fast access time increases responsiveness and performance in read and write operations, ideal for high-speed applications.

Data Polling: YES

Data polling capability allows for enhanced reliability in data management, ensuring efficient error handling and data integrity.

Technical Specifications

Flash Memory M29DW128F60ZA6 attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

60 ns

Additional Features:

100,000 PROGRAM/ERASE CYCLES

Alternate Memory Width:

8

Boot Block:

BOTTOM/TOP

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

JESD-30 Code:

R-PBGA-B64

JESD-609 Code:

e0

Length:

13 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

16,254

No. of Terminals:

64

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Page Size (words):

8/16

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

8K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Toggle Bit:

YES

Type:

NOR TYPE

Width:

10 mm

Trade Compliance

M29DW128F60ZA6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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