Loading...

M29DW128F60NF6E

STMicroelectronics

M29DW128F60NF6E by STMicroelectronics

M29DW128F60NF6E from STMicroelectronics is a 16-bit NOR Flash memory with a density of 128Mb, operating at 3V. It features asynchronous access with a max time of 60ns and supports industrial-grade temperatures from -40 °C to 85 °C. Ideal for embedded applications, it offers reliable data storage in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 5,572 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,572

-

-

-

-

Vyrian

USA . 4,246 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,246

-

-

-

-

Anansix

USA . 2,180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,180

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,788 parts In-Stock

1+ parts

$2.014

100+ parts

-

1k+ parts

$1.812

10k+ parts

-

1,788

$2.014

-

$1.812

-

MKK Technologies

India . 1,269 parts In-Stock

1+ parts

$3.787

100+ parts

-

1k+ parts

-

10k+ parts

-

1,269

$3.787

-

-

-

DigiPath Technology Company

USA . 1,269 parts In-Stock

1+ parts

$3.787

100+ parts

-

1k+ parts

-

10k+ parts

-

1,269

$3.787

-

-

-

Corphita

USA . 4,560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,560

-

-

-

-

Parana Technologies

USA . 2,236 parts In-Stock

1+ parts

-

100+ parts

$2.408

1k+ parts

-

10k+ parts

-

2,236

-

$2.408

-

-

Overview

Unlock your project’s potential with the M29DW128F60NF6E Flash Memory from STMicroelectronics. Renowned for its reliability and innovative technology, this high-performance memory solution offers exceptional speed and efficiency for a wide range of applications, from industrial automation to consumer electronics. With a compact design that seamlessly integrates into your systems, experience enhanced data storage capabilities and peace of mind knowing you’re backed by a trusted industry leader. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body provides good protection against environmental factors, enhancing the product's longevity.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into electronic devices, making this product suitable for modern applications.

Package Shape: RECTANGULAR

A rectangular shape aids in efficient PCB layout and design flexibility.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for faster data access, improving overall performance.

Nominal Supply Voltage / Vsup: 3 V

The 3V nominal supply voltage ensures compatibility with a wide range of low-power applications.

Power Supplies (V): 3/3.3 V

Flexible power supply options (3V and 3.3V) make the device adaptable to various electronic systems.

No. of Terminals: 56

A high number of terminals allows for greater connectivity options, accommodating more data lines for speed and efficiency.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile facilitate space-saving designs, ideal for compact electronics.

Alternate Memory Width: 8

The alternate memory width supports varied data handling, beneficial for diverse application needs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suited for high-temperature environments.

Organization: 8MX16

The organization offers a balanced architecture that enhances data retrieval and performance.

Minimum Operating Temperature: -40 °C

Operating from -40 °C makes it suitable for extreme environments, adding to its versatility.

No. of Sectors/Size: 16,254

A high number of sectors enhances data organization and efficiency during reading/writing operations.

Terminal Finish: MATTE TIN/TIN BISMUTH

The terminal finish ensures excellent solderability and corrosion resistance, prolonging device life.

Terminal Position: DUAL

Dual terminal position allows for better physical layout spacing, contributing to improved performance.

Maximum Seated Height: 1.2 mm

Low seated height enables integration into tighter spaces, appealing to compact device manufacturers.

Width: 14 mm

Reasonable width accommodates various PCB designs while maintaining performance.

Minimum Supply Voltage (Vsup): 2.7 V

Minimum supply voltage of 2.7V supports broader operational flexibility in various applications.

Page Size (words): 8/16

Configurable page sizes enhance customization options, suitable for varying application requirements.

Maximum Time At Peak Reflow Temperature (s): 40

Supports modern assembly processes with a reflow time limit that allows for better thermal management.

Peak Reflow Temperature °C: 260

A peak temperature of 260 °C ensures compatibility with advanced soldering techniques.

Type: NOR TYPE

NOR flash memory enables random access, advantageous for storing code and executing commands.

Common Flash Interface: YES

Common Flash Interface allows for easy integration and communication with various devices.

Length: 18.4 mm

Compact length contributes to its suitability for space-constrained applications.

Programming Voltage (V): 3

A standard programming voltage of 3V ensures compatibility with typical flash programming equipment.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliability in demanding environments.

Technology: CMOS

CMOS technology enhances performance while minimizing power consumption.

Parallel or Serial: PARALLEL

Parallel interface provides faster data transfer rates, improving performance in high-speed applications.

Terminal Form: GULL WING

Gull wing terminals are easy to handle and solder, facilitating efficient PCB assembly.

Sector Size (Words): 8K,64K

Flexible sector sizes optimize performance for various data storage needs.

Maximum Supply Current: 20 mA

Moderate supply current keeps power consumption manageable for battery-operated devices.

No. of Words: 8388608 words

A large word count ensures ample storage capacity for a wide range of applications.

Toggle Bit: YES

Toggle bit functionality enhances data integrity checks, contributing to reliable data management.

Memory Width: 16

Wide memory width allows for efficient data processing and operations.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is ideal for high-density designs, making it versatile for modern electronics.

No. of Words Code: 8M

The 8M words code indicates a robust memory structure, ensuring ample space for data.

Command User Interface: YES

A command user interface simplifies interaction with the memory, enhancing user experience.

Ready or Busy: YES

The ready or busy status indicator improves operational control, enhancing data management.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V ensures the product works effectively with various power supplies.

Boot Block: BOTTOM/TOP

Versatile boot block options provide flexibility in application programming and execution.

Memory Density: 134217728 bit

High memory density signifies a substantial storage capability, fulfilling extensive data needs.

Memory IC Type: FLASH

Being a flash memory IC allows for rewritable and erasable functionalities, making it ideal for numerous applications.

Maximum Standby Current: 0.0001 Amp

Low standby current helps in energy-efficient applications, particularly in battery-operated devices.

Maximum Access Time: 60 ns

A fast access time of 60 ns facilitates rapid data retrieval, beneficial for performance-sensitive applications.

Data Polling: YES

Data polling capability enhances the reliability of data writing operations, improving confidence in data integrity.

Technical Specifications

Flash Memory M29DW128F60NF6E attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

60 ns

Additional Features:

100,000 PROGRAM/ERASE CYCLES

Alternate Memory Width:

8

Boot Block:

BOTTOM/TOP

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e3/e6

Length:

18.4 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

16,254

No. of Terminals:

56

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Page Size (words):

8/16

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

8K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN/TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Toggle Bit:

YES

Type:

NOR TYPE

Width:

14 mm

Trade Compliance

M29DW128F60NF6E Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20