Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M29DW128F60ZA6F from STMicroelectronics is a 16-bit NOR Flash memory with a density of 128Mb, operating at 3V. It features asynchronous access with a max time of 60ns and supports industrial-grade temperatures from -40 °C to 85 °C. Ideal for embedded applications, it offers reliable data storage in compact designs.
Median Price
-
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Vyrian
1+ parts
100+ parts
1k+ parts
10k+ parts
Digiode
Anansix
IDEA Electronic Components Group
$2.881
$2.593
MKK Technologies
$5.418
DigiPath Technology Company
Corphita
Parana Technologies
$3.445
The robust plastic/epoxy body material provides excellent protection against environmental factors, making it suitable for various industrial applications.
Surface mount technology allows for efficient use of space on printed circuit boards, which is essential for modern compact electronic designs.
The rectangular package shape offers a standardized footprint that aids in easy integration into existing layouts.
Asynchronous operation allows for faster data access without needing synchronized signals, improving performance in applications requiring quick read/write cycles.
A nominal voltage of 3V is convenient for compatibility with various systems while ensuring efficient power consumption.
Dual power supply options enhance flexibility for use in different systems, allowing for easier adaptation and reduced complexity.
With 64 terminals, this chip can support complex data connections, ensuring high data throughput and improved performance.
The thin profile grid array design enables space-saving implementations while maintaining effective thermal performance.
An alternate memory width of 8 bits offers flexibility in data handling, catering to various application requirements.
Operating at high temperatures up to 85 °C ensures reliability in demanding environments, useful for industrial applications.
This organization format provides efficient data arrangements, optimizing performance and allowing for easy memory access.
The capability to operate at -40 °C ensures functionality in extreme conditions, making it suitable for harsh environments.
An ample number of sectors allows for flexible memory management and segmentation, making it efficient for various applications.
Bottom terminal positioning is advantageous for device layouts, enabling optimal connectivity and space efficiency.
A low seated height allows for compact design options, making it ideal for modern electronics where space is a premium.
A width of 10 mm ensures that the component can easily fit within standard PCB designs.
A lower voltage threshold of 2.7V ensures compatibility with a wider range of applications and power systems.
Flexible page sizes help optimize read and write operations based on application requirements, enhancing overall performance.
The ability to withstand a maximum of 40 seconds at peak reflow temperature ensures reliability during soldering processes.
A peak reflow temperature of 260 °C confirms compatibility with lead-free soldering processes, supporting modern manufacturing regulations.
NOR flash memory allows for fast read operations and efficient random access, making it ideal for code storage applications.
A common flash interface provides compatibility with a wide range of systems, facilitating easier integration.
A length of 13 mm allows for versatile placement on PCBs, ensuring it fits well within varying design constraints.
A programming voltage of 3V offers a balance of performance and efficiency, reducing power consumption during write operations.
Industrial grade specifications ensure that the memory device is designed for reliability under challenging conditions.
CMOS technology supports low power consumption and high-speed operation, optimizing performance in battery-powered devices.
Parallel access enables faster data transfer rates, improving performance for applications demanding high throughput.
Ball terminals facilitate effective thermal management and seamless integration with PCB designs.
Diverse sector sizes allow for optimized memory allocations based on varying application needs, enhancing efficiency.
A maximum supply current of 20 mA allows for efficient power management, contributing to longer device lifespans.
With a substantial word count of over 8 million, this flash memory provides ample storage for large data requirements.
The toggle bit feature streamlines error detection, enhancing data integrity and reliability during operation.
A memory width of 16 bits allows for efficient data handling, optimizing operations in 16-bit architectures.
A 1 mm terminal pitch ensures compatibility with standard PCB designs while allowing for high-density packaging.
An 8M words code enhances data storage capacity, making it suitable for applications that require significant memory.
A command user interface simplifies memory management, making it user-friendly for developers.
The ready/busy signal provides real-time status updates, improving control and efficiency during data operations.
A maximum supply voltage of 3.6V ensures stability and flexibility for various applications while maintaining high performance.
Flexible boot block positioning allows for versatile application development, accommodating different initialization requirements.
Having a memory density of 134,217,728 bits ensures substantial data storage, making it ideal for data-intensive applications.
As a flash memory IC, it offers non-volatile data storage, retaining information even without power.
Extremely low standby current optimizes power efficiency, extending battery life in portable devices.
With a maximum access time of 60 ns, this flash memory provides quick data retrieval, essential for performance-centric applications.
Data polling capability enhances operational efficiency by allowing developers to check memory status without delay.
Flash Memory M29DW128F60ZA6F attributes and parameters. Explore more Flash Memory devices from STMicroelectronics
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M29DW128F60ZA6F Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
BAV99
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Bourns
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
1N4148
Itt Components
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .15 A;
Multicomp Pro
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M24308/2-1F
Positronic Industries
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Body or Shell Style: RECEPTACLE;
ATMEGA328P-AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
New Jersey Semiconductor Products
2N2222A
M/a-com Technology Solutions
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Terminal Position: BOTTOM; Package Style (Meter): CYLINDRICAL;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
Cheng-yi Electronic
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
Taiwan Semiconductor
1N4148WS
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
LM358N
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
OPA2277UA/2K5
Texas Instruments
OPA2277UA/2K5 by Texas Instruments is a dual operational amplifier with low offset voltage of 100 uV and micropower consumption of 0.004 uA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1 MHz. With a compact rectangular package style, it is suitable for surface mount designs in various electronic systems.
Diodes Incorporated
W25Q80DVUXIETR
Winbond Electronics
W25Q80DVUXIETR by Winbond Electronics is a 1MX8 NOR flash memory with SPI serial bus, operating at up to 104 MHz. It has a supply voltage range of 2.7V to 3.6V and offers 100000 write/erase cycles endurance. Ideal for industrial applications requiring high-speed data storage in compact devices.
S25FL512SAGMFI011
Spansion
Spansion's S25FL512SAGMFI011 is a NOR flash memory with 128MX4 organization, operating at 3V and up to 133MHz clock frequency. It is commonly used in industrial applications for its endurance of 100k write/erase cycles and serial bus type SPI.
SST25VF040B-50-4I-SAF-T
Microchip Technology
SST25VF040B-50-4I-SAF-T by Microchip: NOR Flash Memory, 50MHz Clock, SPI Interface. Ideal for industrial applications with -40 to 85°C temp range. Offers 4Mbit memory density and 100K Write/Erase cycles.
S25FS512SAGBHI210
Infineon Technologies
The Infineon Technologies S25FS512SAGBHI210 is a NOR type flash memory with 64Mx8 organization, operating at 133MHz. It features hardware/software write protection and offers 100000 write/erase cycles endurance. Ideal for industrial applications requiring high-speed synchronous operation in a compact grid array package.
BMXRMS008MP
Schneider Electric Sa
FLASH CARD;
EMMC04G-M627-X03U
Kingston Technology Company
Kingston's EMMC04G-M627-X03U is a 4GX8 MLC NAND flash memory with 3.3V programming voltage and 200 MHz clock frequency. With a package style of GRID ARRAY, it operates in synchronous mode at temperatures ranging from -25 to 85 °C, making it ideal for high-speed data storage applications.
MTFC4GACAJCN-4MIT
Micron Technology
MTFC4GACAJCN-4MIT by Micron Technology is a 4GX8 MLC NAND flash memory with 34359738368 bit density. Operating at -40 to 85 °C, it has a clock frequency of 52 MHz and supports parallel interface. Ideal for industrial applications requiring high-speed data storage in compact devices.
SDINBDG4-8G-ZA
Western Digital
SDINBDG4-8G-ZA by Western Digital is a 8GX8 MLC NAND flash memory with 68719476736 bit density. It operates in industrial temperature range (-40 to 105 °C) and uses synchronous mode at 3.3V supply voltage. Ideal for applications requiring high-speed, reliable data storage in compact devices.
S29GL064S70BHI040
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: VFBGA; Package Shape: RECTANGULAR; Organization: 4MX16;
SST25VF080B-50-4C-S2AF
SST25VF080B-50-4C-S2AF by Microchip: NOR Flash Memory, 8Mx1 organization, SPI serial bus type. Operating at 3/3.3V with 50MHz clock frequency. Ideal for hardware/software write protection in commercial-grade applications.
S29JL032J70TFI020
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
S25FL512SAGBHIA10
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Length: 8 mm;
W25Q64JVSSIM
W25Q64JVSSIM by Winbond Electronics is a 8MX8 NOR type flash memory with 133 MHz clock frequency. Operating at 3.3V, it offers 100000 Write/Erase cycles and SPI serial bus interface. Ideal for industrial applications requiring high endurance and fast data transfer speeds.
SST25VF016B-50-4I-QAF-T
SST25VF016B-50-4I-QAF-T by Microchip: NOR flash memory with 16Mx1 organization, 50MHz clock frequency, SPI serial bus. Ideal for industrial applications requiring high endurance and low standby current.
S25FL128SAGNFI010
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Programming Voltage (V): 3;
MT25QL256ABA8ESF-0SIT
Micron Technology's MT25QL256ABA8ESF-0SIT is a 256Mbit Flash Memory with synchronous operation at up to 133MHz clock frequency. It has a small outline package, operates in industrial temperature range (-40 to 85 °C), and is suitable for applications requiring high-speed data storage and retrieval.
S25FL256SAGMFIR00
The Infineon Technologies S25FL256SAGMFIR00 is a NOR type flash memory with 64Mx4 organization, 133 MHz clock frequency, and SPI serial bus. It operates at -40 to 85 °C with 100000 write/erase cycles endurance. Ideal for industrial applications requiring high-speed synchronous operation in compact designs.
SST39VF6401B-70-4I-EKE
SST39VF6401B-70-4I-EKE by Microchip Technology is a 3V NOR flash memory with 4Mx16 organization, operating at -40 to 85°C. It offers 2K sectors, 100k write/erase cycles endurance, and supports common flash interface. Ideal for industrial applications requiring fast access time of 70ns and low standby current of 0.00002A.
SDCIT2/8GBSP
Kingston's SDCIT2/8GBSP is a rectangular flash memory chip with 8GX8 organization, SLC NAND type, and 3.3V programming voltage. Ideal for applications requiring high endurance with 30K write/erase cycles and a memory density of 68719476736 bits.
SST25VF016B-50-4I-S2AF-T
SST25VF016B-50-4I-S2AF-T by Microchip: 16MX1 NOR Flash Memory, SPI Serial Bus, 50 MHz Clock Frequency. Ideal for industrial applications requiring high endurance and low standby current.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M29DW128F60NF6E
STMicroelectronics
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Maximum Access Time: 60 ns;
M29DW128F60NF1E
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Terminal Pitch: .5 mm;
M29DW128F60ZA1T
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Boot Block: BOTTOM/TOP;
M29DW128F60NF6
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Length: 18.4 mm;
M29DW128F60NF1F
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Memory Density: 134217728 bit;
M29DW128F60ZA6E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Sector Size (Words): 8K,64K;
M29DW128F60ZA1F
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
M29DW128F70NF1E
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
M29DW128F60NF6T
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
M29DW128F60ZA1
M29DW128F60NF1
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
M29DW128F60ZA6T
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
M29DW128F60ZA6
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Pitch: 1 mm;
M29DW128F70NF1
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Qualification: Not Qualified;
M29DW128F70NF1T
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Additional Features: 100,000 PROGRAM/ERASE CYCLES;
M29DW128F70NF1F
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;
M29DW128F60ZA1E
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Sectors/Size: 16,254;
M29DW128F60NF6F
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Qualification: Not Qualified;
M29DW128F60NF1T
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE;
Numonyx
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Alternate Memory Width: 8;
Supply Digital Components
$106.00
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Total price ≈ $80,197.29
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