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NGTD20T120F2WP

Onsemi

NGTD20T120F2WP by Onsemi

NGTD20T120F2WP by Onsemi is an N-CHANNEL IGBT with 1200V VCEsat, 20V VGE, and 175 °C max operating temp. Ideal for power control applications due to its single configuration and silicon transistor element material.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,891 parts In-Stock

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Digiode

USA . 836 parts In-Stock

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AZTECH Wire

Italy . 476 parts In-Stock

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$9.780

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476

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Microchip USA

USA . 4,868 parts In-Stock

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$17.136

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Component Stockers USA

USA . 393 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 8,307 parts In-Stock

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Kulean Microsystems

USA . 7,756 parts In-Stock

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SupplyDigital Components

Austria . 6,176 parts In-Stock

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Problanco Electronics

Mexico . 5,450 parts In-Stock

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Corphita

USA . 1,755 parts In-Stock

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UHIMA Technologies

Türkiye . 377 parts In-Stock

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Corohmni

South Africa . 174 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the NGTD20T120F2WP by Onsemi. As a leading manufacturer in the industry, Onsemi delivers unparalleled quality and reliability in its Insulated Gate Bipolar Transistors (IGBT). Designed for power control applications, this single-channel N-CHANNEL transistor offers exceptional performance with a maximum collector-emitter voltage of 1200V and a low VCEsat of 2.4V. With surface-mount capabilities and a wide operating temperature range, this product provides customers with unmatched value and benefits for their electronic projects.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making them ideal for power control applications.

Configuration: SINGLE

SINGLE configuration simplifies the circuit design and ensures easy integration in power control systems.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance and reliability in controlling high power devices.

Maximum VCEsat: 2.4 V

Low VCEsat value indicates minimal power loss and high efficiency during operation.

Package Shape: RECTANGULAR

Rectangular package shape offers efficient heat dissipation and easy mounting in various applications.

No. of Terminals: 2

With only 2 terminals, the IGBT is easy to connect in the circuit, reducing complexity and potential points of failure.

Maximum Operating Temperature: 175 °C

High maximum operating temperature ensures reliability and stable performance even in demanding conditions.

Maximum Collector-Emitter Voltage: 1200 V

High voltage handling capability enables the IGBT to switch and control high power devices effectively.

Transistor Element Material: SILICON

Silicon-based transistor element offers high efficiency, reliability, and longevity in operation.

Maximum Gate-Emitter Voltage: 20 V

High maximum gate-emitter voltage ensures reliable switching and control of the IGBT under different operating conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature enables the IGBT to function in extreme cold environments without compromising performance.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Optimal gate-emitter threshold voltage provides precise control over the IGBT's switching behavior.

Terminal Position: UPPER

Upper terminal position simplifies the connection process and ensures proper alignment in the circuit.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTD20T120F2WP attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUUC-N2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

2.4 V

Trade Compliance

NGTD20T120F2WP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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