Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M29DW128F60NF1E from STMicroelectronics is a 16-bit NOR Flash memory with a density of 128Mb, operating at 3V. It features asynchronous access with a max time of 60ns and supports parallel interface, ideal for embedded applications. Its compact SOIC package ensures efficient space utilization in designs.
Median Price
-
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Digiode
1+ parts
100+ parts
1k+ parts
10k+ parts
Vyrian
Anansix
IDEA Electronic Components Group
$4.830
$4.347
MKK Technologies
$9.082
DigiPath Technology Company
Corphita
Parana Technologies
$5.775
The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for various applications.
Surface mount capability allows for efficient space-saving designs and automated manufacturing processes.
Rectangular package shapes contribute to a compact layout and easy integration into circuit boards.
Asynchronous operation provides faster read access times, enhancing overall system performance.
A nominal supply voltage of 3V ensures compatibility with a wide range of devices while maintaining energy efficiency.
Supports both 3V and 3.3V, making it versatile for different electronic applications.
A higher number of terminals allows for more complex interconnections and improved functionality.
The small outline, thin-profile design is perfect for space-constrained applications without sacrificing performance.
An 8-bit memory width contributes to efficient data handling, suitable for various application requirements.
With a maximum operating temperature of 70 °C, the flash memory can function effectively in moderate operating conditions.
The 8MX16 organization provides a balanced architecture for data storage and accessibility, optimizing performance.
Operational down to 0 °C ensures usability in a variety of environments, including cooler climates.
A large number of sectors enables efficient data management and organization, essential for complex applications.
The terminal finish enhances solderability and ensures a reliable electrical connection for improved longevity.
Dual terminal positioning enhances connectivity options, making integration into PCBs easier.
A low seated height of 1.2 mm contributes to a compact design, facilitating the use of this memory in miniaturized applications.
A width of 14 mm allows for efficient space utilization on the circuit board.
A minimum supply voltage of 2.7V ensures flexibility in power supply options, accommodating a wide range of devices.
A choice of page sizes enhances flexibility in data writing and reading operations, catering to various application needs.
Supporting a maximum reflow time of 40 seconds ensures compatibility with commonly used soldering processes.
Capable of withstanding high reflow temperatures of up to 260 °C ensures reliability during mounting processes.
As a NOR type flash memory, it offers fast random access for read operations, ideal for executing code in place.
Support for a common flash interface makes integration straightforward and facilitates compatibility with multiple devices.
A length of 18.4 mm optimizes space efficiency on the PCB while still delivering robust functionality.
The programming voltage of 3V allows for ease of integration into low-voltage systems.
Being rated for commercial temperature ranges makes this product suitable for a variety of everyday applications.
CMOS technology ensures low power consumption and high density, contributing to efficient performance.
Parallel access allows for faster data transfer rates, ideal for applications requiring high-speed data retrieval.
Gull wing terminals provide excellent surface mountability and ease of soldering.
Configurable sector sizes of 8K and 64K make it adaptable to various data storage requirements.
A maximum supply current of 20 mA keeps power requirements low, making it efficient for battery-operated devices.
With a capacity of 8,388,608 words, this flash memory provides ample storage for a wide range of applications.
Support for a toggle bit mechanism enhances the efficiency of read and write operations.
A memory width of 16 indicates a broader data path, allowing for faster data transfers.
A terminal pitch of 0.5 mm facilitates densely packed designs while maintaining electrical integrity.
With an 8M word code, this memory is suitable for larger applications needing significant storage capabilities.
A command user interface simplifies the programming and control of the flash memory.
Indication of ready or busy status helps in managing data operations more efficiently.
Supports a maximum supply voltage of 3.6V, ensuring stability and performance under various conditions.
Configurable boot block supports various architectures for initializing programs effectively.
With a memory density of 134,217,728 bits, this flash memory can store large files and data sets.
As a flash memory IC, it provides non-volatile storage, retaining data even in the absence of power.
A maximum standby current of only 0.0001 A contributes to energy efficiency, ideal for power-sensitive applications.
A maximum access time of 60 ns ensures rapid data retrieval, enhancing performance in applications that require quick access.
Data polling capability allows for efficient monitoring of data processing states, providing reliability during operations.
Flash Memory M29DW128F60NF1E attributes and parameters. Explore more Flash Memory devices from STMicroelectronics
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M29DW128F60NF1E Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
1N4148WS
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBR0540T1G
Onsemi
MBR0540T1G by Onsemi is a Schottky rectifier diode with max. forward voltage of 0.62V and max. output current of 0.5A, ideal for applications requiring high efficiency power conversion in small outline packages. Operating temp range: -55 to 150°C, with peak reflow temp at 260°C, making it suitable for various electronic devices needing reliable rectification performance in compact designs.
CRG0805F10K
TE Connectivity
TE Connectivity's CRG0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in various electronic circuits due to its compact size and high temperature rating.
LM317T
Bay Linear
Other Regulators; No. of Terminals: 3; No. of Outputs: 1; Surface Mount: NO; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel;
DS18B20U
Maxim Integrated
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
NDT2955
National Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Weitron Technology
LM107H
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
M39029/58-360
Defense Logistics Agency
CONNECTOR ACCESSORY; Contact Type: CRIMP REAR RELEASE; Mating Contacts: M39029/56-348, M39029/57-354; Insertion Tool Sources: MILITARY; Contact Gender: MALE; Alternate Contact Sources: MILITARY;
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
BAV99
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM2931AZ-5.0RPG
LM2931AZ-5.0RPG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V nominal output voltage and 0.1A max output current. It features a low dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature range from -40 to 125°C. The package style is cylindrical with matte tin terminal finish, ideal for various electronic devices needing precise voltage regulation.
LM7805CT
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
LM555CN
Intersil
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Diodes Incorporated
1N4148WT
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBT3904LT1G
MMBT3904LT1G by Onsemi is a NPN BJT with max. collector-emitter voltage of 40V, hFE of 30, and fT of 300MHz. Ideal for small signal applications in electronics due to its compact size, high transition frequency, and low power dissipation capabilities.
SST25VF512A-33-4C-SAE
Microchip Technology
SST25VF512A-33-4C-SAE by Microchip Technology is a 512Kx1 NOR type Flash Memory with SPI serial bus, operating at 33MHz. It has 100000 write/erase cycles endurance and operates on 3.3V supply voltage. Ideal for applications requiring high-speed data transfer and low power consumption in commercial temperature grade environments.
AM29F010B-70JF
Advanced Micro Devices
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; No. of Words: 131072 words;
NAND128W3A2BN6E
Micron Technology
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Length: 18.4 mm;
S25FS512SAGBHI210
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
IS21ES08G-JCLI-TR
Integrated Silicon Solution
IS21ES08G-JCLI-TR by Integrated Silicon Solution is an 8GX8 flash memory with 68719476736 bit density. Operating at 3.3V, it features a very thin profile grid array package and operates in industrial temperature range (-40 to 85 °C). Ideal for applications requiring high-speed synchronous flash memory with parallel interface.
MT25QU256ABA8E12-1SIT
Micron Technology's MT25QU256ABA8E12-1SIT is a 256MX1 flash memory IC with 268M words capacity. Operating at 166 MHz, it has a thin profile grid array package suitable for industrial applications. With synchronous operation and serial interface, this CMOS technology chip operates b/w -40 to 85 °C, making it ideal for high-speed data storage needs.
SST39VF1681-70-4C-EKE
Silicon Storage Technology
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 40;
W25Q64JVSSIM
Winbond Electronics
W25Q64JVSSIM by Winbond Electronics is a 8MX8 NOR type flash memory with 133 MHz clock frequency. Operating at 3.3V, it offers 100000 Write/Erase cycles and SPI serial bus interface. Ideal for industrial applications requiring high endurance and fast data transfer speeds.
AT45DB161E-SSHD-B
Dialog Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words Code: 16M;
W25Q16JVZPIQTR
W25Q16JVZPIQTR by Winbond Electronics is a NOR type Flash Memory with 2Mx8 organization, operating at 133MHz clock frequency. It features 100000 Write/Erase cycles endurance and SPI serial bus type, suitable for applications requiring high-speed data storage in compact devices.
MT29F2G08ABAEAH4-IT:E
MT29F2G08ABAEAH4-IT:E by Micron Technology is a 256MX8 SLC NAND flash memory with a capacity of 2GB. It operates at a voltage of 3.3V and has an industrial temperature grade. This flash memory is suitable for applications that require high-speed data storage and retrieval in harsh environments.
AT45DB641E-MHN2B-T
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; No. of Words Code: 64M;
W25Q128FVSIG
W25Q128FVSIG by Winbond Electronics is a NOR flash memory with 128Mx1 organization, SPI serial bus type, and 104 MHz clock frequency. It operates at temperatures ranging from -40 to 85°C and has a max supply voltage of 3.6V. Ideal for industrial applications requiring high endurance with 100000 write/erase cycles.
THGBMNG5D1LBAIT
Kioxia Holdings
FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; No. of Functions: 1;
SST25VF016B-50-4I-S2AF-T
SST25VF016B-50-4I-S2AF-T by Microchip: 16MX1 NOR Flash Memory, SPI Serial Bus, 50 MHz Clock Frequency. Ideal for industrial applications requiring high endurance and low standby current.
M25P40-VMN6TPB
Numonyx
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
S25FL128LAGMFI010
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE; Type: NOR TYPE;
MT25QU01GBBB1EW9-0SIT
Micron Technology's MT25QU01GBBB1EW9-0SIT is a 1Gx1 Flash Memory IC with 1073741824-bit memory density. Operating at 166MHz clock frequency, it has a small outline package style and operates in industrial temperature grade applications. The memory chip features synchronous operation, serial interface, and low power consumption at 1.8V supply voltage.
SDINBDG4-8G-I2
Western Digital
SDINBDG4-8G-I2 by Western Digital is a Flash Memory with 8GX8 organization, MLC NAND type, and 3000 Write/Erase Cycles endurance. It has a memory density of 68719476736 bit and operates b/w -25 to 85 °C. Ideal for applications requiring high-density storage in compact devices.
S25FL256SAGMFIR01
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Type: NOR TYPE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M29DW128F60NF6E
STMicroelectronics
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Maximum Access Time: 60 ns;
M29DW128F60ZA1T
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Boot Block: BOTTOM/TOP;
M29DW128F60NF6
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Length: 18.4 mm;
M29DW128F60NF1F
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Memory Density: 134217728 bit;
M29DW128F60ZA6E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Sector Size (Words): 8K,64K;
M29DW128F60ZA1F
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
M29DW128F70NF1E
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
M29DW128F60NF6T
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
M29DW128F60ZA1
M29DW128F60ZA6F
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Ready or Busy: YES;
M29DW128F60NF1
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
M29DW128F60ZA6T
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
M29DW128F60ZA6
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Pitch: 1 mm;
M29DW128F70NF1
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Qualification: Not Qualified;
M29DW128F70NF1T
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Additional Features: 100,000 PROGRAM/ERASE CYCLES;
M29DW128F70NF1F
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;
M29DW128F60ZA1E
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Sectors/Size: 16,254;
M29DW128F60NF6F
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Qualification: Not Qualified;
M29DW128F60NF1T
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE;
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Sectors/Size: 16,254;
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