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NGTD17T65F2SWK

Onsemi

NGTD17T65F2SWK by Onsemi

NGTD17T65F2SWK by Onsemi is an N-CHANNEL IGBT with 650V VCEsat, 20V VGE, and 175 °C max operating temp. Ideal for power control applications due to its single configuration and silicon transistor element material. Suitable for surface mount with a rectangular package style.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

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1k+

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Vyrian

USA . 8,476 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 840 parts In-Stock

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$11.990

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Ampacity Inc.

Singapore . 228 parts In-Stock

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$62.050

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Component Stockers USA

USA . 514 parts In-Stock

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Microchip USA

USA . 7,626 parts In-Stock

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Kulean Microsystems

USA . 6,679 parts In-Stock

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TANS Electronics

Latvia . 6,129 parts In-Stock

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Authorized Procurement Solutions

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QUARKTWIN TECHNOLOGY LTD

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Problanco Electronics

Mexico . 4,007 parts In-Stock

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SupplyDigital Components

Austria . 994 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 110 parts In-Stock

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Corohmni

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Overview

Experience superior power control with the NGTD17T65F2SWK by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that are perfect for a variety of applications. Whether you're looking to enhance efficiency in your power systems or improve overall performance, this N-CHANNEL transistor offers unmatched value and benefits. With a maximum VCEsat of 2V and a maximum operating temperature of 175 °C, this SINGLE configuration transistor is a game-changer for your projects. Trust Onsemi to provide you with reliable and innovative solutions for all your power control needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs offer better performance and efficiency compared to P-Channel IGBTs, making it a good choice for power control applications.

Configuration: SINGLE

Single configuration IGBTs are simpler to use and require less complex circuitry, making them more reliable in power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance and efficiency in controlling high power loads.

Surface Mount: YES

Surface mount IGBTs are easier to install and allow for a more compact design, making them suitable for space-constrained applications.

Maximum VCEsat: 2 V

Low VCEsat means reduced power losses and higher efficiency, making this IGBT ideal for power control applications where energy efficiency is crucial.

Package Shape: RECTANGULAR

Rectangular package shape allows for easier mounting and handling, contributing to overall ease of use and installation.

Terminal Form: NO LEAD

No lead terminals reduce the risk of damage during installation and handling, improving the reliability and longevity of the IGBT.

No. of Terminals: 3

Having a minimal number of terminals simplifies the connection process and reduces the likelihood of errors during installation, ensuring reliable operation.

Package Style (Meter): UNCASED CHIP

The unencased chip package style allows for efficient heat dissipation, improving the overall thermal performance and reliability of the IGBT.

Maximum Operating Temperature: 175 °C

High maximum operating temperature tolerance ensures stable operation even in demanding environments, making this IGBT suitable for a wide range of applications.

Maximum Collector-Emitter Voltage: 650 V

High maximum collector-emitter voltage rating makes this IGBT suitable for applications that require handling high voltages with precision and efficiency.

Transistor Element Material: SILICON

Silicon-based material offers high performance, reliability, and efficiency in power control applications, making this IGBT a durable and reliable choice.

Maximum Gate-Emitter Voltage: 20 V

High maximum gate-emitter voltage allows for precise control over the IGBT's operation, ensuring accurate power modulation in power control applications.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature tolerance enables the IGBT to operate reliably in extreme temperature conditions, making it suitable for a wide range of environments.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The maximum gate-emitter threshold voltage ensures stable switching behavior and efficient power control, making this IGBT ideal for high-performance applications.

Terminal Position: UPPER

Upper terminal position simplifies the connection process and ensures proper alignment during installation, contributing to the overall reliability of the IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTD17T65F2SWK attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUUC-N3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

2 V

Trade Compliance

NGTD17T65F2SWK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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