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NGTB35N60FL2WG

Onsemi

NGTB35N60FL2WG by Onsemi

NGTB35N60FL2WG by Onsemi is an N-CHANNEL IGBT with 600V VCE, 70A IC, and 300W Pd. It operates up to 175°C making it ideal for high-power applications like motor drives and inverters. With surface mount capability and a gate-emitter threshold voltage of 6.5V, it offers efficient power management in various industrial settings.

Median Price

$5.620

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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DigiKey

USA . 90 parts In-Stock

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Nova Conductors

Japan . 89 parts In-Stock

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Vyrian

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Digiode

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Chip Stock

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Bristol Electronics

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Dan-Mar Components

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ACDS - Activité Composants Distribution Service

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Corohmni

South Africa . 50 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$2.983

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$2.920

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Ampacity Inc.

Singapore . 90 parts In-Stock

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AZTECH Wire

Italy . 374 parts In-Stock

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Lixinc

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TANS Electronics

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Kulean Microsystems

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Problanco Electronics

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SupplyDigital Components

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Overview

Unleash the power of innovation with the NGTB35N60FL2WG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that are designed for efficiency and reliability. This N-CHANNEL transistor offers a maximum power dissipation of 300W, making it ideal for a wide range of applications. From automotive to industrial use, this product provides customers with unparalleled value, performance, and peace of mind. Elevate your projects to new heights with the NGTB35N60FL2WG from Onsemi.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher switching speeds compared to P-channel IGBTs, making them more efficient for many applications.

Surface Mount: YES

Surface mount IGBTs are easier to integrate into modern PCB designs, allowing for compact and space-saving solutions.

Maximum Power Dissipation (Abs): 300 W

With a high maximum power dissipation, this IGBT can handle high power levels safely, making it suitable for demanding applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows this IGBT to operate reliably in high-temperature environments, increasing its versatility.

Maximum Collector-Emitter Voltage: 600 V

The high maximum collector-emitter voltage rating enables this IGBT to be used in applications with high voltage requirements, providing flexibility.

Maximum Gate-Emitter Voltage: 20 V

The low maximum gate-emitter voltage ensures that the IGBT is easy to drive with standard control signals, simplifying the circuit design.

Maximum Collector Current (IC): 70 A

With a high maximum collector current rating, this IGBT can handle large current loads, making it suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The low gate-emitter threshold voltage allows for efficient control of the IGBT, enabling precise switching and reducing power losses.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish provides good solderability and conductivity, ensuring a reliable electrical connection in your circuit.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB35N60FL2WG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-609 Code:

e3

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Trade Compliance

NGTB35N60FL2WG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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