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N25Q032A13ESC40G

Micron Technology

N25Q032A13ESC40G by Micron Technology

N25Q032A13ESC40G by Micron Technology is a NOR type flash memory with 32Mx1 organization, operating at 108MHz. It features a 3V nominal voltage and offers 100000 write/erase cycles. Ideal for industrial applications requiring high-speed synchronous operation in small outline packages.

Median Price

$2.240

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,080 parts In-Stock

1+ parts

$2.220

100+ parts

$1.690

1k+ parts

$1.620

10k+ parts

$1.410

3,080

$2.220

$1.690

$1.620

$1.410

DigiKey

USA . 597 parts In-Stock

1+ parts

$2.260

100+ parts

$1.780

1k+ parts

$1.580

10k+ parts

$1.453

597

$2.260

$1.780

$1.580

$1.453

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 10,901 parts In-Stock

1+ parts

$0.147

100+ parts

-

1k+ parts

-

10k+ parts

-

10,901

$0.147

-

-

-

Nova Conductors

Japan . 32 parts In-Stock

1+ parts

$0.469

100+ parts

-

1k+ parts

-

10k+ parts

-

32

$0.469

-

-

-

Digiode

USA . 113 parts In-Stock

1+ parts

$2.109

100+ parts

-

1k+ parts

-

10k+ parts

-

113

$2.109

-

-

-

Chip Stock

USA . 9,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,500

-

-

-

-

Kruse Electronics AG

Switzerland . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,000

-

-

-

-

Kruse

Germany . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,000

-

-

-

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Vyrian

USA . 5,138 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,138

-

-

-

-

Cyclops Electronics Ltd

UK . 1,191 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,191

-

-

-

-

PC Components Company LLC

USA . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

40

-

-

-

-

Bristol Electronics

USA . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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40

-

-

-

-

Electronics Depot

USA . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 754 parts In-Stock

1+ parts

$0.469

100+ parts

-

1k+ parts

-

10k+ parts

$0.455

754

$0.469

-

-

$0.455

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.469

100+ parts

-

1k+ parts

$0.446

10k+ parts

$0.436

100

$0.469

-

$0.446

$0.436

Ampacity Inc.

Singapore . 1,542 parts In-Stock

1+ parts

$1.890

100+ parts

-

1k+ parts

-

10k+ parts

-

1,542

$1.890

-

-

-

Corphita

USA . 1,254 parts In-Stock

1+ parts

$1.998

100+ parts

-

1k+ parts

-

10k+ parts

-

1,254

$1.998

-

-

-

Component Stockers USA

USA . 14,596 parts In-Stock

1+ parts

$2.120

100+ parts

$1.670

1k+ parts

$1.490

10k+ parts

-

14,596

$2.120

$1.670

$1.490

-

Advanced Electronics

New Zealand . 99 parts In-Stock

1+ parts

$3.488

100+ parts

$3.453

1k+ parts

$3.314

10k+ parts

-

99

$3.488

$3.453

$3.314

-

Aztec Data Supply Inc.

USA . 38,201 parts In-Stock

1+ parts

$4.271

100+ parts

-

1k+ parts

-

10k+ parts

-

38,201

$4.271

-

-

-

Andel Nordic

Denmark . 3,949 parts In-Stock

1+ parts

$5.943

100+ parts

-

1k+ parts

$5.705

10k+ parts

$5.705

3,949

$5.943

-

$5.705

$5.705

RC Electronics

USA . 77,337 parts In-Stock

1+ parts

-

100+ parts

$0.480

1k+ parts

$0.440

10k+ parts

$0.420

77,337

-

$0.480

$0.440

$0.420

A-Z Elektronik GmbH

Germany . 8,977 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,977

-

-

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-

Authorized Procurement Solutions

USA . 4,447 parts In-Stock

1+ parts

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4,447

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Perfect Parts

USA . 2,756 parts In-Stock

1+ parts

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2,756

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-

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Microchip USA

USA . 1,581 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,581

-

-

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Kepictronics

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

-

-

-

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iodParts Technologies Inc.

India . 105 parts In-Stock

1+ parts

-

100+ parts

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105

-

-

-

-

Overview

Experience superior performance and reliability with the N25Q032A13ESC40G by Micron Technology. As a leading manufacturer in the industry, Micron ensures top-notch quality and cutting-edge technology in its Flash Memory products. This versatile device is perfect for a wide range of applications, offering fast operation, low power consumption, and high endurance. With a nominal supply voltage of 3V and 32MX1 organization, this product delivers exceptional value and benefits to customers seeking high-performance memory solutions. Upgrade your systems with Micron's N25Q032A13ESC40G and experience the difference in efficiency and productivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the flash memory, ensuring it can withstand various environmental conditions.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer rates and improved efficiency in data processing.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this flash memory can function reliably in industrial environments with elevated temperatures.

No. of Words: 33554432 words

The large number of words indicates a high memory capacity, suitable for storing a vast amount of data.

Endurance: 100000 Write/Erase Cycles

With a high endurance level, this flash memory can withstand frequent write and erase cycles, ensuring longevity and reliability.

Technical Specifications

Flash Memory N25Q032A13ESC40G attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Maximum Clock Frequency (fCLK):

108 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Type:

NOR TYPE

Width:

3.9 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

N25Q032A13ESC40G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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