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S25FL256LAGNFI010

Infineon Technologies

S25FL256LAGNFI010 by Infineon Technologies

S25FL256LAGNFI010 by Infineon Tech: NOR Flash Memory, 32MX8 organization, SPI serial bus type. Ideal for industrial applications with -40 to 85 °C operating temp range and 100000 write/erase cycles endurance. Compact chip carrier package style with 133 MHz clock frequency support.

Median Price

$4.010

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 375 parts In-Stock

1+ parts

$1.439

100+ parts

-

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-

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375

$1.439

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-

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Avnet

USA . 676 parts In-Stock

1+ parts

$2.001

100+ parts

$1.899

1k+ parts

-

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676

$2.001

$1.899

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-

Chip1Stop

Japan . 4,022 parts In-Stock

1+ parts

$3.310

100+ parts

-

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4,022

$3.310

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Mouser Electronics

USA . 3,571 parts In-Stock

1+ parts

$4.010

100+ parts

$3.540

1k+ parts

$3.320

10k+ parts

-

3,571

$4.010

$3.540

$3.320

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DigiKey

USA . 1,131 parts In-Stock

1+ parts

$4.090

100+ parts

$3.531

1k+ parts

$3.298

10k+ parts

$3.250

1,131

$4.090

$3.531

$3.298

$3.250

Newark

USA . 328 parts In-Stock

1+ parts

$4.920

100+ parts

$4.410

1k+ parts

$4.310

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-

328

$4.920

$4.410

$4.310

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Farnell

UK . 587 parts In-Stock

1+ parts

$6.497

100+ parts

$4.462

1k+ parts

$4.184

10k+ parts

-

587

$6.497

$4.462

$4.184

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Element14

Singapore . 203 parts In-Stock

1+ parts

$6.660

100+ parts

$5.910

1k+ parts

$5.620

10k+ parts

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203

$6.660

$5.910

$5.620

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Flip Electronics (Authorized)

USA . 156,751 parts In-Stock

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156,751

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Rochester

USA . 8,979 parts In-Stock

1+ parts

-

100+ parts

$2.140

1k+ parts

$1.910

10k+ parts

$1.800

8,979

-

$2.140

$1.910

$1.800

Verical

USA . 7,915 parts In-Stock

1+ parts

-

100+ parts

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$2.388

10k+ parts

$2.250

7,915

-

-

$2.388

$2.250

RS (Exports)

UK . 1,688 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$5.972

10k+ parts

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1,688

-

-

$5.972

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 459 parts In-Stock

1+ parts

$1.665

100+ parts

-

1k+ parts

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459

$1.665

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$4.560

100+ parts

-

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50

$4.560

-

-

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Flip Electronics

USA . 81,736 parts In-Stock

1+ parts

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81,736

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Vyrian

USA . 17,715 parts In-Stock

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17,715

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Chip Stock

USA . 17,710 parts In-Stock

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17,710

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GLYN GmbH & Co. KG

Germany . 1,966 parts In-Stock

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1,966

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 17,981 parts In-Stock

1+ parts

$1.490

100+ parts

-

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17,981

$1.490

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Semicontronic

India . 17,542 parts In-Stock

1+ parts

$1.490

100+ parts

$1.453

1k+ parts

$1.445

10k+ parts

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17,542

$1.490

$1.453

$1.445

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Corphita

USA . 604 parts In-Stock

1+ parts

$1.578

100+ parts

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604

$1.578

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Aztec Data Supply Inc.

USA . 18,942 parts In-Stock

1+ parts

$1.988

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18,942

$1.988

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Argo Parts USA

USA . 319 parts In-Stock

1+ parts

$4.270

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319

$4.270

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Corohmni

South Africa . 892 parts In-Stock

1+ parts

$4.447

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892

$4.447

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Modulus Dynamics

Lithuania . 298 parts In-Stock

1+ parts

$4.447

100+ parts

$4.269

1k+ parts

$4.091

10k+ parts

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298

$4.447

$4.269

$4.091

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Component Stockers USA

USA . 21,642 parts In-Stock

1+ parts

$4.650

100+ parts

$4.030

1k+ parts

$3.960

10k+ parts

$3.960

21,642

$4.650

$4.030

$3.960

$3.960

Continental Prestige Electronics

USA . 437 parts In-Stock

1+ parts

$5.910

100+ parts

$4.280

1k+ parts

-

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437

$5.910

$4.280

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Robosynatics

Brazil . 2,770 parts In-Stock

1+ parts

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100+ parts

$4.358

1k+ parts

$4.269

10k+ parts

$4.269

2,770

-

$4.358

$4.269

$4.269

Lucentia Tech

USA . 2,770 parts In-Stock

1+ parts

-

100+ parts

$4.358

1k+ parts

$4.269

10k+ parts

$4.269

2,770

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$4.358

$4.269

$4.269

Bastille Electronics

Australia . 1,373 parts In-Stock

1+ parts

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1,373

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Perfect Parts

USA . 757 parts In-Stock

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757

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Overview

Unlock the power of reliable and high-quality flash memory with the S25FL256LAGNFI010 by Infineon Technologies. Designed with cutting-edge technology, this product offers seamless operation in a variety of applications. Whether you're looking to enhance your industrial systems or boost the performance of your consumer electronics, this flash memory provides the speed, durability, and flexibility you need. Trust in Infineon Technologies to deliver top-notch products that bring value and innovation to your projects. Upgrade to the S25FL256LAGNFI010 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the flash memory, ensuring it can withstand various environmental conditions.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer rates and more efficient communication with the memory.

Write Protection: HARDWARE/SOFTWARE

Having both hardware and software write protection options adds an extra layer of security to prevent unwanted data modification.

Endurance: 100000 Write/Erase Cycles

With a high number of write/erase cycles, this flash memory can be relied upon for frequent use without deteriorating quickly.

Memory IC Type: FLASH

Being a flash memory IC allows for non-volatile storage, meaning data is retained even when power is removed.

Technical Specifications

Flash Memory S25FL256LAGNFI010 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

8 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.3

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00006 Amp

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

6 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL256LAGNFI010 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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