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NGTD28T65F2WP

Onsemi

NGTD28T65F2WP by Onsemi

NGTD28T65F2WP by Onsemi is an N-CHANNEL IGBT for MOTOR CONTROL applications. It features a Max VCEsat of 2V, Max VGE of 20V, and Max VCE of 650V. With a temperature range from -55 °C to 175°C, this surface-mount transistor is ideal for high-power motor control systems.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,128 parts In-Stock

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Digiode

USA . 2,265 parts In-Stock

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AZTECH Wire

Italy . 1,074 parts In-Stock

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$12.420

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Microchip USA

USA . 6,084 parts In-Stock

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$22.265

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Ampacity Inc.

Singapore . 902 parts In-Stock

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$63.050

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Component Stockers USA

USA . 503 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 8,243 parts In-Stock

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Kulean Microsystems

USA . 7,187 parts In-Stock

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Problanco Electronics

Mexico . 6,667 parts In-Stock

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SupplyDigital Components

Austria . 723 parts In-Stock

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Corphita

USA . 652 parts In-Stock

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UHIMA Technologies

Türkiye . 182 parts In-Stock

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Corohmni

South Africa . 143 parts In-Stock

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Overview

Enhance your motor control applications with the NGTD28T65F2WP by Onsemi. This N-CHANNEL IGBT offers top-notch quality and reliability from a trusted manufacturer. Ideal for various motor control tasks, this single configuration transistor ensures seamless operation while maximizing efficiency. Say goodbye to voltage worries with its impressive 650 V maximum collector-emitter voltage and low 2 V VCEsat. Experience superior performance and durability with Onsemi's cutting-edge technology, making your projects run smoother than ever before.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making them suitable for motor control applications.

Configuration: SINGLE

SINGLE configuration simplifies the design and implementation of the IGBT, making it more reliable and easier to control.

Transistor Application: MOTOR CONTROL

Specifically designed for motor control applications, ensuring optimal performance and efficiency in controlling motors.

Surface Mount: YES

Surface mount technology offers space-saving benefits and ease of assembly, making it ideal for compact motor control applications.

Maximum VCEsat: 2 V

Low VCEsat reduces power dissipation in the IGBT and improves efficiency in motor control operations.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact form factor, saving space in motor control circuit designs.

Package Style (Meter): UNCASED CHIP

The unencased chip design allows for precise thermal management and efficient heat dissipation, crucial for high-power motor control applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature ensures reliability and performance in demanding motor control environments.

Maximum Collector-Emitter Voltage: 650 V

High collector-emitter voltage rating allows the IGBT to handle high voltages in motor control systems, enhancing safety and reliability.

Transistor Element Material: SILICON

Silicon-based IGBTs offer high breakdown voltage and low ON-state resistance, critical for efficient motor control applications.

Maximum Gate-Emitter Voltage: 20 V

The high gate-emitter voltage rating ensures reliable and consistent control of the IGBT in motor control applications.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows the IGBT to operate in a wide range of environments, ensuring reliability in varying conditions.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The gate-emitter threshold voltage determines the turn-on characteristics of the IGBT, ensuring optimal performance in motor control applications.

Terminal Position: UPPER

The terminal position simplifies the integration of the IGBT into motor control circuits, enhancing ease of installation and maintenance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTD28T65F2WP attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUUC-N3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

2 V

Trade Compliance

NGTD28T65F2WP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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