Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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KAI-50140-AXA-JP-B1 by Onsemi is an image sensor with 4.5x4.5 um pixel size, 60 MHz master clock, and 10440 horizontal pixels. It operates b/w -50 to 60 °C and has a dynamic range of 60 dB. Ideal for digital output applications requiring high-resolution imaging in various environments.
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Vyrian
Digiode
AZTECH Wire
$18.320
Problanco Electronics
Kulean Microsystems
SupplyDigital Components
Corphita
TANS Electronics
UHIMA Technologies
Corohmni
The small pixel size allows for high resolution images to be captured, making this image sensor a good choice for detailed applications.
The high maximum supply voltage provides flexibility in power supply options and ensures stable performance under varying voltage conditions.
The high master clock frequency enables fast data readout and processing, making this image sensor suitable for high-speed imaging applications.
The CCD sensor type offers high image quality and low noise characteristics, making it ideal for applications that require high precision and sensitivity.
The rectangular package shape allows for easy integration into various devices and systems, making this image sensor versatile in its application possibilities.
The low minimum supply voltage ensures power efficiency and compatibility with a wide range of power sources, making this image sensor suitable for portable and battery-operated devices.
The high maximum operating temperature tolerance allows for reliable performance in harsh environmental conditions, making this image sensor suitable for outdoor or industrial applications.
The high number of horizontal pixels results in detailed and high-resolution images, making this image sensor ideal for applications that require precision imaging.
The digital output format simplifies data processing and transmission, making this image sensor easy to integrate into digital systems and applications.
The low minimum operating temperature tolerance ensures reliable performance even in extreme cold conditions, making this image sensor suitable for a wide range of environmental settings.
The low operating current consumption results in energy efficiency and longer battery life in portable devices that use this image sensor.
The glass housing provides durability and protection for the sensitive components of the image sensor, ensuring long-term reliability and performance.
The high dynamic range allows the image sensor to capture a wide range of light intensities with detail and accuracy, making it suitable for diverse lighting conditions.
The high number of vertical pixels enables detailed image capture in both horizontal and vertical dimensions, making this image sensor ideal for high-resolution imaging applications.
The solder termination type ensures secure and reliable connections in the device's circuitry, enhancing the image sensor's overall performance and longevity.
The frame array type allows for efficient data capture and processing, resulting in smooth and high-quality image output from this image sensor.
The through hole mounting feature enables easy and secure installation of the image sensor in circuit boards or devices, ensuring stable and reliable operation.
Image Sensors KAI-50140-AXA-JP-B1 attributes and parameters. Explore more Image Sensors devices from Onsemi
Array Type:
Dynamic Range:
Horizontal Pixel:
Housing:
Master Clock:
Mounting Feature:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
1N4148
Silicon Standard
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Lite-on Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; JESD-609 Code: e0; Terminal Position: SINGLE; Adjustability: ADJUSTABLE; Maximum Load Regulation (%): 1.5 %;
STMicroelectronics
2N2222A
Tesla Elektronicke Soucastky
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SS14
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
LM358AN
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148WS
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
Microchip Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
L7805CV
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Output Voltage-1: 5 V;
LM107H/883C
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Package Equivalence Code: CAN8,.2;
Boca Semiconductor
ESD5Z5.0T1G
ESD5Z5.0T1G by Onsemi is a unidirectional Trans Voltage Suppressor Diode with 5V reverse test voltage and 174W peak power dissipation. It is used for transient suppression in electronic circuits, meeting IEC-61000-4-2, 4-4 standards and UL recognized for reliability.
1N5819HW-7-F
KAF-0402-ABA-CD-B1
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Minimum Supply Voltage: 14.75 V; Array Type: FULL FRAME;
KAI-1020-AAA-JP-BA
KAI-1020-AAA-JP-BA by Onsemi is an image sensor with 1000x1000 pixels, 7.4um pixel size, and 58dB dynamic range. Ideal for applications requiring high-resolution imaging such as industrial machine vision systems or medical imaging equipment.
KLI-2113-DAA-ED-AA
KLI-2113-DAA-ED-AA by Onsemi is an Image Sensor with 14x14 um pixel size, 2098 horizontal and vertical pixels. It operates b/w -25 to 80 °C, has a dynamic range of 76 dB, and outputs analog voltage. This sensor is ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAF-16801-AAA-DP-AE
The Onsemi KAF-16801-AAA-DP-AE is a square image sensor with 4096x4096 pixels, offering a pixel size of 9x9 µm and a dynamic range of 76 dB. It operates b/w -60 to 60 °C, suitable for high-resolution imaging applications requiring precise color capture and low light sensitivity. The sensor features a full-frame array design and can achieve data rates up to 10 Mbps, making it ideal for professional digital photography and scientific imaging projects.
MN34041PLJ
Panasonic
Image Sensors;
2H4813
The Onsemi 2H4813 image sensor features 2048x2048 resolution, 7.4um pixel size, and -50 to 70 °C operating temperature range. Ideal for industrial cameras, machine vision systems, and surveillance applications due to its high resolution and wide temperature tolerance.
KAF-40000-CXA-JD-AE
The Onsemi KAF-40000-CXA-JD-AE is a CCD image sensor with 6x6 um pixel size, 7304 horizontal pixels, and 5478 vertical pixels. It operates b/w 0-60 °C with a dynamic range of 70.2 dB. Ideal for high-resolution imaging applications requiring precise color reproduction and low light sensitivity.
MT9P031I12STC-DP
MT9P031I12STC-DP by Onsemi is an image sensor with 2.2x2.2 um pixel size, 96 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring a square CMOS image sensor with a digital voltage output interface and frame array type at temperatures ranging from -30 to 70 °C.
AR0140AT2C00XUEA0-TPBR
Onsemi's AR0140AT2C00XUEA0-TPBR is a 1/4 inch CMOS image sensor with 1280x800 resolution, 3x3 um pixel size, and 96 dB dynamic range. Ideal for applications requiring high-quality digital imaging in automotive cameras, surveillance systems, and drones at temperatures ranging from -40 to 105 °C.
MT9V022I77ATM
Micron Technology
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-2.90V; Vertical Pixel: 480;
KAI-16050-PXA-JD-B1
Onsemi's KAI-16050-PXA-JD-B1 is a 5.5X5.5 um CCD image sensor with 4896x3264 pixels, offering a dynamic range of 64 dB. It operates at temperatures ranging from -50 to 70 °C and requires a 15V power supply. Ideal for applications requiring high-resolution imaging in various industries.
AR0330CM1C21SHKA0-CR
The Onsemi AR0330CM1C21SHKA0-CR image sensor features 2.2x2.2 um pixel size, 27 MHz master clock, and 2304 horizontal pixels. Ideal for applications requiring a digital voltage output interface, such as surveillance cameras, automotive vision systems, and industrial imaging solutions.
KLI-4104-AAA-CB-AA
The Onsemi KLI-4104-AAA-CB-AA is an Image Sensor with 10x10 um pixel size, 4134 horizontal and vertical pixels. It operates b/w 0-70 °C, with a dynamic range of 60 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-29050-AXA-JD-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Dynamic Range: 64 dB; Vertical Pixel: 4384; Pixel Size (um): 5.5X5.5; Optical Format (inch): 4/2.99;
NOIH2SM1000T-HHC
NOIH2SM1000T-HHC by Onsemi is a CMOS image sensor with 1024x1024 pixels, 18x18 um pixel size, and operates at temperatures from -40 to 85 °C. It has a digital voltage output range of 2.20-2.60V and requires a 3.3V power supply. Ideal for applications requiring high-resolution imaging in a compact square ceramic package for surface mount assembly.
AR0135CS2M00SUEA0-DPBR1
The Onsemi AR0135CS2M00SUEA0-DPBR1 image sensor features 3.75um pixel size, 50MHz master clock, and 1280x960 resolution. Ideal for applications requiring high-quality digital imaging with a dynamic range of 71.1dB, such as surveillance cameras and industrial machine vision systems.
AR0238CSSC12SHRA0-DP1
Onsemi's AR0238CSSC12SHRA0-DP1 is a 3x3 um CMOS image sensor with 1928H x 1088V pixels, offering a dynamic range of 96 dB. Operating at 48 MHz master clock, it has a digital current output interface and supports frame rates up to 60 fps. Ideal for applications requiring high-resolution imaging in automotive, surveillance, and industrial sectors.
AR0835HS3C12SUAA0-DR
The Onsemi AR0835HS3C12SUAA0-DR is a 1/3.2 inch CMOS image sensor with 1.40um pixel size, offering a dynamic range of 64 dB and operating at a max supply voltage of 1.3V. It features a digital voltage output interface, suitable for applications requiring high-speed imaging such as surveillance cameras and industrial machine vision systems.
MT9V113M02
The Onsemi MT9V113M02 is a CMOS image sensor with 2.2x2.2 um pixel size, offering 640x480 resolution and 67 dB dynamic range. It operates b/w -15 to 40 °C, with digital output via a 2-wire interface, making it ideal for applications requiring high-quality imaging in compact devices.
AR0323ATSB17XUEA0-DRBR-E
Onsemi's AR0323ATSB17XUEA0-DRBR-E is a 3x3 um CMOS image sensor with 2880H x 1080V pixels, offering a dynamic range of 120 dB. Operating at -40 to 105 °C, it has a digital voltage output interface and supports frame rates up to 45 fps. Ideal for applications requiring high-resolution imaging in compact devices.
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KAI-50140-AXA-JD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Master Clock: 60 MHz; Minimum Supply Voltage: 14.5 V;
KAI-50140-AXA-JD-B1
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 4800; Housing: GLASS;
KAI-50140-AXA-JD-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 10440; Master Clock: 60 MHz;
KAI-50140-AXA-JP-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 14.5 V; Maximum Operating Current: 11 mA;
KAI-50140-AXA-JP-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Master Clock: 60 MHz; Housing: GLASS;
KAI-50140-AXB-JD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Master Clock: 60 MHz; Dynamic Range: 60 dB;
KAI-50140-AXB-JD-B1
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Pixel Size (um): 4.5X4.5; Maximum Operating Temperature: 60 Cel;
KAI-50140-AXB-JD-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 60 Cel; Horizontal Pixel: 10440;
KAI-50140-FXA-JD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Maximum Operating Temperature: 60 Cel;
KAI-50140-FXA-JD-B1
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Vertical Pixel: 4800;
KAI-50140-FXA-JD-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Housing: GLASS;
KAI-50140-QXA-JD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 14.5 V; Vertical Pixel: 4800;
Supply Digital Components
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12,000 In-Stock
Total price ≈ $80,197.29
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