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NGTD23T120F2SWK

Onsemi

NGTD23T120F2SWK by Onsemi

NGTD23T120F2SWK by Onsemi is an N-CHANNEL IGBT for POWER CONTROL applications. It features a Max VCEsat of 2.2V, Max VGE of 20V, and Max VCE of 1200V. With a temperature range from -55 °C to 175°C, it's suitable for high-power electronic systems requiring efficient power management.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,094 parts In-Stock

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Digiode

USA . 1,997 parts In-Stock

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AZTECH Wire

Italy . 553 parts In-Stock

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$19.100

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Microchip USA

USA . 6,952 parts In-Stock

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Component Stockers USA

USA . 626 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 7,053 parts In-Stock

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SupplyDigital Components

Austria . 3,757 parts In-Stock

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Problanco Electronics

Mexico . 1,328 parts In-Stock

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Corphita

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Kulean Microsystems

USA . 547 parts In-Stock

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UHIMA Technologies

Türkiye . 446 parts In-Stock

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Corohmni

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Overview

Unlock the power of efficient and reliable power control with the NGTD23T120F2SWK by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and performance in all their products. This Insulated Gate Bipolar Transistor (IGBT) is perfect for a wide range of applications, from industrial machinery to renewable energy systems. With a maximum VCEsat of 2.2V and a maximum collector-emitter voltage of 1200V, this N-channel transistor offers unparalleled value, benefits, and advantages to customers looking for high-quality power control solutions. Trust Onsemi for cutting-edge technology that delivers results.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making them ideal for power control applications.

Configuration: SINGLE

Single configuration IGBTs simplify circuit design and offer better thermal performance compared to multiple configurations.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for efficient and reliable performance in high-power systems.

Surface Mount: YES

Surface mount technology allows for easy and secure installation, reducing the overall size and weight of the system.

Maximum VCEsat: 2.2 V

Low VCEsat reduces power dissipation and improves overall efficiency of the IGBT, leading to lower operating costs.

Package Shape: RECTANGULAR

Rectangular packages offer efficient heat dissipation and easy integration into existing circuit layouts.

Terminal Form: NO LEAD

No-lead terminals provide improved thermal performance and reliability, reducing the risk of solder joint failures.

No. of Terminals: 2

A two-terminal design simplifies connections and reduces the chances of wiring errors in the system.

Package Style (Meter): UNCASED CHIP

The chip package style offers high power density and excellent thermal transfer properties, ensuring reliable performance in demanding environments.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this IGBT can withstand harsh environmental conditions and maintain stable performance.

Maximum Collector-Emitter Voltage: 1200 V

A high maximum VCE rating allows the IGBT to handle large voltages, making it suitable for high-power applications.

Transistor Element Material: SILICON

Silicon-based IGBTs offer good thermal and electrical performance, ensuring long-term reliability in power control applications.

Maximum Gate-Emitter Voltage: 20 V

The high maximum gate-emitter voltage allows for flexible control over the switching behavior of the IGBT, enhancing its versatility in power control applications.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this IGBT can operate in cold environments or during startup conditions without any performance degradation.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The maximum gate-emitter threshold voltage determines the turn-on characteristics of the IGBT, ensuring precise control over power switching operations.

Terminal Position: UPPER

An upper terminal position simplifies the connectivity of the IGBT in the circuit, reducing the risk of signal interference and improving overall system stability.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTD23T120F2SWK attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUUC-N2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

2.2 V

Trade Compliance

NGTD23T120F2SWK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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