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NGTD21T65F2WP

Onsemi

NGTD21T65F2WP by Onsemi

NGTD21T65F2WP by Onsemi is an N-CHANNEL IGBT for POWER CONTROL applications. It features a Max VCEsat of 1.9V, Max VGE of 20V, and Max VCE of 650V. With a temperature range from -55 °C to 175°C, it's suitable for high-power electronic systems requiring efficient power switching.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,008 parts In-Stock

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4,008

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Digiode

USA . 179 parts In-Stock

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179

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Distributors (Availability)

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AZTECH Wire

Italy . 990 parts In-Stock

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$14.800

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990

$14.800

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Microchip USA

USA . 5,312 parts In-Stock

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$18.889

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$18.889

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SupplyDigital Components

Austria . 7,702 parts In-Stock

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Kulean Microsystems

USA . 7,691 parts In-Stock

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7,691

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TANS Electronics

Latvia . 5,388 parts In-Stock

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5,388

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Problanco Electronics

Mexico . 3,122 parts In-Stock

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3,122

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Corphita

USA . 1,693 parts In-Stock

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UHIMA Technologies

Türkiye . 526 parts In-Stock

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Corohmni

South Africa . 488 parts In-Stock

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Overview

Experience unparalleled power control with the NGTD21T65F2WP by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that are perfect for a wide range of applications. Whether you're looking to enhance your industrial machinery or elevate your automotive systems, this N-CHANNEL transistor offers exceptional performance and reliability. With a maximum VCEsat of 1.9V and a maximum collector-emitter voltage of 650V, this single-channel IGBT ensures efficient power management at all times. Trust Onsemi to provide you with the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors generally have better conductivity and efficiency compared to P-CHANNEL transistors, making this IGBT a good choice for power control applications.

Configuration: SINGLE

SINGLE configuration simplifies circuit design and ensures easy integration, making this IGBT suitable for power control applications where simplicity is key.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, this IGBT is optimized for efficient and reliable performance in controlling power systems.

Maximum VCEsat: 1.9 V

Low VCEsat value indicates minimal power loss and high efficiency, making this IGBT ideal for power control applications where energy efficiency is important.

Package Shape: SQUARE

SQUARE package shape is compact and allows for efficient PCB layout, making this IGBT suitable for space-constrained power control applications.

Terminal Form: NO LEAD

NO LEAD terminal form simplifies the soldering process and enhances reliability, making this IGBT easy to handle and suitable for robust power control applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature ensures reliable performance in harsh environments, making this IGBT suitable for industrial power control applications.

Maximum Collector-Emitter Voltage: 650 V

High maximum collector-emitter voltage allows for handling high power levels, making this IGBT suitable for high voltage power control applications.

Maximum Gate-Emitter Voltage: 20 V

High maximum gate-emitter voltage provides flexibility in gate control, making this IGBT suitable for a wide range of power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTD21T65F2WP attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

S-XUUC-N3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

1.9 V

Trade Compliance

NGTD21T65F2WP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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