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NGTB50N65S1WG

Onsemi

NGTB50N65S1WG by Onsemi

The Onsemi NGTB50N65S1WG is an N-CHANNEL IGBT with a max VCEsat of 2.45V and IC of 140A. Ideal for POWER CONTROL applications, it has a turn-off time of 228ns and can operate at temperatures ranging from -55 to 175 °C.

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1k+

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Vyrian

USA . 3,201 parts In-Stock

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Digiode

USA . 447 parts In-Stock

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$0.974

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$0.886

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$0.799

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600

$0.974

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AZTECH Wire

Italy . 416 parts In-Stock

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$20.570

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Component Stockers USA

USA . 430 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 13,781 parts In-Stock

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SupplyDigital Components

Austria . 8,035 parts In-Stock

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Perfect Parts

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Kulean Microsystems

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Problanco Electronics

Mexico . 6,822 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

Germany . 5,292 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Microchip USA

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Corohmni

South Africa . 421 parts In-Stock

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TANS Electronics

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UHIMA Technologies

Türkiye . 85 parts In-Stock

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Overview

Experience unparalleled power control with the NGTB50N65S1WG insulated gate bipolar transistor by Onsemi. This N-channel transistor boasts a maximum VCEsat of 2.45V and a maximum collector-emitter voltage of 650V, making it ideal for a variety of high-power applications. With a built-in diode and a maximum operating temperature of 175 °C, this transistor offers reliability and efficiency like no other. Whether you're in the automotive industry, renewable energy sector, or industrial automation field, the NGTB50N65S1WG provides the performance and value you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides excellent insulation and protection for the internal components of the IGBT, ensuring reliability and longevity.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and higher efficiency compared to P-channel types, making them suitable for power control applications.

Maximum VCEsat: 2.45 V

Low VCEsat value indicates minimal voltage drop across the collector-emitter terminals when the IGBT is conducting, leading to reduced power losses and improved efficiency.

Nominal Turn Off Time (toff): 228 ns

Fast turn-off time allows for precise control over switching operations, which is crucial for power control applications requiring rapid response.

Maximum Power Dissipation (Abs): 300 W

High power dissipation capability enables the IGBT to handle large amounts of power without overheating, making it suitable for high-power applications.

Maximum Collector-Emitter Voltage: 650 V

High maximum VCE voltage rating allows the IGBT to withstand high voltage spikes and surges, ensuring reliable operation in challenging environments.

Maximum Collector Current (IC): 140 A

High maximum collector current rating enables the IGBT to handle large current loads, making it suitable for high-power applications that require high current handling capacity.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB50N65S1WG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

228 ns

Nominal Turn On Time (ton):

118 ns

Maximum VCEsat:

2.45 V

Trade Compliance

NGTB50N65S1WG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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