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MT25QU256ABA8E12-1SIT

Micron Technology

MT25QU256ABA8E12-1SIT by Micron Technology

Micron Technology's MT25QU256ABA8E12-1SIT is a 256MX1 flash memory IC with 268M words capacity. Operating at 166 MHz, it has a thin profile grid array package suitable for industrial applications. With synchronous operation and serial interface, this CMOS technology chip operates b/w -40 to 85 °C, making it ideal for high-speed data storage needs.

Median Price

$4.940

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,746 parts In-Stock

1+ parts

$4.220

100+ parts

$3.650

1k+ parts

$3.440

10k+ parts

$3.410

3,746

$4.220

$3.650

$3.440

$3.410

Arrow

USA . 1,022 parts In-Stock

1+ parts

$4.510

100+ parts

-

1k+ parts

-

10k+ parts

-

1,022

$4.510

-

-

-

Farnell

UK . 304 parts In-Stock

1+ parts

$5.370

100+ parts

$3.800

1k+ parts

$3.650

10k+ parts

-

304

$5.370

$3.800

$3.650

-

Element14

Singapore . 304 parts In-Stock

1+ parts

$8.750

100+ parts

$6.950

1k+ parts

$6.390

10k+ parts

-

304

$8.750

$6.950

$6.390

-

DigiKey

USA . 1,032 parts In-Stock

1+ parts

$9.740

100+ parts

$8.364

1k+ parts

$7.889

10k+ parts

$7.657

1,032

$9.740

$8.364

$7.889

$7.657

Newark

USA . 1,122 parts In-Stock

1+ parts

$10.000

100+ parts

-

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-

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-

1,122

$10.000

-

-

-

Verical

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.385

30,000

-

-

-

$4.385

Future Electronics

Canada . 3,366 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.280

10k+ parts

-

3,366

-

-

$2.280

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 140 parts In-Stock

1+ parts

$2.802

100+ parts

-

1k+ parts

-

10k+ parts

-

140

$2.802

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$7.813

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$7.813

-

-

-

Chip Stock

USA . 6,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,500

-

-

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Cyclops Electronics Ltd

UK . 5,946 parts In-Stock

1+ parts

-

100+ parts

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5,946

-

-

-

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BCID Electronics Ltd.

Israel . 3,210 parts In-Stock

1+ parts

-

100+ parts

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3,210

-

-

-

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Vyrian

USA . 1,251 parts In-Stock

1+ parts

-

100+ parts

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1,251

-

-

-

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ComSIT Distribution GmbH

Germany . 154 parts In-Stock

1+ parts

-

100+ parts

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154

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,782 parts In-Stock

1+ parts

$2.170

100+ parts

-

1k+ parts

-

10k+ parts

-

1,782

$2.170

-

-

-

Semicontronic

India . 1,238 parts In-Stock

1+ parts

$2.170

100+ parts

$2.116

1k+ parts

$2.105

10k+ parts

-

1,238

$2.170

$2.116

$2.105

-

Corphita

USA . 2,312 parts In-Stock

1+ parts

$2.655

100+ parts

-

1k+ parts

-

10k+ parts

-

2,312

$2.655

-

-

-

Corohmni

South Africa . 986 parts In-Stock

1+ parts

$3.027

100+ parts

-

1k+ parts

-

10k+ parts

-

986

$3.027

-

-

-

Continental Prestige Electronics

USA . 1,122 parts In-Stock

1+ parts

$4.860

100+ parts

-

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-

10k+ parts

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1,122

$4.860

-

-

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Aztec Data Supply Inc.

USA . 2,580 parts In-Stock

1+ parts

$4.890

100+ parts

-

1k+ parts

-

10k+ parts

-

2,580

$4.890

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$5.956

100+ parts

$5.659

1k+ parts

$5.659

10k+ parts

-

5,000

$5.956

$5.659

$5.659

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$7.813

100+ parts

$7.657

1k+ parts

-

10k+ parts

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2,000

$7.813

$7.657

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RC Electronics

USA . 9,253 parts In-Stock

1+ parts

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9,253

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Legend Electronics Inc. (Excess)

USA . 2,872 parts In-Stock

1+ parts

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2,872

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A-Z Elektronik GmbH

Germany . 2,500 parts In-Stock

1+ parts

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2,500

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-

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Speed Components Ltd (Excess)

Israel . 1,320 parts In-Stock

1+ parts

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1,320

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-

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Kepictronics

USA . 1,000 parts In-Stock

1+ parts

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1,000

-

-

-

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Argo Parts USA

USA . 841 parts In-Stock

1+ parts

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841

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GreenTree Electronics

Israel . 787 parts In-Stock

1+ parts

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787

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-

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Robosynatics

Brazil . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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100

-

-

-

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Lucentia Tech

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$1.634

1k+ parts

$1.634

10k+ parts

$1.634

100

-

$1.634

$1.634

$1.634

Overview

Discover the cutting-edge MT25QU256ABA8E12-1SIT by Micron Technology, a top-of-the-line flash memory with unparalleled quality and reliability. From industrial-grade technology to its innovative design, this product offers seamless integration and superior performance in various applications. Experience lightning-fast data transfer speeds and enhanced storage capabilities without compromising on durability. Elevate your projects with the unmatched value and benefits of Micron's flash memory solutions. Upgrade to the future of memory storage today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the flash memory, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and secure installation on a circuit board, saving space and simplifying assembly.

Operating Mode: SYNCHRONOUS

Enables efficient and synchronous data transfer, enhancing overall performance.

Nominal Supply Voltage: 1.8V

Optimal voltage for stable and reliable operation of the flash memory.

Maximum Clock Frequency: 166 MHz

High clock frequency allows for fast data processing and access speeds.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with a wide operating temperature range, ensuring reliability in various environments.

Organization: 256MX1

Efficient organization of memory cells, maximizing storage capacity and performance.

Memory Density: 268435456 bit

High memory density allows for storing a large amount of data in a compact form factor.

Technical Specifications

Flash Memory MT25QU256ABA8E12-1SIT attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Maximum Clock Frequency (fCLK):

166 MHz

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

24

No. of Words:

268435456 words

No. of Words Code:

256M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Programming Voltage (V):

1.8

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Trade Compliance

MT25QU256ABA8E12-1SIT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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