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N25Q064A13ESFA0F

Micron Technology

N25Q064A13ESFA0F by Micron Technology

Micron Technology's N25Q064A13ESFA0F is a 64Mb NOR Flash Memory with 8Mx8 organization, operating at up to 108MHz clock frequency. It features hardware/software write protection and offers 100,000 Write/Erase cycles endurance. Ideal for automotive applications due to its -40°C to 125°C temperature range and small outline package style.

Median Price

$1.660

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,008 parts In-Stock

1+ parts

$1.660

100+ parts

$1.443

1k+ parts

$1.371

10k+ parts

$1.276

1,008

$1.660

$1.443

$1.371

$1.276

Mouser Electronics

USA . 736 parts In-Stock

1+ parts

$1.660

100+ parts

$1.450

1k+ parts

$1.360

10k+ parts

$1.240

736

$1.660

$1.450

$1.360

$1.240

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,650 parts In-Stock

1+ parts

$1.834

100+ parts

-

1k+ parts

-

10k+ parts

-

1,650

$1.834

-

-

-

Kruse

Germany . 351,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

351,000

-

-

-

-

Kruse Electronics AG

Switzerland . 323,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

323,000

-

-

-

-

ARCO, INC.

USA . 323,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

323,000

-

-

-

-

Vyrian

USA . 1,088 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,088

-

-

-

-

Nova Conductors

Japan . 30 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30

-

-

-

-

NexGen Digital

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,285 parts In-Stock

1+ parts

$1.450

100+ parts

-

1k+ parts

-

10k+ parts

-

1,285

$1.450

-

-

-

Corphita

USA . 951 parts In-Stock

1+ parts

$1.737

100+ parts

-

1k+ parts

-

10k+ parts

-

951

$1.737

-

-

-

Aztec Data Supply Inc.

USA . 1,379 parts In-Stock

1+ parts

$5.733

100+ parts

-

1k+ parts

-

10k+ parts

-

1,379

$5.733

-

-

-

Andel Nordic

Denmark . 1,210 parts In-Stock

1+ parts

$6.610

100+ parts

-

1k+ parts

$6.345

10k+ parts

$6.345

1,210

$6.610

-

$6.345

$6.345

RC Electronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$1.960

1k+ parts

$1.850

10k+ parts

$1.810

9,000

-

$1.960

$1.850

$1.810

A-Z Elektronik GmbH

Germany . 5,831 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,831

-

-

-

-

Kepictronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Futuretech Components

Singapore . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Perfect Parts

USA . 2,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,240

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Argo Parts USA

USA . 1,383 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,383

-

-

-

-

Continental Prestige Electronics

USA . 999 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

999

-

-

-

-

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Overview

Experience the next level of performance and reliability with the N25Q064A13ESFA0F by Micron Technology. As a leading manufacturer in the industry, Micron Technology delivers top-quality flash memory products that are perfect for a wide range of applications. Whether you're looking to enhance your automotive systems or boost the efficiency of your electronics, this NOR type memory device offers unmatched value, benefits, and advantages. Trust in Micron Technology to provide innovative solutions that meet your needs and exceed your expectations. Elevate your technology with the N25Q064A13ESFA0F today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount technology makes it easy to integrate this flash memory into various compact electronic devices.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures reliable and efficient data transfer in synchronization with the clock signal.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes it compatible with a wide range of electronic circuits and systems.

Write Protection: HARDWARE/SOFTWARE

Having both hardware and software write protection options adds an extra layer of security to prevent accidental data loss or unauthorized access.

Maximum Clock Frequency (fCLK): 108 MHz

The high maximum clock frequency allows for fast data read/write operations, enhancing the overall performance of the flash memory.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this flash memory can withstand harsh environmental conditions and temperature fluctuations.

Endurance: 100000 Write/Erase Cycles

With a high endurance of 100,000 write/erase cycles, this flash memory offers long-lasting reliability and data retention.

Technical Specifications

Flash Memory N25Q064A13ESFA0F attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Maximum Clock Frequency (fCLK):

108 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

16

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Type:

NOR TYPE

Width:

7.5 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

N25Q064A13ESFA0F Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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