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NGTD13T65F2SWK

Onsemi

NGTD13T65F2SWK by Onsemi

The Onsemi NGTD13T65F2SWK is an N-CHANNEL IGBT transistor with a max VCEsat of 2.2V and a max collector-emitter voltage of 650V. Ideal for motor control applications, it operates b/w -55 °C to 175°C, featuring a gate-emitter threshold voltage of 6.5V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,040 parts In-Stock

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Vyrian

USA . 1,249 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 27,197 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 8,304 parts In-Stock

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TANS Electronics

Latvia . 6,683 parts In-Stock

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SupplyDigital Components

Austria . 4,760 parts In-Stock

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Kulean Microsystems

USA . 4,301 parts In-Stock

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Corphita

USA . 1,671 parts In-Stock

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UHIMA Technologies

Türkiye . 557 parts In-Stock

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Corohmni

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Overview

Unlock the potential of your motor control applications with the NGTD13T65F2SWK insulated gate bipolar transistor by Onsemi. Manufactured to the highest standards, this N-channel single configuration transistor offers exceptional performance and reliability. Whether you're looking to boost efficiency or enhance power management in your projects, this product delivers unmatched value and benefits. Trust Onsemi for top-quality components that meet your needs and exceed your expectations.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high efficiency and fast switching capabilities, making them ideal for motor control applications.

Configuration: SINGLE

Single configuration IGBTs are simpler to use and require less complicated circuit design compared to dual or triple configurations.

Transistor Application: MOTOR CONTROL

Specifically designed for motor control applications, ensuring optimal performance and efficiency in controlling electric motors.

Surface Mount: YES

Surface mount technology allows for easy installation on PCBs, saving space and improving thermal performance.

Maximum VCEsat: 2.2 V

Low VCEsat value indicates minimal power loss and high efficiency, crucial for energy-efficient motor control.

Package Shape: SQUARE

Square package shape provides uniform heat dissipation and ease of mounting on PCBs.

No. of Terminals: 3

Three terminals allow for simplified connection and control of the IGBT in motor control circuits.

Maximum Operating Temperature: 175 °C

High maximum operating temperature ensures reliability and stability in harsh industrial environments.

Maximum Collector-Emitter Voltage: 650 V

High maximum voltage rating allows for the control of high-power motors without risk of damage or failure.

Transistor Element Material: SILICON

Silicon-based IGBTs offer superior performance and reliability in motor control applications.

Maximum Gate-Emitter Voltage: 20 V

High maximum gate-emitter voltage ensures smooth and reliable switching of the IGBT in motor control circuits.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for reliable operation even in extreme cold conditions.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Optimal gate-emitter threshold voltage ensures precise and efficient control of the IGBT in motor control circuits.

Terminal Position: UPPER

Upper terminal position provides easy access for connection and control of the IGBT in motor control circuits.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTD13T65F2SWK attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

S-XUUC-N3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

UNCASED CHIP

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

2.2 V

Trade Compliance

NGTD13T65F2SWK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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