Loading...

KAI-50140-AXA-JP-B2

Onsemi

KAI-50140-AXA-JP-B2 by Onsemi

KAI-50140-AXA-JP-B2 by Onsemi is an image sensor with 4.5x4.5 um pixel size, 60 MHz master clock, and 10440 horizontal pixels. It operates b/w -50 to 60 °C and has a max supply voltage of 15.5 V. Ideal for digital output applications in various industries due to its high dynamic range and frame array type design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,252

-

-

-

-

Digiode

USA . 110 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

110

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 454 parts In-Stock

1+ parts

$20.270

100+ parts

-

1k+ parts

-

10k+ parts

-

454

$20.270

-

-

-

SupplyDigital Components

Austria . 6,381 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,381

-

-

-

-

TANS Electronics

Latvia . 2,372 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,372

-

-

-

-

Problanco Electronics

Mexico . 2,232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,232

-

-

-

-

Corphita

USA . 1,918 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,918

-

-

-

-

Kulean Microsystems

USA . 943 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

943

-

-

-

-

UHIMA Technologies

Türkiye . 646 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

646

-

-

-

-

Corohmni

South Africa . 84 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

84

-

-

-

-

Overview

Elevate your imaging experience with the KAI-50140-AXA-JP-B2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality image sensors that are perfect for a wide range of applications. Whether you're into photography, robotics, or medical imaging, this image sensor offers unmatched value with its high performance and reliability. Capture every detail with precision and clarity, thanks to the advanced features of the KAI-50140-AXA-JP-B2. Choose Onsemi for exceptional imaging solutions that will take your projects to the next level.

Feature Benefit Bullets

Pixel Size (um): 4.5X4.5

Small pixel size allows for high resolution images to be captured, making this image sensor suitable for high-quality imaging applications.

Maximum Supply Voltage: 15.5 V

The high maximum supply voltage provides flexibility in power supply options and ensures reliable operation.

Master Clock: 60 MHz

High master clock frequency enables fast data readout and processing, making this image sensor suitable for applications requiring high speed imaging.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD image sensors are known for their high-quality image capture capabilities, making this product a good choice for applications where image quality is critical.

Package Shape or Style: RECTANGULAR

Rectangular package shape allows for easy integration and mounting in various devices and systems.

Minimum Supply Voltage: 14.5 V

The low minimum supply voltage ensures power efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 60 °C

High maximum operating temperature allows for reliable operation even in harsh environmental conditions.

Horizontal Pixel: 10440

High horizontal pixel count enables high-resolution image capture, making this sensor suitable for demanding imaging applications.

Output Type: DIGITAL OUTPUT

Digital output simplifies data processing and transmission, making this image sensor easy to interface with digital systems.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature ensures reliable performance in cold environments.

Maximum Operating Current: 11 mA

Low maximum operating current ensures power efficiency and extends battery life in battery-powered applications.

Housing: GLASS

Glass housing provides durability and protection for the sensor elements, ensuring long-term reliability.

Dynamic Range: 60 dB

High dynamic range allows the sensor to capture details in both bright and dark areas of the image, making it suitable for high-contrast scenes.

Vertical Pixel: 4800

High vertical pixel count allows for detailed image capture in the vertical direction, enhancing overall image quality.

Termination Type: SOLDER

Solder termination ensures secure electrical connections and reliable operation in various mounting configurations.

Array Type: FRAME

Frame array type enables simultaneous capture of multiple image frames, making this sensor suitable for applications requiring rapid image acquisition.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature allows for easy and secure installation in various systems and devices.

Technical Specifications

Image Sensors KAI-50140-AXA-JP-B2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Dynamic Range:

60 dB

Horizontal Pixel:

10440

Housing:

GLASS

Master Clock:

60 MHz

Mounting Feature:

Maximum Operating Current:

11 mA

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-50 Cel

Output Type:

Package Shape or Style:

Pixel Size (um):

4.5X4.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

4800

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 12