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NGTD13T120F2SWK

Onsemi

NGTD13T120F2SWK by Onsemi

NGTD13T120F2SWK by Onsemi is an N-CHANNEL IGBT for POWER CONTROL applications. It features a Max VCEsat of 2.4V, Max VGE of 20V, and Max VCE of 1200V. With a temperature range from -55 °C to 175°C, it's suitable for high-power electronic systems requiring efficient power management.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

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Digiode

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TANS Electronics

Latvia . 6,898 parts In-Stock

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SupplyDigital Components

Austria . 5,654 parts In-Stock

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Kulean Microsystems

USA . 4,652 parts In-Stock

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Problanco Electronics

Mexico . 765 parts In-Stock

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Corphita

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Corohmni

South Africa . 252 parts In-Stock

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UHIMA Technologies

Türkiye . 53 parts In-Stock

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Overview

Enhance your power control applications with the NGTD13T120F2SWK from Onsemi, a leading manufacturer known for top-quality Insulated Gate Bipolar Transistors (IGBT). With its N-channel configuration and maximum VCEsat of 2.4V, this single-channel transistor offers exceptional performance and reliability. Whether you're working on industrial equipment, motor drives, or renewable energy systems, this IGBT chip's high collector-emitter voltage of 1200V and low gate-emitter threshold voltage of 6.5V provide unmatched efficiency and precision. Trust Onsemi to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are generally more efficient and have lower conduction losses compared to P-CHANNEL IGBTs.

Configuration: SINGLE

Single configuration IGBTs are easier to manage in circuit design and provide reliable performance.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance and efficiency.

Maximum VCEsat: 2.4 V

Low VCEsat reduces power dissipation and improves efficiency in power switching applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and compact design in circuit layouts.

No. of Terminals: 2

Having only 2 terminals simplifies the connection process and reduces chances of error in installation.

Maximum Operating Temperature: 175 °C

Can operate efficiently at high temperatures, making it suitable for industrial applications.

Maximum Collector-Emitter Voltage: 1200 V

Supports high voltage applications, providing versatility in power control circuits.

Transistor Element Material: SILICON

Silicon-based transistor elements offer high performance, reliability, and have a wide operating temperature range.

Maximum Gate-Emitter Voltage: 20 V

Suitable for driving the gate of the IGBT efficiently, ensuring precise control over power switching.

Minimum Operating Temperature: -55 °C

Capable of operating in extreme cold temperatures, suitable for a wide range of environmental conditions.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Provides a safe threshold for gate triggering, preventing accidental activation and ensuring stable operation.

Terminal Position: UPPER

The upper terminal position makes it easy for integration into circuit layouts and connections.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTD13T120F2SWK attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUUC-N2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

UNCASED CHIP

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

2.4 V

Trade Compliance

NGTD13T120F2SWK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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