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THGBMJG6C1LBAU7

Kioxia Holdings

THGBMJG6C1LBAU7 by Kioxia Holdings

THGBMJG6C1LBAU7 by Kioxia Holdings is an 8GX8 flash memory IC with 68719476736 bit memory density. It operates b/w -40 to 105 °C, suitable for industrial applications. With a terminal pitch of 0.5 mm and package style GRID ARRAY, it's ideal for compact electronic devices.

Median Price

$11.426

Lifecycle Status

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1k+

THGBMJG6C1LBAU7 by Kioxia Holdings
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Bristol Electronics

USA . 7 parts In-Stock

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$10.500

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Nova Conductors

Japan . 300 parts In-Stock

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$12.351

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$12.351

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Chip Stock

USA . 15,200 parts In-Stock

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ARCO, INC.

USA . 3,040 parts In-Stock

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Vyrian

USA . 800 parts In-Stock

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Component Sense

UK . 519 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 162 parts In-Stock

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NAC Semi

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Aztec Data Supply Inc.

USA . 55 parts In-Stock

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$2.150

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Continental Prestige Electronics

USA . 4,494 parts In-Stock

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$10.240

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$10.035

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Bastille Electronics

Australia . 450 parts In-Stock

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$12.350

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$11.732

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$10.992

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$12.350

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Advanced Electronics

New Zealand . 20 parts In-Stock

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$12.598

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$12.598

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Microchip USA

USA . 4,000 parts In-Stock

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$19.720

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$19.720

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$19.720

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$19.720

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$19.720

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GlobX GmbH

Germany . 15,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,462 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

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Formix International (Excess)

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GreenTree Electronics

Israel . 927 parts In-Stock

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Perfect Parts

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Overview

Experience lightning-fast data transfer and reliable storage with the THGBMJG6C1LBAU7 Flash Memory by Kioxia Holdings. Crafted with superior quality materials and cutting-edge technology, this memory device offers unmatched performance and durability for a wide range of applications. Whether you're a professional looking for seamless data access or a tech-savvy individual in need of reliable storage solutions, the THGBMJG6C1LBAU7 provides unparalleled value, benefits, and advantages to meet your every need. Trust Kioxia Holdings to deliver excellence in flash memory technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy and secure installation of the product on a PCB.

No. of Functions: 1

The single function design simplifies the use of the product and ensures efficient performance.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on a circuit board.

No. of Terminals: 153

The high number of terminals provides multiple connection options for enhanced versatility.

Package Style (Meter): GRID ARRAY

The grid array package style offers a compact and organized layout for improved connectivity.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance in various environments.

Organization: 8GX8

The 8GX8 organization allows for efficient data storage and retrieval.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can withstand extreme cold conditions.

Terminal Position: BOTTOM

The bottom terminal position simplifies installation and connection processes.

Width: 11 mm

The compact width of 11mm allows for easy integration into various systems.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement increases energy efficiency.

Length: 13 mm

The small length of 13mm makes the product suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments.

Technology: CMOS

The CMOS technology offers low power consumption and high speed performance.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections.

No. of Words: 8589934592 words

The large number of words allows for extensive data storage capacity.

Memory Width: 8

The memory width of 8 bits enables efficient data processing and transfer.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density packing on the PCB.

No. of Words Code: 8G

The 8G words code indicates the high memory capacity of the product.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage ensures compatibility with various power sources.

Memory Density: 68719476736 bit

The high memory density allows for storing a large amount of data in a compact space.

Memory IC Type: FLASH CARD

The flash card memory IC type offers fast data access and reliable performance.

Technical Specifications

Flash Memory THGBMJG6C1LBAU7 attributes and parameters. Explore more Flash Memory devices from Kioxia Holdings

Specs

JESD-30 Code:

R-PBGA-B153

Length:

13 mm

Memory Density:

68719476736 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

153

No. of Words:

8589934592 words

No. of Words Code:

8G

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8GX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA153,14X14,20

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Trade Compliance

THGBMJG6C1LBAU7 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Kioxia Holdings

KIOXIA Group is one of the largest manufacturers of NAND flash memory. In 1987, KIOXIA invented the world’s first NAND flash memory not to require a power source (non-volatile memory). This technology is now being used in various fields ranging from digital devices such as smartphones to data centers and has become an indispensable core component of the information society. As IoT, AI and 5G technologies become more widespread, we will see an explosive increase in the volume of data generated around the world. Large-capacity, high-performance memory and devices, and high-speed data processing systems will be indispensable for the storage and use of that data. As a global leader in flash memory and SSDs, we will continue to deliver products and services that create new value for society.

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