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NGTD13T65F2WP

Onsemi

NGTD13T65F2WP by Onsemi

NGTD13T65F2WP by Onsemi is an N-CHANNEL IGBT transistor for MOTOR CONTROL applications. It features a Max VCEsat of 2.2V, Max VGE of 20V, and Max VCE of 650V. With a temperature range from -55 °C to 175°C, this SQUARE-shaped transistor is ideal for high-power motor control systems.

Median Price

$0.770

Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 6,469 parts In-Stock

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$0.770

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$0.770

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$0.770

$0.770

Flip Electronics (Authorized)

USA . 6,469 parts In-Stock

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6,469

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Distributors (In-Stock)

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Vyrian

USA . 734 parts In-Stock

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$0.770

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734

$0.770

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Flip Electronics

USA . 6,469 parts In-Stock

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6,469

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Digiode

USA . 1,259 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 117 parts In-Stock

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$0.770

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117

$0.770

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$2.307

100+ parts

$2.099

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$1.892

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500

$2.307

$2.099

$1.892

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Microchip USA

USA . 2,056 parts In-Stock

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$12.247

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Problanco Electronics

Mexico . 8,073 parts In-Stock

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Kulean Microsystems

USA . 7,287 parts In-Stock

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TANS Electronics

Latvia . 7,039 parts In-Stock

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Corphita

USA . 1,183 parts In-Stock

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SupplyDigital Components

Austria . 948 parts In-Stock

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UHIMA Technologies

Türkiye . 861 parts In-Stock

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Overview

The NGTD13T65F2WP by Onsemi is a game-changer in the world of Insulated Gate Bipolar Transistors (IGBT). With its N-CHANNEL polarity and SINGLE configuration, this transistor is perfect for MOTOR CONTROL applications. Onsemi's reputation for high-quality components shines through in this product, offering customers unparalleled value and reliability. Whether you're looking to optimize motor performance or enhance energy efficiency, the NGTD13T65F2WP has you covered. Say goodbye to outdated technology and experience the benefits of cutting-edge innovation with Onsemi's latest offering.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are commonly used in motor control applications due to their efficiency and performance characteristics.

Configuration: SINGLE

SINGLE configuration simplifies the circuit design and makes it easier to use in motor control applications.

Transistor Application: MOTOR CONTROL

Specifically designed for motor control applications, ensuring optimal performance and efficiency in controlling motors.

Maximum VCEsat: 2.2 V

Low VCEsat reduces power losses and improves the efficiency of the device in motor control applications.

Surface Mount: YES

Surface mount capability allows for easy and compact integration into circuit boards, reducing space requirements and facilitating mass production.

Package Shape: SQUARE

Square package shape provides better thermal dissipation and easier mounting on circuit boards.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of short circuits and improves reliability in motor control applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature ensures the device can withstand harsh environments and extended operation periods.

Maximum Collector-Emitter Voltage: 650 V

High maximum collector-emitter voltage allows for the control of high power motors and robust performance in motor control applications.

Transistor Element Material: SILICON

Silicon as the element material ensures high reliability and performance in motor control applications.

Maximum Gate-Emitter Voltage: 20 V

High maximum gate-emitter voltage allows for precise control of the IGBT and ensures stable operation in motor control applications.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows the IGBT to operate in a wide range of temperature conditions and environments.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

High gate-emitter threshold voltage ensures reliable switching and control of the IGBT in motor control applications.

Terminal Position: UPPER

Upper terminal position facilitates easier connections and mounting in motor control circuits.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTD13T65F2WP attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

S-XUUC-N3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

2.2 V

Trade Compliance

NGTD13T65F2WP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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