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NGTB30N60FLWG

Onsemi

NGTB30N60FLWG by Onsemi

NGTB30N60FLWG by Onsemi is an N-CHANNEL IGBT with 600V VCE, 60A IC, and 250W power dissipation. Ideal for high-power applications requiring efficient switching capabilities at up to 150 °C operating temperature.

Median Price

$10.900

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 429 parts In-Stock

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$10.900

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$7.030

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429

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Distributors (In-Stock)

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Digiode

USA . 375 parts In-Stock

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$10.355

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375

$10.355

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Vyrian

USA . 7,498 parts In-Stock

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Flip Electronics

USA . 450 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$1.545

100+ parts

$1.406

1k+ parts

$1.267

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40

$1.545

$1.406

$1.267

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Corphita

USA . 624 parts In-Stock

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$9.810

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624

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Corohmni

South Africa . 240 parts In-Stock

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$10.900

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AZTECH Wire

Italy . 1,144 parts In-Stock

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$16.250

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$16.250

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SupplyDigital Components

Austria . 6,637 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Kulean Microsystems

USA . 3,463 parts In-Stock

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Perfect Parts

USA . 3,432 parts In-Stock

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TANS Electronics

Latvia . 3,159 parts In-Stock

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Problanco Electronics

Mexico . 433 parts In-Stock

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433

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Authorized Procurement Solutions

USA . 429 parts In-Stock

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429

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GreenTree Electronics

Israel . 429 parts In-Stock

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UHIMA Technologies

Türkiye . 217 parts In-Stock

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Overview

Unleash the power of technology with the NGTB30N60FLWG by Onsemi, a high-quality N-CHANNEL IGBT that offers unmatched performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this IGBT is designed to meet the demands of various applications, providing customers with superior efficiency and durability. Elevate your projects with ease knowing that you have a product that delivers exceptional value and benefits, making it the perfect choice for all your electronic needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are more efficient and have lower conduction losses compared to P-channel IGBTs, making them ideal for high power applications.

Maximum Power Dissipation (Abs): 250 W

With a high maximum power dissipation, this IGBT can handle significant power levels without overheating, ensuring reliability in demanding applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows this IGBT to withstand elevated temperatures, making it suitable for industrial and automotive applications where heat dissipation is a concern.

Maximum Collector-Emitter Voltage: 600 V

A high maximum collector-emitter voltage ensures that this IGBT can handle high voltage applications with ease, providing robust performance in various voltage levels.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage of 20V provides flexibility in gate drive voltage selection, allowing for easy integration with different control circuits.

Maximum Collector Current (IC): 60 A

With a high maximum collector current, this IGBT can handle significant current levels, making it suitable for high power applications such as motor control and power inverters.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The gate-emitter threshold voltage of 6.5V ensures reliable turn-on and turn-off of the IGBT, providing precise control over the switching behavior of the device.

Terminal Finish: TIN

The TIN terminal finish provides excellent solderability and corrosion resistance, ensuring a reliable electrical connection in various operating environments.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB30N60FLWG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-609 Code:

e3

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Trade Compliance

NGTB30N60FLWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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