Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Toshiba's THGBM5G5A1JBAIR is a NAND flash memory with 4GX8 organization, 34359738368-bit density, and 4294967296-word capacity. Operating b/w -25°C to 85°C, it's ideal for applications requiring high-speed data storage in compact devices like smartphones and tablets.
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Vyrian
Nova Conductors
Classic Components Corporation
Advanced Electronics
$3.049
Corohmni
$5.156
AZTECH Wire
$13.806
Ampacity Inc.
$14.000
Continental Prestige Electronics
Kepictronics
Argo Parts USA
Benley Electronics
Bastille Electronics
Computer Components Inc. - USA
The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable devices.
Surface mount technology allows for easy installation and space-saving on circuit boards.
With a high maximum operating temperature, this product can be used in various environments without overheating.
CMOS technology provides low power consumption and high noise immunity, making the product efficient and reliable.
The high memory density allows for storing a large amount of data in a compact form, ideal for storage-intensive applications.
Flash Memory THGBM5G5A1JBAIR attributes and parameters. Explore more Flash Memory devices from Toshiba
JESD-30 Code:
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THGBM5G5A1JBAIR Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
TOSHIBA, is a Japanese multinational conglomerate corporation headquartered in Minato, Tokyo, Japan. Its diversified products and services include power, industrial and social infrastructure systems, elevators and escalators, electronic components, semiconductors, hard disk drives (HDD), printers, batteries, lighting, as well as IT solutions such as quantum cryptography which has been in development at Cambridge Research Laboratory, Toshiba Europe, located in the United Kingdom, now being commercialised.It was one of the biggest manufacturers of personal computers, consumer electronics, home appliances, and medical equipment. As a semiconductor company and the inventor of flash memory, Toshiba had been one of the top 10 in the chip industry until its flash memory unit was spun off as Toshiba Memory, later Kioxia, in the late 2010s.
2N2222A
New England Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Leshan Radio
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
2N7002
Nte Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .115 A; No. of Terminals: 3;
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
EEAGA1H4R7
Panasonic
Panasonic EEAGA1H4R7 is a 4.7uF, 50V Aluminum Electrolytic Capacitor with 0.1 Tan Delta and 0.003mA Leakage Current. Ideal for applications requiring high ripple current handling in temperatures ranging from -55 to 105°C.
ULN2803ADWRG4
Texas Instruments
ULN2803ADWRG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output, and built-in transient protection. It operates b/w -40 to 85 °C with a max supply voltage of 3 V. Ideal for applications requiring sink current flow direction in a small outline package style.
SS14
Hy Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Diotec Semiconductor Ag
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
Transys Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
M39029/58360
Esterline Technologies
CONNECTOR ACCESSORY; Terminal Type: CRIMP; Removal Tools: M81969/14-01; Associated Military - Specifications: MIL-DTL-38999; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT;
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBR0540T1G
Onsemi
MBR0540T1G by Onsemi is a Schottky rectifier diode with max. forward voltage of 0.62V and max. output current of 0.5A, ideal for applications requiring high efficiency power conversion in small outline packages. Operating temp range: -55 to 150°C, with peak reflow temp at 260°C, making it suitable for various electronic devices needing reliable rectification performance in compact designs.
NC7WZ07P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
Changzhou Galaxy Century Microelectronics
Itt Components
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .005 us; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Non Repetitive Peak Forward Current: 1 A;
Taitron Components
AT45DB041E-SHN-B
Dialog Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Data Retention Time: 20;
AT45DB321D-SU-SL954
Atmel
Atmel's AT45DB321D-SU-SL954 is a 32Mbit NOR flash memory with SPI interface, operating at 66MHz. It offers 100000 write/erase cycles and supports hardware/software write protection. Ideal for industrial applications requiring reliable data storage in a compact package.
S29AL016J70TFI020
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Equivalence Code: TSSOP48,.8,20;
S25FL256SAGBHVB00
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
AT45DB641E-MWHN-T
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
SST26VF016-80-5I-S2AE
Silicon Storage Technology
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
SDSDQAF3-008G-I
Sandisk
FLASH CARD; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Form: NO LEAD; Memory Density: 68719476736 bit;
S29JL064J55TFI000
Infineon Technologies
S29JL064J55TFI000 by Infineon Technologies is a NOR type flash memory with 4MX16 organization, operating at 3V. It features a small outline package with 48 terminals and offers fast access time of 55ns. Ideal for industrial applications requiring high-density memory storage in compact devices.
KLM8G1GETF-B0410
Samsung
Samsung's KLM8G1GETF-B0410 is a 8GX8 MLC NAND flash memory with 68719476736 bit density. Operating at 200 MHz, it has a very thin profile and fine pitch package style suitable for high-speed applications. With a voltage range of 1.7V to 1.95V, this CMOS technology chip is ideal for devices requiring fast data storage and retrieval.
S29AL008J70TFI020
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
IS25LP016D-JNLE
Integrated Silicon Solution
IS25LP016D-JNLE by Integrated Silicon Solution is a 16Mb NOR Flash Memory with 2MX8 organization, SPI serial bus type, and 133 MHz clock frequency. It operates at -40 to 105 °C, suitable for industrial applications requiring high-speed data storage in compact devices.
THGBMTG5D1LBAIL
Kioxia Holdings
Kioxia Holdings' THGBMTG5D1LBAIL is a NAND flash memory with 4MX8 organization, 34359738368 bit density, and 200 MHz clock frequency. It is suitable for applications requiring high-speed data storage in compact devices due to its very thin profile, fine pitch package style, and synchronous operating mode.
AT25SF161-SSHD-T
Adesto Technologies
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
S25FL128SAGMFIG01
S25FL128SAGMFIG01 by Infineon is a 16MX8 NOR flash memory with 133 MHz clock frequency, SPI serial bus type, and 100000 write/erase cycles. It is ideal for industrial applications requiring high-speed data storage in small outline packages.
SDINBDG4-8G-XI2
Western Digital
SDINBDG4-8G-XI2 by Western Digital is a Flash Memory with 8GX8 organization, MLC NAND type, and 3000 Write/Erase cycles endurance. It has a very thin profile, fine pitch package style suitable for industrial applications requiring high memory density and low power consumption.
S25FL128LAGNFV010
S25FL128LAGNFV010 by Infineon is a 16MX8 NOR flash memory with 133 MHz clock frequency, SPI serial bus type. Operating at -40 to 105 °C, it offers 100000 write/erase cycles and has a memory density of 134217728 bits. Ideal for industrial applications requiring high-speed data storage in compact devices.
MT28EW256ABA1HPC-0SIT
Micron Technology
Micron Technology's MT28EW256ABA1HPC-0SIT is a 16Mx16 NOR flash memory with 268MB density. Operating at 3V, it offers fast access time of 70ns for industrial applications. With a low profile grid array package, it supports asynchronous mode and parallel interface for high-speed data storage solutions.
W25Q16JLSNIG
Winbond Electronics
W25Q16JLSNIG by Winbond Electronics is a 16Mb flash memory IC with synchronous operation, 104 MHz clock frequency, and 2.7-3.6V supply voltage range. It is ideal for industrial applications requiring high-speed data storage in a compact small outline package.
S25FL128SAGMFI003
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Type: NOR TYPE;
N25Q128A13EF840F
N25Q128A13EF840F by Micron Technology is a NOR type flash memory with 128Mx1 organization, operating at 3V with 108MHz clock frequency. It features hardware/software write protection and SPI serial bus type, suitable for industrial applications requiring high endurance of 100000 Write/Erase cycles.
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THGBMNG5D1LBAIT
Toshiba
Toshiba's THGBMNG5D1LBAIT Flash Memory features 4GX8 organization, MLC NAND type, and 34359738368 bit memory density. Ideal for applications requiring high memory capacity and fast data access with a temperature range of -25 to 85 °C.
FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; No. of Functions: 1;
THGBMNG5D1LBAIL
Toshiba's THGBMNG5D1LBAIL is a Flash Memory with 4GX8 organization, 34359738368 bit memory density, and operates in asynchronous mode. It features 153 terminals in a grid array package style for applications requiring high-speed data storage and retrieval.
FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
THGBMJG6C1LBAU7
THGBMJG6C1LBAU7 by Kioxia Holdings is an 8GX8 flash memory IC with 68719476736 bit memory density. It operates b/w -40 to 105 °C, suitable for industrial applications. With a terminal pitch of 0.5 mm and package style GRID ARRAY, it's ideal for compact electronic devices.
THGBMJG6C1LBAIL
Kioxia Holdings' THGBMJG6C1LBAIL is an 8GX8 flash memory IC with 68719476736-bit memory density. It operates b/w -25°C to 85°C, with a voltage range of 2.7V to 3.6V. This rectangular GRID ARRAY package is surface-mountable and ideal for applications requiring high-speed data storage in compact devices.
THGBMJG7C2LBAU8
THGBMJG7C2LBAU8 by Kioxia Holdings is a Flash Memory with 16GX8 organization, 17179869184 words capacity, and 137438953472 bit memory density. It operates in industrial temperature range (-40 to 105 °C) and supports a supply voltage of 2.7V to 3.6V. Ideal for applications requiring high-speed data storage in compact devices.
THGBMJG8C4LBAU8
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
THGBMJG8C2LBAIL
FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
THGBMAG6A2JBAIR
FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 153; Package Shape: RECTANGULAR; Programming Voltage (V): 2.7; Technology: CMOS;
THGBM5G8A4JBAIR
FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 153; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Type: NAND TYPE;
THGBMAG5A1JBAIR
FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 153; Package Shape: RECTANGULAR; Minimum Operating Temperature: -25 Cel; Organization: 4GX8;
THGBM1G7D4EBAI2
FLASH; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: LFBGA; Package Shape: RECTANGULAR; Memory Width: 32;
THGBM5G8A4JBAIM
FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 169; Package Shape: RECTANGULAR; Technology: CMOS; Minimum Operating Temperature: -25 Cel;
THGBM5G8B4JBAIM
FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 169; Package Shape: RECTANGULAR; Programming Voltage (V): 2.7; Organization: 32GX8;
THGBM1G3D1EBAI8
FLASH; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: TFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;
THGBM1G7D8EBAI0
FLASH; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: LFBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
THGBM5G9A8JBAIG
FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 153; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V; Organization: 64GX8;
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