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NGTD14T65F2SWK

Onsemi

NGTD14T65F2SWK by Onsemi

NGTD14T65F2SWK by Onsemi is an N-CHANNEL IGBT with 650V VCEsat, 20V VGE, and 175 °C max operating temp. Ideal for power control applications due to its single configuration and silicon transistor element material.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,750 parts In-Stock

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5,750

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Digiode

USA . 93 parts In-Stock

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93

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Microchip USA

USA . 8,722 parts In-Stock

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$13.080

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8,722

$13.080

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AZTECH Wire

Italy . 173 parts In-Stock

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$17.510

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Component Stockers USA

USA . 437 parts In-Stock

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$99.990

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437

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Problanco Electronics

Mexico . 8,158 parts In-Stock

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Kulean Microsystems

USA . 6,184 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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SupplyDigital Components

Austria . 3,427 parts In-Stock

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Corphita

USA . 900 parts In-Stock

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900

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TANS Electronics

Latvia . 422 parts In-Stock

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Corohmni

South Africa . 236 parts In-Stock

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UHIMA Technologies

Türkiye . 46 parts In-Stock

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Overview

Enhance the power control in your applications with the NGTD14T65F2SWK Insulated Gate Bipolar Transistor by Onsemi. With its N-CHANNEL polarity and single configuration, this transistor offers high-quality performance and reliability. Ideal for a variety of power control applications, this product provides value by delivering efficient power management and improved system functionality. Trust Onsemi's expertise and innovation to elevate your projects to the next level.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making them ideal for power control applications.

Configuration: SINGLE

Single configuration IGBTs are simpler to use and control, making them suitable for power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

Surface mount technology allows for easier integration and space-saving on circuit boards.

Maximum VCEsat: 2 V

Low VCEsat ensures minimal power loss and high efficiency during operation.

Package Shape: SQUARE

Square package shape provides better heat dissipation and easier mounting on PCBs.

No. of Terminals: 3

Three terminals allow for easy connection and control in power control circuits.

Maximum Operating Temperature: 175 °C

High maximum operating temperature ensures reliability and performance in demanding conditions.

Maximum Collector-Emitter Voltage: 650 V

High maximum collector-emitter voltage allows for use in high-power applications.

Transistor Element Material: SILICON

Silicon-based IGBTs are known for their high performance and reliability in power control applications.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage allows for fast switching speeds and efficient operation.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures functionality even in extreme cold environments.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Optimal gate-emitter threshold voltage for efficient power control and performance.

Terminal Position: UPPER

Upper terminal positioning enables easier connections and integration in power control circuits.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTD14T65F2SWK attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

S-XUUC-N3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

2 V

Trade Compliance

NGTD14T65F2SWK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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