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M25P64-VME6G

STMicroelectronics

M25P64-VME6G by STMicroelectronics

STMicroelectronics M25P64-VME6G is a NOR flash memory with 8Mx8 organization, SPI serial bus type, and 50 MHz clock frequency. It operates at -40 to 85 °C, supports 100000 write/erase cycles, and has a small outline package for industrial applications.

Median Price

$8.918

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 2 parts In-Stock

1+ parts

$2.457

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2

$2.457

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Component Electronics Inc.

Canada . 36 parts In-Stock

1+ parts

$15.380

100+ parts

$11.540

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$10.000

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36

$15.380

$11.540

$10.000

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Chip Stock

USA . 13,600 parts In-Stock

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Digiode

USA . 5,739 parts In-Stock

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5,739

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Anansix

USA . 1,537 parts In-Stock

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Vyrian

USA . 1,478 parts In-Stock

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1,478

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Bas Electronics GmbH & Co. KG

Germany . 419 parts In-Stock

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ComSIT Distribution GmbH

Germany . 154 parts In-Stock

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Greenchips

USA . 87 parts In-Stock

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87

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SIE Connect GmbH - GreenChips

Germany . 87 parts In-Stock

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87

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Prism Electronics

USA . 72 parts In-Stock

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72

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Legend Electronics Inc.

USA . 55 parts In-Stock

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55

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Sensible Micro Corp

USA . 47 parts In-Stock

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Nova Conductors

Japan . 39 parts In-Stock

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Odi Ramu Company

Canada . 20 parts In-Stock

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20

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Bristol Electronics

USA . 19 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 3,005 parts In-Stock

1+ parts

$2.130

100+ parts

-

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3,005

$2.130

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Component Stockers USA

USA . 644 parts In-Stock

1+ parts

$3.880

100+ parts

$3.690

1k+ parts

$3.570

10k+ parts

-

644

$3.880

$3.690

$3.570

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Corohmni

South Africa . 241 parts In-Stock

1+ parts

$4.013

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241

$4.013

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IDEA Electronic Components Group

UK . 1,192 parts In-Stock

1+ parts

$4.861

100+ parts

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$4.375

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1,192

$4.861

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$4.375

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Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$5.629

100+ parts

$5.348

1k+ parts

$5.348

10k+ parts

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150

$5.629

$5.348

$5.348

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MKK Technologies

India . 1,034 parts In-Stock

1+ parts

$9.141

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1,034

$9.141

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DigiPath Technology Company

USA . 1,034 parts In-Stock

1+ parts

$9.141

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1,034

$9.141

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AZTECH Wire

Italy . 731 parts In-Stock

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$13.390

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731

$13.390

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Semicontronic

India . 960 parts In-Stock

1+ parts

$20.000

100+ parts

$19.500

1k+ parts

$19.400

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960

$20.000

$19.500

$19.400

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Continental Prestige Electronics

USA . 6,333 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,082 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,388 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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Kepictronics

USA . 2,080 parts In-Stock

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2,080

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Argo Parts USA

USA . 1,691 parts In-Stock

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Corphita

USA . 1,314 parts In-Stock

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1,314

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Parana Technologies

USA . 686 parts In-Stock

1+ parts

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$5.812

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686

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$5.812

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EMSNET (Excess)

USA . 98 parts In-Stock

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98

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Legend Electronics Inc. (Excess)

USA . 45 parts In-Stock

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45

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Speed Components Ltd (Excess)

Israel . 45 parts In-Stock

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45

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Computer Components Inc. - USA

USA . 18 parts In-Stock

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18

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Perfect Parts

USA . 16 parts In-Stock

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16

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Overview

Unlock endless possibilities with the M25P64-VME6G by STMicroelectronics. As a leader in the industry, STMicroelectronics delivers top-notch quality and reliability in their flash memory products. Ideal for industrial applications, this compact, high-performance memory chip offers fast synchronous operation and a wide temperature range. With features like hardware/software write protection and 100,000 write/erase cycles endurance, customers can trust in the long-lasting value and benefits that this product provides. Elevate your projects with the M25P64-VME6G and experience seamless performance like never before.

Feature Benefit Bullets

Surface Mount YES

This feature allows for easy installation on a circuit board, saving space and simplifying integration into electronic devices.

Package Shape RECTANGULAR

The rectangular shape of the package makes it compatible with standard PCB layouts, facilitating manufacturing and assembly processes.

Operating Mode SYNCHRONOUS

Synchronous operation ensures faster data transfer speeds and more efficient communication with other components in the system.

Nominal Supply Voltage / Vsup (V) 3

The 3V nominal supply voltage provides a stable power source for optimal performance of the flash memory.

Power Supplies (V) 3/3.3

Dual power supply options offer flexibility in voltage requirements, allowing compatibility with a wide range of systems.

No. of Terminals 8

The 8 terminals provide secure connections and enable seamless integration of the flash memory into the circuit design.

Package Style (Meter) SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile of the package save valuable space on the PCB, ideal for compact devices.

Maximum Operating Temperature 85 °C

With a high maximum operating temperature, this flash memory can withstand harsh environmental conditions and industrial applications.

Organization 8MX8

The 8MX8 organization provides high memory density and efficient data storage capabilities for various applications.

Minimum Operating Temperature -40 °C

The low minimum operating temperature ensures reliable performance in extreme cold environments, expanding the usability of the flash memory.

Terminal Position DUAL

Dual terminal positions offer flexibility in mounting options and facilitate easy integration into different circuit designs.

Write Protection HARDWARE/SOFTWARE

The write protection feature provides security for stored data, preventing accidental or unauthorized modifications.

Maximum Seated Height 1 mm

The low maximum seated height allows for compact design solutions, maintaining a slim profile in electronic devices.

Maximum Clock Frequency (fCLK) 50 MHz

The high maximum clock frequency enables rapid data processing and efficient operation of the flash memory.

Width 6 mm

The slim width of the flash memory package saves space on the PCB and allows for efficient use of board real estate.

Minimum Supply Voltage (Vsup) 2.7 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, enhancing the flexibility of the product.

Type NOR TYPE

The NOR flash memory type offers fast read and write speeds, making it suitable for applications requiring high performance and reliability.

Length 8 mm

The compact length of the flash memory package saves space on the PCB, making it suitable for small electronic devices.

Programming Voltage (V) 2.7

The 2.7V programming voltage ensures efficient programming of the flash memory, enhancing reliability and performance.

Temperature Grade INDUSTRIAL

Designed for industrial-grade applications, this flash memory can withstand rugged conditions and deliver reliable performance in demanding environments.

Technology CMOS

The CMOS technology used in the flash memory ensures low power consumption, extending battery life in portable devices.

Parallel or Serial SERIAL

The serial interface enables easy integration with a wide range of microcontrollers and processors, simplifying system design.

Terminal Form NO LEAD

The lead-free terminal form complies with environmental regulations and reduces the risk of lead contamination, promoting a sustainable product design.

Maximum Supply Current 20 mA

With a low maximum supply current, this flash memory consumes minimal power, ideal for energy-efficient electronics.

No. of Words 8388608 words

The high number of words provides ample storage capacity for data-intensive applications, offering enhanced functionality and versatility.

Memory Width 8

The 8-bit memory width enables efficient data transfer and processing, ensuring high-speed performance in read and write operations.

Minimum Data Retention Time 20

The minimum data retention time of 20 years ensures the longevity of stored data, making this flash memory a reliable choice for long-term applications.

Terminal Pitch 1.27 mm

The small terminal pitch allows for tight integration on the PCB, reducing signal interference and improving overall system performance.

No. of Words Code 8M

The 8M words code provides a convenient way to reference the memory capacity of the flash memory, simplifying system design and integration.

Maximum Supply Voltage (Vsup) 3.6 V

The high maximum supply voltage offers headroom for voltage fluctuations, ensuring stable operation of the flash memory across varying supply conditions.

Endurance 100000 Write/Erase Cycles

With a high endurance rating, this flash memory can withstand frequent write and erase cycles, ensuring reliable performance over an extended product lifespan.

Serial Bus Type SPI

The SPI serial bus type enables easy communication with other devices and microcontrollers, enhancing system compatibility and flexibility.

Maximum Write Cycle Time (tWC) 15 ms

The fast maximum write cycle time ensures quick data storage and retrieval, improving overall system efficiency and performance.

Memory Density 67108864 bit

The high memory density offers ample storage capacity for large datasets and applications, making this flash memory suitable for data-intensive tasks.

Memory IC Type FLASH

The FLASH memory IC type provides non-volatile storage capabilities, retaining data even when power is removed, ensuring data integrity and reliability.

Maximum Standby Current 0.00005 Amp

The low maximum standby current minimizes power consumption in idle states, making this flash memory ideal for energy-efficient systems.

Technical Specifications

Flash Memory M25P64-VME6G attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

50 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-XDSO-N8

Length:

8 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/3.3

Programming Voltage (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Type:

NOR TYPE

Width:

6 mm

Maximum Write Cycle Time (tWC):

15 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M25P64-VME6G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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