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NOIX3SN012KB-LTI

Onsemi

NOIX3SN012KB-LTI by Onsemi

NOIX3SN012KB-LTI by Onsemi is an Image Sensor with 3.2X3.2 um pixel size, 32.4 MHz master clock, and 4096 horizontal pixels. Ideal for applications requiring high-resolution imaging at a max operating temperature of 85 °C, such as surveillance cameras or industrial machine vision systems.

Median Price

$938.825

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 25 parts In-Stock

1+ parts

$367.650

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25

$367.650

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Chip1Stop

Japan . 449 parts In-Stock

1+ parts

$1,510.000

100+ parts

$773.000

1k+ parts

-

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449

$1,510.000

$773.000

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,434 parts In-Stock

1+ parts

$465.414

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1,434

$465.414

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Vyrian

USA . 2,742 parts In-Stock

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2,742

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Flip Electronics

USA . 350 parts In-Stock

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350

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,475 parts In-Stock

1+ parts

$440.919

100+ parts

-

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2,475

$440.919

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Corohmni

South Africa . 389 parts In-Stock

1+ parts

$489.910

100+ parts

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389

$489.910

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Kulean Microsystems

USA . 6,258 parts In-Stock

1+ parts

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6,258

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SupplyDigital Components

Austria . 3,974 parts In-Stock

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3,974

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Problanco Electronics

Mexico . 2,223 parts In-Stock

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2,223

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TANS Electronics

Latvia . 1,947 parts In-Stock

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1,947

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UHIMA Technologies

Türkiye . 877 parts In-Stock

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877

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Overview

Unleash the power of cutting-edge technology with the NOIX3SN012KB-LTI by Onsemi, a top-tier manufacturer known for delivering superior quality image sensors. Perfect for a wide range of applications, this innovative product offers unmatched value and benefits to customers seeking high-performance solutions. With its advanced features and exceptional performance, the NOIX3SN012KB-LTI is designed to exceed expectations and provide users with reliable and top-notch imaging capabilities. Elevate your projects with the best in the industry – choose Onsemi for unparalleled excellence.

Feature Benefit Bullets

Pixel Size (um) 3.2X3.2

Smaller pixel size allows for higher resolution and better image quality.

Maximum Supply Voltage 1.3 V

Low maximum supply voltage reduces power consumption and heat generation.

Master Clock 32.4 MHz

High master clock frequency enables fast data readout and processing.

Body Width 19.9 inch

Compact body width ensures easy integration into various devices.

Sensors or Transducers Type IMAGE SENSOR,CMOS

CMOS sensors offer low power consumption and high sensitivity for accurate imaging.

Output Type DIGITAL VOLTAGE

Digital output simplifies data transfer and processing for efficient operation.

Maximum Operating Temperature 85 °C

High maximum operating temperature allows for use in various environmental conditions.

Dynamic Range 68 dB

Wide dynamic range ensures detailed imaging in both bright and dark areas.

Array Type FRAME

Frame array design enables efficient capture of images with minimal distortion.

Mounting Feature SURFACE MOUNT

Surface mount capability simplifies installation and integration into different devices.

Technical Specifications

Image Sensors NOIX3SN012KB-LTI attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER; IT ALSO OPERATES AT ANALOG VOLTAGE OF 2.7 V TO 2.9V

Array Type:

FRAME

Body Width:

19.9 inch

Body Height:

2.54 mm

Body Length/Diameter:

20.88 mm

Dynamic Range:

68 dB

Frame Rate:

90 fps

Horizontal Pixel:

4096

Housing:

CERAMIC, METAL-SEALED COFIRED

Master Clock:

32.4 MHz

Mounting Feature:

Maximum Operating Current:

240 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1

Output Interface Type:

I2C/SPI INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.2X3.2

Sensors or Transducers Type:

Spectral Response (nm):

300-1000

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.1 V

Termination Type:

SOLDER

Vertical Pixel:

3072

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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