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NGTD17T65F2WP

Onsemi

NGTD17T65F2WP by Onsemi

NGTD17T65F2WP by Onsemi is an N-CHANNEL IGBT with 650V VCEsat, 20V VGE, and 175 °C max operating temp. Ideal for power control applications due to its single configuration and silicon transistor element material. Suitable for surface mount with a rectangular package style.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,234 parts In-Stock

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Digiode

USA . 1,685 parts In-Stock

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AZTECH Wire

Italy . 111 parts In-Stock

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$13.060

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Microchip USA

USA . 3,854 parts In-Stock

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$14.274

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Ampacity Inc.

Singapore . 1,183 parts In-Stock

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$55.050

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QUARKTWIN TECHNOLOGY LTD

USA . 14,412 parts In-Stock

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Problanco Electronics

Mexico . 6,470 parts In-Stock

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Kulean Microsystems

USA . 5,462 parts In-Stock

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Corphita

USA . 1,985 parts In-Stock

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TANS Electronics

Latvia . 1,428 parts In-Stock

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SupplyDigital Components

Austria . 1,015 parts In-Stock

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Corohmni

South Africa . 105 parts In-Stock

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UHIMA Technologies

Türkiye . 36 parts In-Stock

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Overview

Experience the power and efficiency of the NGTD17T65F2WP by Onsemi, a top-tier manufacturer known for their high-quality components. As part of the Insulated Gate Bipolar Transistors (IGBT) category, this N-CHANNEL transistor offers superior performance in power control applications. With a maximum VCEsat of 2V and a maximum Collector-Emitter Voltage of 650V, this product delivers reliability and durability. Say goodbye to lead terminals with its surface mount design and rectangular package shape. Trust Onsemi to provide innovative solutions for your power control needs with the NGTD17T65F2WP.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower on-state voltage and higher switching speeds compared to P-CHANNEL, making them suitable for high power control applications.

Configuration: SINGLE

Single configuration IGBTs are simpler to control and are suitable for power control applications where only one output is needed.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring efficient and reliable performance in controlling high levels of power.

Maximum VCEsat: 2 V

Low maximum VCEsat value indicates minimal voltage drop when the transistor is conducting, resulting in efficient power control and reduced energy loss.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and making the product suitable for compact designs.

Maximum Collector-Emitter Voltage: 650 V

High maximum collector-emitter voltage allows for the handling of high voltage levels, making it suitable for power control in demanding applications.

Maximum Gate-Emitter Voltage: 20 V

High maximum gate-emitter voltage ensures reliable and consistent control over the transistor, preventing damage from excessive voltage levels.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTD17T65F2WP attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUUC-N3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

2 V

Trade Compliance

NGTD17T65F2WP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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